10CL016YM164C6G - Cyclone 10 LP FPGA 16K LE 164-MBGA | Intel
MPN： 10CL016YM164C6G ✓ 啟用中10CL016YM164C6G 概覽
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor that combines configurable logic blocks (CLBs), programmable interconnect, and on-chip memory into a single device, allowing engineers to implement custom digital circuits, state machines, and parallel processing pipelines in hardware. FPGAs sit within the broader programmable logic hierarchy (PLD -> CPLD -> FPGA) and are widely used for I/O expansion, custom protocol bridging, and hardware acceleration in embedded systems.
The 10CL016YM164C6G provides up to 87 user I/O pins, 56 embedded 18x18 multipliers, 2 4 PLLs, and 4 Mb of configuration memory (typical). It supports common interfaces such as LVDS, DDR3, and LPDDR2 through the hardened memory controller, and integrates a JTAG interface for boundary-scan and in-system programming via the Quartus Prime design suite.
Architecturally, Cyclone 10 LP devices use a low-power 60-nm process technology with adaptive logic modules (ALMs), variable-precision DSP blocks, and a configurable 8-lane transceiver at speeds up to 250 MHz. The device's energy-efficient logic fabric makes it the preferred choice for portable and thermally constrained products.
Typical applications include industrial motor control, video bridging, sensor aggregation, low-cost protocol bridging (I2C/SPI/UART to Ethernet), and entry-level software-defined radio front ends. The 164-pin MBGA package provides a compact 8 x 8 mm footprint suited for space-constrained designs.
When designing with this part, plan for a 1.2 V core supply and a separate 2.5 V/3.3 V bank supply. Use the Quartus Prime PowerPlay early power estimator to characterize dynamic power before final layout.
This page consolidates verified distributor pricing, same-package drop-in alternatives from the Cyclone 10 LP family, and application guidance not found in the standalone datasheet.
直接替換替代品，適用於 10CL016YM164C6G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10CL016YM164C6G （相同外形與佔位） — 差異在於 Package, MSL Level, Core Voltage, Embedded Memory, PLLs.
10CL016YM164A7G
✅ 直接替換聯絡詢價
查看資料表 →10CL016YM164I7G
✅ 直接替換聯絡詢價
查看資料表 →10CL016YM164C8G
✅ 直接替換聯絡詢價
查看資料表 →10CL010YM164C6G
✅ 直接替換聯絡詢價
查看資料表 →10CL010YM164C8G
✅ 直接替換聯絡詢價
查看資料表 →10CL010YM164I7G
✅ 直接替換聯絡詢價
查看資料表 →10CL016YM164C6G 最大額定值與電氣特性
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 15,408 |
| Embedded Memory | 516,096 bits |
| User I/O | 87 |
| DSP Blocks (18x18 Multipliers) | 56 |
| PLLs | 2 4 |
| Core Voltage | 1.2 V (1.15 V min, 1.25 V max) |
| 封裝 | 164-MBGA (TFBGA, 8 x 8 mm) |
| JEDEC Package Code | S-PBGA-B164 |
| Temperature Grade | Commercial (0C to 85C) |
| Process Node | 60 nm |
| Configuration Memory | 4 Mb |
| 工作溫度 | 0C to 85C |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
10CL016YM164C6G 腳位配置
| 腳位 A1 | — User I/O pin (bank 1A) |
| 腳位 A2 | — User I/O pin (bank 1A) |
| 腳位 A3 | — User I/O pin (bank 1A) |
| 腳位 A4 | — VCCIO bank 1A |
| 腳位 A5 | — User I/O pin (bank 1B) |
| 腳位 A6 | — User I/O pin (bank 1B) |
| 腳位 A7 | — User I/O pin (bank 1B) |
| 腳位 A8 | — User I/O pin (bank 1B) |
| 腳位 A9 | — User I/O pin (bank 1B) |
| 腳位 A10 | — User I/O pin (bank 1B) |
| 腳位 A11 | — User I/O pin (bank 1B) |
| 腳位 A12 | — User I/O pin (bank 1B) |
| 腳位 B1 | — User I/O pin (bank 1A) |
| 腳位 B2 | — GND |
| 腳位 B3 | — User I/O pin (bank 1A) |
| 腳位 B4 | — User I/O pin (bank 1A) |
| 腳位 B5 | — User I/O pin (bank 1B) |
| 腳位 B6 | — User I/O pin (bank 1B) |
| 腳位 B7 | — VCCIO bank 1B |
| 腳位 B8 | — User I/O pin (bank 1B) |
| 腳位 B9 | — User I/O pin (bank 1B) |
| 腳位 B10 | — User I/O pin (bank 1B) |
| 腳位 B11 | — User I/O pin (bank 1B) |
| 腳位 B12 | — User I/O pin (bank 1B) |
典型應用
10CL016YM164C6G 適用於 6 應用s: Industrial Motor Control, Video Bridging and Image Aggregation, Low-Cost Protocol Bridging, Sensor Aggregation Hubs, Entry-Level Software-Defined Radio, Automotive Infotainment Auxiliary Logic.
Industrial Motor Control
The 10CL016YM164C6G fits industrial motor control because its 56 dedicated 18-bit DSP multipliers implement field-oriented control (FOC) loops and PWM generation, while the 15,408 logic elements encode the state machine, encoder interface (QEP), and protection logic. With 87 user I/O pins, the device easily interfaces Hall sensors, resolver feedback, and gate drivers. The 164-MBGA package is only 8 x 8 mm, enabling compact control PCBs. The 1.2 V core plus separate bank I/O supplies let the FPGA drive 3.3 V gate drivers directly. Quartus Prime Qsys simplifies peripheral integration for variable-frequency drives up to several kW.
推薦
Video Bridging and Image Aggregation
The 10CL016YM164C6G is well suited to entry-level video bridging tasks such as MIPI-CSI2 to parallel RGB conversion or HDMI auxiliary-channel processing. Its 516 Kb of embedded block memory provides line buffering without external SRAM, while the 56 multipliers handle color-space conversion and scaling math. The 87 user I/Os accept multiple 8/16-bit camera interfaces simultaneously. The 60 nm low-power process keeps the 1.2 V core consumption under 1 W for typical 1080p pipelines, making passive heatsink designs feasible in compact embedded vision modules.
推薦
Low-Cost Protocol Bridging
The 10CL016YM164C6G excels at bridging low-speed legacy protocols (UART, SPI, I2C, GPIO) to high-speed links such as Ethernet, USB, or PCIe soft IP. With 15,408 LEs the device can implement full TCP/IP offload, custom serial framing, and timestamp logic in a single chip, replacing multiple discrete MCUs and glue logic. The 87 I/Os are more than enough for quad-UART, octal-SPI slave, and parallel bus aggregation. Cyclone 10 LP's hardened PCI Express Gen1 IP block reduces soft-logic footprint for low-bandwidth endpoint applications.
推薦
Sensor Aggregation Hubs
The 10CL016YM164C6G aggregates sensor data from multiple sources such as IMUs, environmental sensors, and analog front ends in IoT edge nodes. Its 56 DSP blocks perform on-chip FFT, Kalman filtering, and signal conditioning in real time, while the 516 Kb of block RAM serves as circular buffer storage. The 87 I/Os accept SPI, I2C, and LVDS sensor buses concurrently. The commercial-grade 0-85C operating range suits indoor smart-building deployments, and the 164-MBGA package enables very small hub PCBs with passive cooling.
推薦
Entry-Level Software-Defined Radio
The 10CL016YM164C6G can implement narrow-band SDR front-ends for amateur radio, industrial telemetry, and sub-GHz wireless protocols. The 56 DSP multipliers enable digital down-conversion and channelization, and the LVDS-capable I/Os interface directly to ADC/DAC sample clocks. The hardened memory controller supports DDR3 sample buffers up to several hundred MSPS. Compared to a discrete DSP+ASIC design, this single-chip approach reduces BOM cost and PCB area significantly for sub-$200 radio products.
推薦
Automotive Infotainment Auxiliary Logic
The 10CL016YM164A7G (automotive-grade variant of this device) fits automotive infotainment auxiliary logic such as LVDS display bridging, CAN-FD message routing, and touch-panel interfacing. The 15,408 LEs handle message arbitration, audio routing, and backlight control. The 164-MBGA package survives the -40C to +125C automotive temperature range. Combined with the hardened PCI Express Gen1 IP, this device serves as a flexible companion to the main application processor in head-unit designs.
推薦
推薦產品摘要
工程參考資料，適用於 10CL016YM164C6G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10CL016YM164A7G | 10CL016YM164I7G | 10CL016YM164C8G | 10CL010YM164C6G | 10CL010YM164C8G | 10CL010YM164I7G |
|---|---|---|---|---|---|---|---|
| Package | 164-MBGA (TFBGA, 8 x 8 mm) | 164-MBGA (TFBGA) - same | 164-MBGA (TFBGA) - same | 164-MBGA (TFBGA) - same | 164-MBGA (TFBGA) - same | 164-MBGA (TFBGA) - same | 164-MBGA (TFBGA) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 | 10,320 | 10,320 | 10,320 |
| Embedded Memory | 516,096 bits | 516,096 bits | 516,096 bits | 516,096 bits | 414,720 bits | 414,720 bits | 414,720 bits |
| Temperature Grade | Commercial (0C to 85C) | Automotive (-40C to +125C) | Industrial (-40C to +100C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Industrial (-40C to +100C) |
| Speed Grade | C6 (commercial, speed grade 6) | A7 (automotive, speed grade 7) | I7 (industrial, speed grade 7) | C8 (commercial, speed grade 8) | C6 (commercial, speed grade 6) | C8 (commercial, speed grade 8) | I7 (industrial, speed grade 7) |
| DSP Blocks (18x18) | 56 | 56 | 56 | 56 | 46 | 46 | 46 |
| User I/O Pins | 87 | 87 | 87 | 87 | 87 | 87 | 87 |
| Core Voltage | 1.2 V (1.15-1.25 V) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
主要差異化特點
- Highest logic density in the 164-MBGA Cyclone 10 LP family (對比10CL010YM164C6G)
- Commercial temperature grade with lowest cost position (對比10CL016YM164I7G)
- Optimized speed grade 6 for typical designs (對比10CL016YM164C8G)
設計說明
Estimated: At 50% logic utilization and 100 MHz toggle rate, the Cyclone 10 LP core draws approximately 0.5-1.0 W from the 1.2 V rail. Provide a low-noise LDO (such as TI TPS7A4701 or similar) for VCCINT and a separate 2.5 V/3.3 V regulator for VCCIO bank supplies. Decoupling: place 0.1 uF X7R ceramic capacitors on every VCC pin within 5 mm trace length, plus 4.7 uF bulk capacitors at each supply plane. The PLL analog supply (VCCA_PLL) requires additional filtering per the device handbook.
The 164-MBGA package has theta_JA of approximately 28 C/W on a standard 4-layer JEDEC test board. Estimated: at 1.0 W dissipation, junction temperature rises 28 C above ambient, well within the 85 C commercial limit. Above 1.5 W dissipation, attach a thermal pad pattern on inner PCB layers to reduce theta_JB and keep junction temperature below 100 C. Industrial-grade variants (I7, A7) provide higher thermal headroom but follow the same board layout guidelines.
The 164-MBGA uses a 0.5 mm ball pitch. Per the Cyclone 10 LP hardware design guidelines, use microvia-in-pad construction with NSMD (non-solder-mask-defined) land pads of 0.30 mm diameter. Maintain a 0.20 mm solder mask clearance between adjacent pads. For high-speed LVDS or DDR3 interfaces, match trace lengths within 50 mil tolerance and use 100 ohm differential impedance. Reference the device pin connection guidelines for ball map and bank assignment details.
Do not leave VCCIO bank supplies floating - every active bank requires its own supply even if its I/Os are unused. The configuration pins (MSEL, nCONFIG, CONF_DONE) must be pulled to valid logic levels via 4.7 kohm resistors per the handbook. When migrating from Cyclone IV to Cyclone 10 LP, note that the JTAG pinout changed - verify against the pin connection guidelines, not Cyclone IV legacy documents. Avoid backdriving any configuration pin during power-up sequencing.
合規資訊
RoHS and REACH compliant per Intel product declaration. Lead-free (Pb-free) and halogen-free molding compound. Not AEC-Q100 qualified - choose 10CL016YM164A7G automotive variant for AEC-Q100 compliance.
