A3PE3000L-1FG324ID - Low Power Flash FPGA 324-BGA | Microchip
MPN： A3PE3000L-1FG324ID ✓ 啟用中A3PE3000L-1FG324ID 概覽
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration device or volatile SRAM. Within the power-management hierarchy of programmable logic, flash FPGAs deliver true single-chip operation, instant-on behavior, and high design security, sitting alongside SRAM FPGAs and CPLDs as a programmable logic category for glue logic, control, and data-path functions.
Key differentiating features include Microchip's Flash*Freeze technology, which dramatically reduces static power, and the ProASIC3L architecture that lowers dynamic power by 40% and static power by 50% compared with the equivalent standard ProASIC3 device. The 1.2 V to 1.5 V core and I/O operation as low as 1.2 V makes the family attractive for battery-powered and thermally constrained systems. The device supports weak pull-up/pull-down options, a Schmitt trigger option on single-ended inputs, and IEEE 1149.1 (JTAG) boundary scan test.
Technically, the A3PE3000L is fabricated in a 130 nm flash process with versatile VersaTile logic fabric, embedded SRAM blocks, and pin-compatible packages across the ProASIC3L family, which simplifies migration between density grades without board redesign.
Typical applications include portable and battery-operated instrumentation, industrial control, military and aerospace systems (the ProASIC3/EL datasheet also covers military variants), and power-sensitive bridging logic where an instant-on, single-chip FPGA eliminates the boot time and configuration memory of SRAM-based devices.
A key design consideration is supply sequencing and Flash*Freeze pin handling: to achieve the lowest static power, the Flash*Freeze mode must be entered correctly and unused I/Os should be configured with appropriate pull options per the ProASIC3L datasheet.
This page synthesizes distributor availability, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single citable reference for the A3PE3000L-1FG324ID.
直接替換替代品，適用於 A3PE3000L-1FG324ID — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A3PE3000L-1FG324ID （相同外形與佔位） — 差異在於 Package, Family, System Gates, Operating Temperature, Core Voltage.
A3PE3000L-1FG324
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-1FG324I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-1FGG324
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-1FGG324I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-FG324I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-FGG324
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-1FG324ID 最大額定值與電氣特性
| Family | ProASIC3L Low Power Flash FPGA |
| System Gates | 3000000 gates |
| Logic Cells (CLBs) | 75264 |
| User I/O | 221 |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130 nm CMOS flash |
| 封裝 | 324-BGA (FG324) |
| 安裝類型 | Surface Mount |
| Technology | Flash-based (single-chip, reprogrammable) |
| Low Power Feature | Flash*Freeze Technology |
| Dynamic Power Reduction | 40% vs equivalent ProASIC3 |
| Static Power Reduction | 50% vs equivalent ProASIC3 |
| JTAG Boundary Scan | IEEE 1149.1 |
| Schmitt Trigger Input Option | Yes (single-ended inputs) |
| Weak Pull-Up/Pull-Down | Yes |
| 工作溫度 | Industrial (I grade) |
A3PE3000L-1FG324ID 324-bga (fg324) 腳位配置指南
A3PE3000L-1FG324ID（324-bga (fg324) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A3PE3000L-1FG324ID.
請參閱 資料表 以查看完整腳位配置。
典型應用
A3PE3000L-1FG324ID 適用於 6 應用s: Battery-Powered Portable Instrumentation, Industrial Control and Automation, Military and Aerospace Systems, Instant-On Embedded Bridging Logic, Medical Diagnostic Equipment, Secure Industrial Networking and IoT Gateways.
Battery-Powered Portable Instrumentation
The A3PE3000L-1FG324ID fits portable and battery-operated instruments because its 1.2 V to 1.5 V core operation and Flash*Freeze technology directly attack the two dominant FPGA power consumers: dynamic switching and standby leakage. Per the Microchip ProASIC3L datasheet (DS50003268), the family reduces dynamic power by 40% and static power by 50% versus the equivalent standard ProASIC3 device, and Flash*Freeze retains register state while cutting static current dramatically during idle periods. In a portable data logger, the FPGA implements glue logic, sensor interfaces, and display control, entering Flash*Freeze between acquisition windows. Because configuration lives in on-chip flash, the system powers up instantly with no configuration-device energy overhead - a quantified benefit for duty-cycled designs where every boot counts.
推薦
Industrial Control and Automation
In industrial control, the A3PE3000L-1FG324ID serves as single-chip control logic, motor-sequencing state machines, and fieldbus glue logic. Its 75264 logic cells and 221 user I/Os provide enough fabric to consolidate multiple discrete PLDs, while IEEE 1149.1 (JTAG) boundary scan supports board-level production test - a practical requirement on automated assembly lines. The industrial (I) temperature grade supports control cabinets and unconditioned environments. Flash*Freeze mode lets the controller hold state during standby between production cycles, cutting static power by the 50% family-level improvement documented in the ProASIC3L datasheet, and the Schmitt-trigger option on single-ended inputs improves noise immunity on long factory wiring reaching the I/O banks.
推薦
Military and Aerospace Systems
The ProASIC3/EL datasheet lineage includes military temperature variants, and flash-based FPGAs are a mainstay in defense and aerospace payloads because the configuration is non-volatile, single-chip, and resistant to bitstream interception - there is no external configuration device to read. The A3PE3000L-1FG324ID's 130 nm flash fabric with 3 million gates implements sensor preprocessing, bus bridging, and telemetry formatting. Flash*Freeze reduces power during orbit or mission idle phases, which matters for power-limited platforms. Designers should select the appropriate temperature grade ordering code for the mission environment and review Microchip's reliability and radiation documentation for the ProASIC3L family before flight qualification, as ID-coded industrial parts and military-rated variants differ in screening.
推薦
Instant-On Embedded Bridging Logic
The A3PE3000L-1FG324ID excels where logic must be functional within milliseconds of power application: PCIe-style bus bridging, wake-up controllers, and power-rail sequencing logic that cannot wait for an SRAM FPGA to load a bitstream. Because configuration is stored in on-chip flash, the device is genuinely single-chip - Microchip markets the ProASIC3 family as a true single-chip solution with reprogrammability. The 221 user I/Os with bank-selectable I/O voltage as low as 1.2 V let one device interface legacy 3.3 V peripherals and modern 1.2 V cores. In Flash*Freeze, retained-state standby power is minimized, making the part a natural supervisor of its own sleep cycles in always-on edge equipment such as network appliances and gateways.
推薦
Medical Diagnostic Equipment
Portable and benchtop medical diagnostics benefit from the A3PE3000L-1FG324ID's combination of low standby power, instant-on behavior, and deterministic flash fabric timing. Signal-chain housekeeping - multiplexing, gain control, filter configuration, and sensor interface logic - maps well onto the 75264-cell fabric, while Flash*Freeze allows the instrument to hold acquisition state between measurements, exploiting the 50% static power reduction versus standard ProASIC3. The single-chip flash configuration avoids the inrush and boot latency of configuration devices, which simplifies duty-cycled battery designs in handheld monitors. Designers should follow Microchip's I/O banking guidance to isolate sensitive analog sections from digital switching noise, using the Schmitt-trigger input option where sensor signals arrive over shared wiring.
推薦
Secure Industrial Networking and IoT Gateways
Edge gateways and industrial network nodes use the A3PE3000L-1FG324ID for protocol bridging, security logic, and sensor aggregation. The flash fabric keeps configuration internal, raising the bar against bitstream extraction compared with SRAM FPGAs, and the IEEE 1149.1 boundary-scan chain supports manufacturing test of dense multi-layer gateway boards. With I/O operation down to 1.2 V, the device bridges modern low-voltage PHYs and legacy 3.3 V or 2.5 V peripherals without level-shifting glue. Flash*Freeze enables aggressive sleep strategies between polling windows, and the 40% dynamic power reduction documented for the ProASIC3L family lowers thermal load in sealed, fanless enclosures - a concrete benefit for outdoor IoT gateways with passive cooling budgets.
推薦
推薦產品摘要
工程參考資料，適用於 A3PE3000L-1FG324ID — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | A3PE3000L-1FG324 | A3PE3000L-1FGG324 | A3PE3000L-FG324I | A3PE3000L-FGG324 |
|---|---|---|---|---|---|
| Package | 324-BGA (FG324) | 324-BGA (FG324) - same | 324-BGA (FG324) - same | 324-BGA (FG324) - same | 324-BGA (FG324) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Cells (CLBs) | 75264 | 75264 | 75264 | 75264 | 75264 |
| User I/O | 221 | 221 | 221 | 221 | 221 |
| Speed Grade | -1 (fastest ProASIC3L grade) | -1 | -1 | Standard | Standard |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Flash*Freeze Technology | Yes | Yes | Yes | Yes | Yes |
主要差異化特點
- Lowest static power in the ProASIC3 3M-gate class (對比A3PE3000-2FG324)
- Fastest timing closure within the same FG324 footprint (對比A3PE3000L-FG324I)
- RoHS-directed packaging option available (對比A3PE3000L-1FG324)
設計說明
Estimated: to exploit Flash*Freeze, drive the Flash*Freeze pin per the Microchip ProASIC3L datasheet (DS50003268) timing requirements and gate all active clock domains before entry; leaving clocks running in Flash*Freeze forfeits the 50% static power benefit. Core supply must remain within 1.2 V to 1.5 V; operating the core at 1.2 V minimizes dynamic power (roughly proportional to V^2), while 1.5 V may be required for the fastest timing closure at the -1 speed grade. Characterize both corners in Libero power analysis before fixing the rail.
The FG324 324-ball BGA requires a dedicated multilayer stackup: allocate at least one solid ground plane under the die area for ball parasitics and signal return, and fan out the 221 user I/Os using via-in-pad or dogbone patterns appropriate to 1.0 mm BGA pitch. Group I/O banks so each bank's VCCI supply matches its connected voltage standard (down to 1.2 V). Decouple each core and I/O bank supply with bulk plus 0.1 uF ceramics close to the balls, per standard Microchip FPGA power distribution guidance.
Do not treat the ID ordering code, I-suffixed, and FGG variants as interchangeable in procurement documents without checking packing and compliance requirements - the FGG (green) variants are the lead-free packaging option and may be mandatory for RoHS-directed builds. Also note that pin compatibility across ProASIC3L packages excludes PQ208, so footprint reuse claims apply only within the same package (FG324 here). Finally, the -1 and standard speed grades differ in timing; a bitstream closed on a -1 part may fail timing on a standard-grade substitute.
合規資訊
FGG (green) variants of the ProASIC3L family are the lead-free/RoHS-directed packaging options per Microchip convention; RoHS/REACH status for the exact ID ordering code should be confirmed on the Microchip product page or via distributor compliance sheets (e.g. etei.com comparisons) before release to production.
