10AX115R2F40I2LG - Arria 10 GX FPGA 1.15M LE FCFBGA-1517 | Intel
MPN： 10AX115R2F40I2LG ✓ 啟用中10AX115R2F40I2LG 概覽
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and dedicated silicon resources such as transceivers, DSP blocks, and block RAM. FPGAs sit within the broader category of programmable logic devices (PLDs), themselves a sub-class of digital integrated circuits used for high-speed parallel processing, hardware acceleration, and rapid prototyping that ASICs cannot economically match. The Arria 10 family specifically targets mid-range transceiver-rich applications between Cyclone (low cost) and Stratix (maximum performance).
Key features of the 10AX115R2F40I2LG include 1.15M logic elements, 68.86 Mbits of on-site M20K block RAM, integrated 28.05 Gbps transceivers, variable-precision DSP blocks, hard memory controllers, and PCI Express hard IP blocks. The 1517-ball package exposes 24 transceiver channels and supports up to 342 general-purpose I/O running LVDS, LVCMOS, and memory interfaces such as DDR4.
Architecturally, Arria 10 GX combines an adaptive logic module (ALM) fabric with hard IP cores to deliver balanced logic, memory, and serial bandwidth. The 20 nm process and 0.9 V core lower total power versus prior 28 nm Stratix V generations while sustaining comparable throughput, making the part popular for high-throughput wireless, broadcast, and test-and-measurement systems.
Typical applications include 100G/400G optical line cards, wireless baseband and remote-radio-head (RRH) digital front-end processing, military radar and SIGINT, medical imaging accelerators, and high-end ASIC prototyping. The GX transceiver support is particularly valued for backhaul, fronthaul (CPRI/OBSAI), and PCIe Gen3 system integration.
When designing, ensure the 1517-ball FC-FBGA land pattern matches the PCB footprint exactly, route the 0.9 V core and 1.8 V/2.5 V/3.3 V auxiliary supplies per the Intel pin connection guidelines, and respect the transceiver reference-clock jitter budget. Thermal management is critical - the device dissipates substantial power at full transceiver utilization, requiring a heatsink and adequate airflow.
This page synthesizes distributor pricing, drop-in alternatives from the same Arria 10 family, and design guidance not found in the standalone manufacturer datasheet.
直接替換替代品，適用於 10AX115R2F40I2LG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AX115R2F40I2LG （相同外形與佔位） — 差異在於 Package, DSP Blocks, Temperature Grade, PCIe Hard IP, Family.
10AX115R2F40I1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115R2F40I2SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115R2F40E2LG
✅ 直接替換聯絡詢價
查看資料表 →10AX115R2F40E2SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115R2F40E1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115R1F40I1SG
✅ 直接替換聯絡詢價
查看資料表 →10AX115R2F40I2LG 最大額定值與電氣特性
| Series | Arria 10 GX |
| Family | Intel Arria 10 |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory Bits | 68,857,856 bits (68.86 Mbit) |
| User I/O Pins | 342 |
| Transceiver Channels | 24 (up to 28.05 Gbps) |
| PCI Express Hard IP | Yes (Gen3 x8 capable) |
| Process Node | 20 nm TSMC |
| Core Voltage | 0.9 V |
| 封裝 | 1517-ball FC-FBGA |
| Package Code | F40 (FCFBGA-1517) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
10AX115R2F40I2LG f40 (fcfbga-1517) 腳位配置指南
10AX115R2F40I2LG（f40 (fcfbga-1517) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AX115R2F40I2LG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AX115R2F40I2LG 適用於 6 應用s: 100G/400G Optical Line Card Processing, Wireless Baseband and Fronthaul (RRH) Processing, Military Radar and SIGINT Signal Processing, Medical Imaging Accelerator Boards, ASIC Prototyping and Emulation, Broadcast Video Processing and IP Contribution.
100G/400G Optical Line Card Processing
The 10AX115R2F40I2LG's 24 transceivers at 28.05 Gbps directly support 100G Ethernet and 400G (via bonding) optical line cards. With 1.15M logic elements and 68.86 Mbit of on-chip memory, it absorbs MAC, framer, and forward-error-correction logic without external ASICs. The hard PCIe Gen3 block simplifies backplane interfacing to a switch ASIC, while the FC-FBGA thermal envelope supports sustained line-rate processing.
推薦
Wireless Baseband and Fronthaul (RRH) Processing
In 4G LTE and 5G NR remote-radio-head and base-station designs, the 10AX115R2F40I2LG aggregates CPRI/OBSAI links through its 28.05 Gbps transceivers and executes PHY-layer DSP in its variable-precision DSP blocks. The 1.15M logic density supports multi-sector, multi-antenna baseband processing on a single device. Industrial temperature grade (-40C to +100C) handles outdoor cabinet thermal stress in telecom deployments.
推薦
Military Radar and SIGINT Signal Processing
The 10AX115R2F40I2LG is widely used in defense electronic-warfare, radar, and SIGINT subsystems where 24 high-speed transceivers capture wideband digitized RF and 1.15M LEs execute pulse-compression, beamforming, and FFT pipelines. Hard memory controllers feed DDR4 buffers, while PCI Express Gen3 links connect to host CPUs. Industrial grade suits ground-mobile platforms; aerospace customers select the -E2 extended grade for higher operating temperature.
推薦
Medical Imaging Accelerator Boards
In CT, MRI, ultrasound, and digital X-ray imaging platforms, the 10AX115R2F40I2LG accelerates image reconstruction (back-projection, iterative reconstruction) using its parallel DSP fabric and 68.86 Mbit memory. The PCIe Gen3 hard IP moves reconstructed frames to host processors at line rate. Industrial temperature rating supports operating-room and bedside equipment, and FC-FBGA thermals are well-characterized for fan-cooled medical chassis.
推薦
ASIC Prototyping and Emulation
Engineers use the 10AX115R2F40I2LG as an ASIC prototype or pre-silicon emulator given its 1.15M LEs, abundant M20K memory, and high-speed serial links that mirror modern ASIC I/O. Multiple FPGAs can be tiled via transceivers to emulate multi-million-gate ASICs. Quartus Prime synthesis supports ASIC-equivalent coding styles (SystemVerilog, VHDL) and constraint-driven timing closure.
推薦
Broadcast Video Processing and IP Contribution
In broadcast studios and IP-based video contribution networks, the 10AX115R2F40I2LG performs HEVC/H.264 encode/decode acceleration, multi-stream transcoding, and SMPTE ST 2110 IP gateway functions. The 28.05 Gbps transceivers carry uncompressed SDI-over-IP and compressed JPEG XS streams, while 342 user I/Os support HDMI/SDI bridge chips. The 1.15M LEs process 4K/UHD with HDR metadata in real time.
推薦
推薦產品摘要
工程參考資料，適用於 10AX115R2F40I2LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AX115R2F40I1SG | 10AX115R2F40I2SG | 10AX115R2F40E2LG | 10AX115R1F40I1SG |
|---|---|---|---|---|---|
| Package | 1517-ball FC-FBGA (F40) | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| User I/O | 342 | 342 | 342 | 342 | 342 |
| Transceiver Count | 24 (up to 28.05 Gbps) | 24 (28.05 Gbps) | 24 (28.05 Gbps) | 24 (28.05 Gbps) | 0 (logic only, no transceivers) |
| Temperature Grade | Industrial -2 (-40C to +100C) | Commercial -1 (0C to +85C) | Industrial -2 (-40C to +100C) | Extended -E2 | Commercial -1 (0C to +85C) |
| Solder Balls | Lead-free (LG) | Lead-free (SG) | SnPb (SG suffix) | Lead-free (LG) | Lead-free (SG) |
主要差異化特點
- 1.15M logic elements with full 24-channel 28.05 Gbps transceiver complement (對比10AX115R1F40I1SG)
- Industrial -40C to +100C temperature grade (對比10AX115R2F40I1SG)
- Lead-free solder balls (LG suffix) (對比10AX115R2F40I2SG)
設計說明
The Arria 10 GX 10AX115R2F40I2LG dissipates 15 to 25 W typical and can exceed 35 W with all 24 transceivers active at 28.05 Gbps and high DSP utilization. Use a thermal interface material (TIM) rated for at least 3 W/m-K and a heatsink with a minimum 0.5 C/W thermal resistance; ensure chassis airflow exceeds 200 LFM for industrial temperature operation. Always reference the Intel Arria 10 thermal management guidelines for the F40 package theta_JB and theta_JC values.
The 1517-ball F40 FC-FBGA requires a PCB with microvia build-up (any-layer or stagger via) and a 1.0 mm or finer ball pitch. Route high-speed transceiver differential pairs as 85-ohm or 100-ohm impedance with reference planes unbroken beneath. Place AC-coupling capacitors within 200 mil of the transmitter balls; keep them on the same layer where possible to avoid via stubs that degrade 28 Gbps eye performance.
Power the 0.9 V core rail last in the sequence, after 1.8 V and 2.5 V/3.3 V rails are stable. Use a controller with monotonic rise and Power-On-Reset (POR) sequencing per Intel's recommended start-up profile. Decouple every supply pin with 0.1 uF plus bulk decoupling (typically 10 uF + 22 uF) within 100 mil; provide separate ground return paths for noisy PLL supplies to avoid jitter degradation in transceivers.
Do not assume all Arria 10 F40 packages share a unified pinout - silicon revisions and speed grades can shift transceiver ball mapping. Always verify against the latest Intel pin connection guidelines before layout freeze. Also note that configuration via JTAG requires a valid VID chain supply voltage during programming; use the Intel programming tool (Quartus Prime Programmer) and confirm the MSEL pins are set to the correct mode (AS, PS, JTAG) for your boot source.
合規資訊
RoHS-compliant per Altera/Intel product page (LG suffix). Halogen-free status not confirmed in the verified web data and set to unknown. AEC-Q100 is not applicable for FPGAs - this part is qualified per Intel's own internal reliability program rather than automotive-specific AEC standards.
