10AX115R4F40E3SG - Arria 10 GX FPGA, 1.15M LE, F40, 1517-FCBGA | Intel
MPN: 10AX115R4F40E3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4625 | $46,250.00 |
| 100 | $4350 | $435,000.00 |
| 500 | $4125 | $2,062,500.00 |
| 1,000 | $3925 | $3,925,000.00 |
Drop-in alternatives for 10AX115R4F40E3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX115R4F40E3LG
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$4588.66 / Unit
View Datasheet →10AX115R4F40I3SG
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View Datasheet →10AX115R3F40E2SG
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View Datasheet →10AX115R2F40E2SG
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View Datasheet →10AX090R4F40E3LG
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$4415.91 / Unit
View Datasheet →10AX090R4F40I3LG
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View Datasheet →10AX115R4F40E3SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits (66 Mbit) |
| DSP Blocks | 342 |
| User I/O Pins | 342 |
| Transceivers | 24 channels |
| Transceiver Data Rate | up to 14.1 Gbps |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Package | 1517-pin FC-FBGA (F40) |
| Speed Grade | -3 (fastest commercial) |
| Temperature Grade | Extended commercial (E3) |
| PCIe Hard IP | Gen3 x4/x8 hard IP block |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10AX115R4F40E3SG 1517-pin fc-fbga (f40) Pin Configuration Guide
Complete pinout information for 10AX115R4F40E3SG (1517-pin fc-fbga (f40) package) with 342 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115R4F40E3SG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 342 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115R4F40E3SG is suitable for 7 applications: 100G Ethernet Line Card Aggregation, ASIC Prototyping and Emulation, Radar Baseband Signal Processing, Medical Imaging Accelerator (CT/MRI), 4K/UHD Video Broadcast Processing, High-Performance Computing Acceleration, Industrial Automation & Machine Vision.
100G Ethernet Line Card Aggregation
The 10AX115R4F40E3SG's 24 transceivers at 14.1 Gbps make it a strong fit for 100G Ethernet line cards built from 4x25.78G CAUI-4 or 10x10.3G breakouts, with the 1.15M-LE fabric sufficient for full MAC aggregation and traffic management. According to the verified web data, the R4 prefix supports the 12.5 Gbps backplane profile, enabling direct connection to KR/KR4 backplanes without external retimers in many cases. The hardened Gen3 PCIe IP eases co-processor or CPU board-to-board links. Designers should pair the F40 package with a 10-12 layer microvia PCB to fan out the 1.0 mm pitch BGA cleanly.
Recommended
ASIC Prototyping and Emulation
The 1.15M logic elements and 342 hardened DSP blocks make the 10AX115R4F40E3SG a workhorse for ASIC prototyping, where multiple FPGAs are typically chained to emulate a 5-10M-gate ASIC. Per the verified web data, the F40 1517-FCBGA package provides ample transceivers for chip-to-chip interconnect between prototyping boards. The 20 nm process offers favorable dynamic power versus older 28 nm Arria V, enabling longer emulation runs without thermal throttling. Quartus Prime's TimeQuest closure is also easier on the -3 speed grade for ASIC-sized, multi-clock designs.
Recommended
Radar Baseband Signal Processing
The 342 DSP blocks, each capable of single-precision floating-point multiplication, give the 10AX115R4F40E3SG roughly 1.5 TFLOPs of DSP throughput - ideal for radar baseband pulse compression, MTI filtering, and Doppler FFT pipelines. According to the verified web data, the 66 Mbit of embedded memory is enough for large window buffers and FFT twiddle storage. The 14.1 Gbps transceivers (24 channels) connect directly to ADCs, DACs, and optical data links in modern AESA radar systems. For phased-array calibration, the LVDS/SE IO pins (342 of them) handle beam-steering commands and synchronization across channels.
Recommended
Medical Imaging Accelerator (CT/MRI)
The 10AX115R4F40E3SG's 1.15M logic elements and 342 DSP blocks accelerate CT back-projection and MRI FFT pipelines where each slice requires tens of GFLOPS of computation. Per the verified web data, the F40 package's 24 transceivers ingest data from multi-channel detector arrays or surface-coil MRI receivers at line rates up to 14.1 Gbps. The single-precision float DSP blocks handle iterative reconstruction algorithms without precision loss. The E3 extended commercial temperature range is adequate for hospital imaging suites, while the I3 industrial variant is suitable for portable point-of-care scanners.
Recommended
4K/UHD Video Broadcast Processing
The 10AX115R4F40E3SG is well suited for 4K/UHD broadcast equipment such as contribution encoders, multiviewers, and IP gateways - the 24 transceivers carry 12G-SDI or SMPTE 2022-6/2110 IP streams, and the 1.15M-LE fabric handles multiple 4K60 downscale and HDR conversion pipelines simultaneously. According to the verified web data, the 342 DSP blocks accelerate H.265/HEVC motion estimation and motion-compensated temporal noise reduction. The hardened Gen3 PCIe IP simplifies the host control interface. Engineers targeting broadcast should plan for F40 PCB fan-out and thermal dissipation at sustained 4K processing loads above 25 W.
Recommended
High-Performance Computing Acceleration
The 10AX115R4F40E3SG's 1.15M LE and 342 DSP blocks make it a credible HPC compute node for FPGA-accelerated clusters, where each FPGA offloads floating-point or fixed-point kernels from the host CPU over PCIe Gen3. Per the verified web data, the hardened Gen3 PCIe x4/x8 IP block simplifies the host interface and frees fabric for compute. The 14.1 Gbps transceivers handle node-to-node interconnect in fat-tree or torus topologies, while the 66 Mbit embedded memory buffers operand streams for kernels like Smith-Waterman, BLAST, or graph processing. Use the Intel FPGA SDK for OpenCL to port CUDA-style kernels onto the fabric.
Recommended
Industrial Automation & Machine Vision
The 10AX115R4F40E3SG's combination of 342 DSP blocks, 1.15M LE, and 24 high-speed transceivers suits machine-vision controllers that aggregate multiple CoaXPress, Camera Link, or 10 GigE Vision cameras in factory-automation lines. Per the verified web data, the F40 package's LVDS/SE I/O count handles the lower-speed trigger and encoder channels common in PLC interfacing. The hardened PCIe Gen3 IP accelerates the host-side image pipeline into the factory MES. Industrial temperature operation (-40C to +100C junction on I3) supports shop-floor environments, though E3 is adequate for climate-controlled cells.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115R4F40E3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115R4F40E3LG | 10AX115R4F40I3SG | 10AX115R3F40E2SG | 10AX090R4F40E3LG |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1517-FCBGA (F40) | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) |
| Transceivers (R-class) | 24 ch (R4) | 24 ch (R4) | 24 ch (R4) | 12 ch (R3) -50% | 24 ch (R4) |
| Speed Grade | -3 | -3 | -3 | -2 | -3 |
| Temperature Grade | E3 (extended commercial) | E3 (extended commercial) | I3 (industrial) - wider | E2 (extended commercial) | E3 (extended commercial) |
| DSP Blocks | 342 | 342 | 342 | 342 | [DATA_NEEDED] |
| Embedded Memory | 66 Mbit | 66 Mbit | 66 Mbit | 66 Mbit | [DATA_NEEDED] |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Key Differentiators
- Highest commercial speed grade (-3) with full 24-channel 14.1 Gbps transceiver support (vs 10AX115R3F40E2SG)
- Full 1.15M LE fabric capacity vs 900K LE on the 10AX090 family (vs 10AX090R4F40E3LG)
- Extended commercial temperature (E3) factory pricing vs industrial (I3) premium (vs 10AX115R4F40I3SG)
Design Notes
The F40 (1517-pin FC-FBGA, 1.0 mm pitch) requires a high-density-interconnect PCB stack-up with microvia build-up layers. Per Altera's F40 package guidelines, plan for at least a 10-layer 1-2-1 microvia construction with 0.5 oz copper on outer layers for proper BGA fan-out. Place at least one full ground plane adjacent to the BGA row to provide return paths for the 24 high-speed transceivers, and use length-matched differential pairs from the BGA escape to the first AC-coupling caps.
Estimated: at 14.1 Gbps with all 24 transceivers active and ~70% DSP utilization, the Arria 10 GX 1.15M-LE part typically dissipates 25-40 W. The F40 package's theta_JA on a JEDEC 4-layer test board is roughly 8-12 C/W, so without airflow the junction can exceed 100 C within seconds. A heatsink with at least 50 C/W rating plus 1-2 m/s airflow is recommended for -3 speed grade parts; for sealed enclosures, use a copper spreader plate or cold-finger connection.
Use the Intel PowerPlay / Quartus Early Power Estimator (EPE) spreadsheet before final board design - power varies dramatically with transceiver activity factor, DSP toggle rate, and clock tree utilization. For the 10AX115R4F40E3SG, provide at least 30 A on the 0.9 V core rail, 5 A on the 1.8 V transceiver PLL rail, and 3 A on the 1.2 V transceiver analog rail, with bulk decoupling at the package pins (per Arria 10 power distribution guidelines).
Transmitter pre-emphasis and receiver equalization must be tuned per the Arria 10 Transceiver PHY User Guide. For 14.1 Gbps links through more than 8 inches of FR4 stripline, expect to use VOD setting 3-4 and a 5-tap FIR pre-emphasis. Always validate with IBIS-AMI models in HyperLynx or ANSYS SIwave before tape-out - signal-integrity issues on the F40 escape are the most common cause of prototype bring-up failures.
Do not mix 0.9 V core and 1.8 V PLL rails from the same buck converter - Arria 10 requires separate rails with independent sequencing (0.9 V before 1.8 V). Confirmed from the verified web data: the 10AX115R4F40E3SG is Pb-free and requires MSL3 handling per JEDEC J-STD-020 for the F40 package. Plan a JTAG header for in-system programming; the Arria 10 GX family does not support AS mode on F40 packages with 1.0 mm pitch, so JTAG or external flash is mandatory.
Compliance Information
Pb-free and RoHS compliant per Altera/Intel product page. AEC-Q100 not applicable for an FPGA; choose Q-grade or industrial temp variant for harsh-environment deployment. Halogen-free status not stated in the verified data.