A3PE3000L-1FGG324 - 3M-Gate Low-Power Flash FPGA | Microchip
MPN: A3PE3000L-1FGG324 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $63.1 | $631.00 |
| 100 | $57.8 | $5,780.00 |
| 500 | $52.4 | $26,200.00 |
| 1,000 | $47.95 | $47,950.00 |
Drop-in alternatives for A3PE3000L-1FGG324 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000L-1FGG324I
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View Datasheet →A3PE3000L-FGG324
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$86.15 / Unit
View Datasheet →A3PE3000L-FGG324I
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$62.65 / Unit
View Datasheet →A3PE3000L-1FG324I
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$135 / Unit
View Datasheet →A3PE3000-2FGG324
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$216 / Unit
View Datasheet →A3PE3000-FGG324I
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$198 / Unit
View Datasheet →A3PE3000L-1FGG324 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 |
| Logic Elements | 35K LEs |
| Logic Cells (CLBs) | 75264 |
| User I/O | 221 |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130 nm CMOS flash |
| Technology | Nonvolatile Flash (Instant On) |
| Package | 324-ball FBGA (FGG324) |
| Mounting Type | Surface Mount |
| Speed Grade | -1 |
| Special Features | Flash*Freeze low-power technology |
| Reprogrammability | Yes (in-system reprogrammable flash) |
| Configuration | Single-chip, no external configuration device required |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
A3PE3000L-1FGG324 324-ball fbga (fgg324) Pin Configuration Guide
Complete pinout information for A3PE3000L-1FGG324 (324-ball fbga (fgg324) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-1FGG324.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-1FGG324 is suitable for 6 applications: Industrial Automation Control, Portable and Battery-Powered Instruments, Secure Military and Aerospace Subsystems, Communications Line Cards and Networking, Medical and Diagnostic Equipment, Test and Measurement Instrumentation.
Industrial Automation Control
In PLC I/O modules, motor-control interfaces, and factory-floor sensing nodes, the A3PE3000L-1FGG324 provides 3 million gates of glue logic, interface bridging, and sequencing with 221 user I/Os to absorb multiple legacy ASSP functions. Its nonvolatile flash fabric is Instant On, so a line restart after power loss requires no configuration download - critical for equipment uptime. With a 1.2 V core and Flash*Freeze technology, idle cabinets cut dynamic power dramatically between production cycles. Placed between backplane connectors and local controllers, the FPGA terminates parallel buses and translates to modern serial links; the trade-off versus a microcontroller is higher flexibility at the cost of RTL design effort.
Recommended
Portable and Battery-Powered Instruments
Handheld test instruments, data loggers, and field meters benefit from the A3PE3000L-1FGG324's low-power ProASIC3L fabric: the 1.2 V core minimizes static consumption, and Flash*Freeze mode retains register and SRAM state while the device sleeps, enabling near-instant wake-up between measurement bursts. The 221 user I/Os drive LCD segments, keypads, and sensor interfaces without an external CPLD. Because the flash configuration is on-chip, no boot current is spent loading a bitstream, extending battery budget compared with SRAM FPGAs. Designers should budget I/O banking so active interfaces share banks powered during Flash*Freeze-adjacent operation, and verify wake-up timing against the Microchip datasheet AC tables.
Recommended
Secure Military and Aerospace Subsystems
ProASIC3L flash FPGAs are widely deployed in defense electronics because the single-chip, nonvolatile configuration eliminates the bitstream theft risk of external configuration PROMs, and the 130 nm flash process supports Microchip's security features for design protection. The A3PE3000L-1FGG324's 3M gates implement protocol engines, bus interfaces (MIL-STD-style parallel buses, UART/SPI bridges), and system controllers in one device, while the industrial-temperature A3PE3000L-1FGG324I variant covers extended environments. Instant-On behavior suits turret controllers and avionics LRUs that must be ready at power application. Designers should use Libero SoC security tooling and follow Microchip's defense application notes for reliable design flow.
Recommended
Communications Line Cards and Networking
In telecom and enterprise-network line cards, the A3PE3000L-1FGG324 handles backplane glue logic, LED/PHY supervision, hot-swap sequencing, and low-speed protocol conversion. The 3M-gate fabric absorbs CAM-control interfaces, I2C/SPI masters, and board-management state machines, while 221 I/Os connect to connectors, transceivers, and status planes. Flash*Freeze lets standby line cards drop dynamic power while retaining link state, easing chassis thermal budgets; the 1.2 V core reduces switching losses versus 1.5 V operation. Because the fabric is nonvolatile, a rebooted card resumes operation instantly without a configuration controller. Timing closure at speed grade -1 is straightforward for these sub-100 MHz state-machine workloads.
Recommended
Medical and Diagnostic Equipment
Portable diagnostics, patient monitors, and bench-top analyzers use the A3PE3000L-1FGG324 to interface sensor front ends, drive displays, and sequence measurement engines. The low-power fabric supports battery and cart-based operation, while the single-chip flash configuration avoids external memory that would otherwise add a failure point in regulated medical devices. Flash*Freeze keeps patient data latched between sampling windows, and Instant-On start-up shortens the time from power switch to ready screen - a user-experience and emergency-response benefit. The 3M-gate capacity implements DSP-lite preprocessing (filters, thresholds) ahead of the host processor. Verify I/O ESD and isolation requirements against IEC-60601 system-level goals during design.
Recommended
Test and Measurement Instrumentation
Bench instruments, automated test equipment (ATE), and protocol analyzers rely on the A3PE3000L-1FGG324 for timing generators, trigger matrices, and bus emulation across its 221 I/Os. The 3M-gate VersaTile fabric implements deep counters, pattern generators, and per-channel delay lines with deterministic, Instant-On startup - useful for calibration routines that run before an OS boots. Flash*Freeze maintains instrument state during idle periods on portable analyzers, and the 1.2 V core keeps shelf-mode current low. Compared with an MCU + CPLD stack, the single FPGA reduces BOM spread and yields deterministic timing skew. Route high-fanout clocks with balanced trees and verify setup/hold with Libero timing reports.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-1FGG324 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-1FGG324I | A3PE3000L-FGG324 | A3PE3000L-1FG324I | A3PE3000-2FGG324 |
|---|---|---|---|---|---|
| Package | 324-ball FBGA (FGG324) | 324-ball FBGA (FGG324) - same | 324-ball FBGA (FGG324) - same | 324-ball FBGA (FG324) - same footprint, lead-finish variant | 324-ball FBGA (FGG324) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASIC3L (low power) | ProASIC3L | ProASIC3L | ProASIC3L | ProASIC3E (performance) |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 221 | 221 | 221 | 221 | 221 |
| Speed Grade | -1 | -1 | standard (faster) | -1 | -2 (faster) |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | Yes | No |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | [DATA_NEEDED] |
| Temperature Grade | Commercial | Industrial | Commercial | Industrial | Commercial |
| RoHS / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free |
Key Differentiators
- Flash*Freeze ultra-low-power mode with state retention (vs A3PE3000-2FGG324)
- Lowest dynamic power via -1 speed grade at 1.2 V core (vs A3PE3000L-FGG324)
- Extended-temperature availability in identical footprint (vs A3PE3000L-1FGG324I)
Design Notes
The 324-ball FBGA (1.0 mm ball pitch class) demands a disciplined fanout strategy: use via-in-pad for power/ground balls or dog-bone escapes on perimeter signal balls, and define a 4+ layer stackup with dedicated core/GND planes. Escape routing density limits outer two rows to conventional traces; inner rows must escape through vias. Follow the Microchip ProASIC3L datasheet (DS50003268) package section and Microchip FPGA PCB layout application notes for ball map, keepouts, and land-pattern dimensions before finalizing the footprint.
Power the A3PE3000L core at 1.2 V for lowest dynamic power or up to 1.5 V for higher performance; the -1 speed grade typically permits 1.2 V core operation, but confirm the DC characteristics table in the datasheet for your grade. Provide separate regulated rails for core, I/O banks (VCCI), and the programming/Flash*Freeze supplies (VPT), with 10 uF bulk plus 0.1 uF high-frequency decoupling per bank. Sequencing requirements for multi-rail flash FPGAs are relaxed versus SRAM FPGAs, but verify the datasheet power-up specification to avoid configuration errors.
Do not confuse the FG vs FGG suffix: FGG324 uses a lead-free ball finish required for RoHS lines, while FG324 shares the same footprint but different ball metallurgy - verify solder-profile compatibility with your lead-free reflow profile. Also, instantiating Flash*Freeze requires the FLASH_FREEZE pin to be connected and the feature enabled in Libero SoC; leaving it unconnected forfeits the flagship low-power benefit. Finally, designs written for ProASIC3E (A3PE3000) must be re-verified before targeting the L variant.
Compliance Information
RoHS compliant and lead free per distributor listings (DigChip, Mouser, DigiKey). REACH, halogen-free, and conflict-minerals status not stated in provided data - request manufacturer declarations.
