A3PE3000-FG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
MPN： A3PE3000-FG324I ✓ 啟用中A3PE3000-FG324I 概覽
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory cells rather than SRAM, so it powers up instantly without an external configuration PROM and is inherently single-chip. Within the programmable logic hierarchy, the A3PE3000 sits in the mid-density range of the ProASIC3/ProASIC3E family, which is part of the broader FPGA -> programmable logic -> semiconductor taxonomy from Microsemi (now Microchip Technology).
Key features include nonvolatile flash programming that eliminates boot-time configuration and improves secure operation, support for high-performance 32-bit soft processors, low total cost of ownership through single-chip integration, and reprogrammability in-system. The 324-ball FBGA footprint with 221 available user I/Os provides substantial interface density for a mid-density device.
Technically, the device is manufactured on a 130nm flash process operating from a 1.5V core supply. The ProASIC3E architecture combines VersTiles logic elements with embedded block RAM and abundant advanced features such as on-chip PLLs and I/O standards support for common single-ended and differential signaling, enabling glue logic consolidation, bus bridging, and control-plane designs.
Typical applications include industrial automation control, communications and networking line cards, aerospace and defense subsystems requiring instant-on operation, and secure single-chip designs where external boot flash is undesirable. The industrial grade I suffix targets extended-temperature environments.
When designing with this device, verify power sequencing and supply rail design against the manufacturer datasheet, and use Libero SoC design software for synthesis and place-and-route.
This page synthesizes verified distributor data, drop-in alternatives from the same ProASIC3E family, and practical design guidance not consolidated on the manufacturer page.
直接替換替代品，適用於 A3PE3000-FG324I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A3PE3000-FG324I （相同外形與佔位） — 差異在於 Package, RoHS Status, Family, Operating Temperature, System Gates.
A3PE3000-FG324
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-FGG324I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-2FGG324
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-FGG324I
✅ 直接替換聯絡詢價
查看資料表 →M1A3PE3000-FG324I
✅ 直接替換📋 參考替代品（不在目錄中）
A3PE3000-1FG324I
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →A3PE3000-FG324I 最大額定值與電氣特性
| Family | ProASIC3E |
| Logic Elements | 35K (per distributor listing) |
| System Gates | 3M (3,000,000 gates) |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Number of I/Os | 221 |
| Configuration Memory | 516096 (internal flash, nonvolatile) |
| 封裝 | 324-BGA (FBGA) |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +125C (industrial) |
| Programming Type | In-System Programmable (flash, nonvolatile) |
A3PE3000-FG324I 324-bga (fbga) 腳位配置指南
A3PE3000-FG324I（324-bga (fbga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A3PE3000-FG324I.
請參閱 資料表 以查看完整腳位配置。
典型應用
A3PE3000-FG324I 適用於 6 應用s: Industrial Automation and Control, Communications and Networking Line Cards, Aerospace and Defense Subsystems, Secure Single-Chip Designs, Test and Measurement Instrumentation, Medical and Diagnostic Equipment.
Industrial Automation and Control
The A3PE3000-FG324I fits industrial automation controllers because its flash-based, instant-on fabric eliminates configuration boot delays that PLC and motor-control sequencers cannot tolerate, and its 221 user I/Os consolidate sensor interfaces, encoder inputs, and fieldbus glue logic into one 324-ball FBGA device. With 231 MHz system performance and a 1.5V core, it handles deterministic state machines and high-speed interlocks while dissipating less power than SRAM FPGA alternatives of similar density. Deployed between an industrial CPU module and I/O cards, it adds no configuration-flash failure point on the board - a meaningful reliability gain in factory environments rated -40C to +125C at the device level for industrial temperature zones.
推薦
Communications and Networking Line Cards
Line cards and network interface boards benefit from the A3PE3000-FG324I's combination of 3M gates, 231 MHz performance, and abundant I/O for bus bridging, framing, and backplane glue logic. The ProASIC3E embedded memory blocks buffer packet fragments and status registers, while the nonvolatile flash configuration lets a card become operational within milliseconds of slot insertion - valuable in hot-swap telecom shelves. Placed between the MAC/PHY devices and the backplane connector, the FPGA absorbs protocol glue and status multiplexing that would otherwise require multiple discrete devices, reducing BOM count and total cost of ownership on 130nm-class designs with mature, proven timing.
推薦
Aerospace and Defense Subsystems
Defense and avionic subsystems favor the A3PE3000-FG324I because flash-based ProASIC3E devices power up instantly and do not expose configuration bitstreams on an external bus, reducing both boot latency and configuration-readout attack surface. The industrial temperature rating (-40C to +125C) and 324-ball FBGA package with 221 I/Os support conduction-cooled boards processing sensor aggregation, UART/SPI bridges, and safety monitor logic. Microsemi (now Microchip) ProASIC3 devices have a long heritage in space and defense programs, and the single-chip architecture removes the external PROM whose latch-up and seeding concerns complicate radiation-aware designs in this density class.
推薦
Secure Single-Chip Designs
Designs that must not carry external configuration memory - secure industrial gateways, payment terminals, and protected control modules - use the A3PE3000-FG324I because its 516096-bit internal flash holds the bitstream on-chip. Unlike SRAM FPGAs that load configuration from an exposed SPI flash at every power-up, the ProASIC3E device presents no readable bitstream interface in normal operation, simplifying design security reviews. With 3M gates and 231 MHz performance, it implements AES-style logic hooks, secure boot state machines, and tamper-response glue logic while the 221 I/Os connect protected peripherals, all within the industrial temperature envelope for field-deployed hardware.
推薦
Test and Measurement Instrumentation
Bench instruments and modular test hardware use the A3PE3000-FG324I as the timing, trigger, and bus-interface fabric: 3M gates implement trigger state machines and timestamping counters at up to 231 MHz, while the 221 user I/Os front-panel connectors, relay drivers, and host interfaces. Flash configuration means the instrument is measuring immediately at power-on with no boot sequencing from external memory, and reprogrammability via Libero SoC supports field firmware updates. The 1.5V core keeps on-card power budgets manageable in fanless enclosures, and the industrial temperature grade accommodates marginally rated rack environments without derating the host design.
推薦
Medical and Diagnostic Equipment
Diagnostic imaging interfaces and patient-adjacent control boards choose the A3PE3000-FG324I for its deterministic instant-on behavior and single-chip integration: sensor array multiplexing, motor/solenoid sequencing, and host bus bridging all fit within 3M gates, reducing component count on boards that must pass design-history documentation. The nonvolatile flash configuration avoids external boot devices that complicate IEC-style risk analyses, and the industrial temperature range covers sterilizer-adjacent bays. With 221 I/Os in a 0.5mm-class 324-ball FBGA footprint around 23x23mm-class dimensions per the package family, dense multi-board stacks remain feasible while the 1.5V core limits local heating.
推薦
推薦產品摘要
工程參考資料，適用於 A3PE3000-FG324I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | A3PE3000-FG324 | A3PE3000-FGG324I | A3PE3000L-FGG324I | M1A3PE3000-FG324I |
|---|---|---|---|---|---|
| Package | 324-BGA (FBGA) | 324-BGA (FBGA) - same | 324-BGA (FBGA) - same | 324-BGA (FBGA) - same | 324-BGA (FBGA) - same |
| Brand | Microchip Technology (Microsemi/Actel legacy) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Temperature Grade | Industrial (-40C to +125C) | Commercial (0C to +70C) | Industrial (-40C to +125C) | Industrial (-40C to +125C) | Industrial (-40C to +125C) |
| System Gates | 3M | 3M | 3M | 3M | 3M |
| User I/Os | 221 | 221 | 221 | 221 | 221 |
| Soft Processor Support | Generic soft cores | Generic soft cores | Generic soft cores | Generic soft cores | ARM Cortex-M1 optimized |
| Speed Grade Options | Standard (-1 class) | Standard | Standard | L-family speed bins | Standard / -2 options |
主要差異化特點
- Industrial temperature range in the 324-ball footprint (對比A3PE3000-FG324)
- Lower dynamic power at same density (對比A3PE3000-FGG324I)
- ARM Cortex-M1 soft processor option (對比A3PE3000-2FGG324)
設計說明
Design the power tree around a 1.5V core rail plus the bank-dependent I/O rails for the FG324 package; each I/O bank takes one VCCI determined by the standard assigned in Libero SoC. Flash-based ProASIC3E devices draw inrush only for I/O activation, not configuration load, so power supply inrush sizing is simpler than SRAM FPGAs - but still verify per-bank hot-socket limits against the manufacturer datasheet before hot-swap backplane use.
The 324-ball FBGA requires controlled-impedance breakout with via-in-pad or dog-bone escapes on roughly 0.8mm-class ball pitch; follow Microchip's ProASIC3E PCB layout guidelines in the family user documentation. Place 100nF ceramic decoupling at the four corners plus center of the package and bulk capacitance near the regulators. Reserve one or two spare balls routed to test pads for future I/O redefinition - FPGA ball assignment is software-defined, so spare routing preserves layout reuse across speed and temperature grade variants.
Do not substitute commercial-grade A3PE3000-FG324 into an industrial enclosure: the 'I' suffix parts are qualified to -40C to +125C while the non-I parts are 0C to +70C. Also remember the L-family parts use a different core voltage, so although the footprint matches, an A3PE3000L drop-in requires power rail verification and bitstream recompilation. Verify supply voltage bands and MSL handling (bake if floor-life exceeded) before reflow of any FBGA package.
合規資訊
Verified web data does not state RoHS/REACH status for this exact ordering code. The FGG324 variants denote lead-free ball metallurgy per Microchip naming conventions; obtain official material declarations from Microchip before qualification.
