A3PE3000L-1FG324 - ProASIC3L Low Power FPGA 324-BGA | Microchip
MPN: A3PE3000L-1FG324 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $172.5 | $1,725.00 |
| 100 | $158 | $15,800.00 |
| 500 | $146.75 | $73,375.00 |
| 1,000 | $135.9 | $135,900.00 |
Drop-in alternatives for A3PE3000L-1FG324 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000L-1FGG324
✅ Drop-In✓ In Stock
$47.95 / Unit
View Datasheet →A3PE3000L-FG324
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A3PE3000L-FG324I
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Contact for price
View Datasheet →A3PE3000-1FG324
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000-2FGG324
✅ Drop-In✓ In Stock
$216 / Unit
View Datasheet →A3PE3000L-1FG324 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (flash FPGA) |
| System Gates | 3,000,000 gates |
| Logic Elements | 35K LEs (75264 CLBs per distributor listing) |
| User I/O | 221 |
| Embedded SRAM | 516096 bits |
| Core Voltage | 1.2 V (1.2 V to 1.5 V range) |
| I/O Voltage | 1.2 V (as low as 1.2 V supported) |
| Process Technology | 130 nm CMOS flash |
| Speed Grade | -1 |
| Package | 324-Ball FBGA (FG324) |
| Mounting Type | Surface Mount |
| Configuration | Non-volatile flash, live at power-up |
| Special Features | Flash*Freeze technology |
| Maximum Reported Frequency | 892.86 MHz (per FindIC listing) |
| RoHS Status | RoHS Non-Compliant (contains lead, per distributor data) |
| Lead Free Status | Contains Lead |
| Packaging | Tray |
A3PE3000L-1FG324 324-ball fbga (fg324) Pin Configuration Guide
Complete pinout information for A3PE3000L-1FG324 (324-ball fbga (fg324) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-1FG324.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-1FG324 is suitable for 6 applications: Battery-Powered Portable Instrumentation, Industrial Control and Automation, Military and Aerospace Subsystems, Communication Equipment Bridge Logic, Medical Diagnostic and Monitoring Devices, Security and Video Surveillance Control.
Battery-Powered Portable Instrumentation
The A3PE3000L-1FG324 fits portable instrumentation because its ProASIC3L silicon cuts dynamic power roughly 40% and static power roughly 50% versus the equivalent ProASIC3 device, while Flash*Freeze mode drops the 3M-gate fabric into a state-retentive ultra-low-power standby between measurements. The 1.2 V core and I/O operation down to 1.2 V allow direct interfacing with low-voltage ADCs, sensors, and microcontrollers in a single-rail handheld system. Used as the main control and glue-logic fabric between a precision ADC and a low-power MCU, the FPGA implements triggering, filtering, and interface bridging; because configuration is flash-based and live at power-up, the instrument is immediately functional on wake without a boot sequence. The 324-ball FBGA concentrates 221 I/Os in a compact footprint suitable for handheld PCB real estate.
Recommended
Industrial Control and Automation
In industrial control, the A3PE3000L-1FG324 serves as deterministic control logic bridging PLC backplanes, motor-drive encoders, and field I/O. Its 221 user I/Os in the 324-ball FBGA support dense parallel interfaces (parallel buses, encoder inputs, relay control lines), while the flash fabric is live at power-up, so machinery resumes control instantly after power cycles - critical in lines without soft-start sequencing. The -1 speed grade comfortably handles tens to hundreds of MHz control loops, and 516,096 bits of embedded SRAM implement FIFOs and look-up tables for motion profiles. Compared with SRAM FPGAs, the single-chip non-volatile solution eliminates configuration PROMs that add BOM cost and a reliability point in electrically noisy factory environments. Choose the industrial-temperature A3PE3000L-FG324I variant for uncontrolled enclosures.
Recommended
Military and Aerospace Subsystems
The ProASIC3L family originated in Microsemi's military portfolio (the family datasheet covers Military ProASIC3/EL parts), making the A3PE3000L-1FG324 a natural fit for ruggedized, size-constrained defense subsystems such as software-defined radio front-end glue logic, sensor aggregation, and secure boot platforms. Flash-based configuration is inherently non-volatile and does not require bitstream loading from external memory at power-up, reducing both configuration-latency attack surface and component count in convection-limited or sealed enclosures. The 1.2 V core reduces power dissipation in passively cooled modules, and Flash*Freeze supports duty-cycled operation in battery-fed portable soldier systems. The industrial-temperature FG324I variant covers extended environments; verify programmatic flow and documentation requirements with the manufacturer for defense qualification.
Recommended
Communication Equipment Bridge Logic
In networking and communication line cards, the A3PE3000L-1FG324 implements protocol bridging, backplane interface translation, and board-management logic between processors, PHYs, and ASICs. With 221 I/Os arranged in flexible banks and I/O voltage support down to 1.2 V, it can interface simultaneously with legacy 3.3 V/2.5 V parallel buses and modern low-voltage subsystems in mixed-generation equipment. The 516,096-bit embedded SRAM provides buffering for packet-framing logic, while the -1 speed grade supports the moderate fabric frequencies typical of board-control and bridging paths (the 892.86 MHz figure reflects the device's internal cell performance ceiling rather than system I/O rates). Flash-based instant-on configuration eliminates external boot devices from the line-card BOM, improving reliability in always-on telecom infrastructure.
Recommended
Medical Diagnostic and Monitoring Devices
Medical monitoring equipment benefits from the A3PE3000L-1FG324's combination of low standby power and instant-on non-volatile configuration. In bedside monitors and portable diagnostic devices, the FPGA aggregates multiple sensor channels (ECG front ends, SpO2 modules, pressure sensors) into a data path feeding a processor, handling trigger timing, digital filtering, and interface conversion. Flash*Freeze mode lets the device hold state while the unit idles between measurements, extending battery life in transport monitors; wake latency is negligible compared with SRAM FPGA reconfiguration. The 1.2 V core and I/O rails reduce power and simplify rail sharing with modern low-voltage analog front ends. For mains-powered cart-based systems, power savings translate directly into lower enclosure temperatures and quieter operation.
Recommended
Security and Video Surveillance Control
Surveillance camera and video-recording subsystems use the A3PE3000L-1FG324 for sensor-interface bridging, timing generation, and system-management logic. The device's 221 I/Os handle parallel CMOS sensor interfaces, actuator control, and housing peripherals, while embedded SRAM (516,096 bits) buffers image metadata and frame markers. Because the flash configuration is live at power-up, cameras begin operation the moment power is applied - valuable in systems where loss of even the first frames after power events matters. Flash*Freeze keeps the control fabric in a retained ultra-low-power state during scheduled idle windows, complementing low-duty-cycle recording profiles common in battery-backed perimeter systems. The 324-ball FBGA supports compact camera-module board layouts with high I/O density around the image sensor interface.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-1FG324 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-1FGG324 | A3PE3000L-FG324 | A3PE3000L-FG324I | A3PE3000-1FG324 | A3PE3000-2FGG324 |
|---|---|---|---|---|---|---|
| Package | 324-Ball FBGA (FG324) | 324-Ball FBGA (FG324) - same | 324-Ball FBGA (FG324) - same | 324-Ball FBGA (FG324) - same | 324-Ball FBGA (FG324) - same | 324-Ball FBGA (FG324) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family / Power Class | ProASIC3L (low power) | ProASIC3L (low power) | ProASIC3L (low power) | ProASIC3L (low power) | ProASIC3 (standard) | ProASIC3 (standard) |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 221 | 221 | 221 | 221 | 221 | 221 |
| Speed Grade | -1 | -1 | -1 | -1 | -1 | -2 (faster) |
| RoHS Status | Non-compliant (lead-containing balls) | Compliant (lead-free GG balls) | Non-compliant | Non-compliant | Non-compliant | Compliant (lead-free GG balls) |
| Temperature Range | [DATA_NEEDED: temperature range] | [DATA_NEEDED] | Commercial | Industrial | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Lowest static power in the 3M-gate ProASIC3 class (vs A3PE3000-1FG324)
- Flash-based single-chip configuration (vs SRAM-based FPGA competitors)
- Lead-free compliance option in the same footprint (vs A3PE3000L-1FGG324)
- Flash*Freeze state-retentive standby (vs A3PE3000-2FGG324)
Design Notes
Budget the power tree around the 1.2 V to 1.5 V core rail with proper decoupling at each VCC ball group in the 324-ball footprint; the ProASIC3L family datasheet provides per-device current estimates via Microchip's power calculator. Exploit Flash*Freeze for idle windows: entry/exit is controlled by a dedicated pin and retains logic and I/O state, but verify wake latency in your system timing model. Estimated: at a 1.2 V core, even tens of milliamps of static current translates to only tens of milliwatts, but active switching current scales with clock frequency and toggle rate - always run the official power estimator with your post-layout netlist.
The 324-ball FBGA requires controlled PCB fabrication: typical pitch for this package family is 1.0 mm, enabling via-in-pad or dogbone escape fanout on a 4-6 layer board. Plan at least one solid ground plane and one power plane under the package; group I/O bank rails (VCCI) so that shared voltage standards land on the same plane segments. Keep JTAG and dedicated configuration balls routed short and away from switching signals. Follow Microchip's ProASIC3L PCB layout guidelines in the family datasheet for exact ball assignments before finalizing the footprint.
Watch compliance and lifecycle details: the FG324 standard ball finish is lead-containing and RoHS non-compliant per distributor data, so RoHS-regulated production must order the FGG324 lead-free variant instead - both share the identical 324-ball footprint, but solder profiles differ slightly for lead-free assembly. Also do not confuse the A3PE3000L (low power) with the A3PE3000 (standard): they are pin-compatible, but the L variant trades peak fabric performance for roughly 40% lower dynamic and 50% lower static power; timing closure results from an A3PE3000 project may not transfer unchanged to the -1 speed grade L part.
Compliance Information
Distributor data (digchip listing) reports Lead Free Status: Contains Lead and RoHS Status: RoHS Non-Compliant for the FG324 ball finish. Use the A3PE3000L-1FGG324 variant for lead-free/RoHS-compliant assemblies.
