A54SX08-1TQG176I - 12K-Gate SX FPGA, 176-TQFP | Microsemi
MPN： A54SX08-1TQG176I ✓ 啟用中A54SX08-1TQG176I 概覽
An FPGA is a programmable logic device that implements custom digital circuits by configuring a fabric of logic blocks and interconnect. The SX family belongs to the higher tier of the Actel/Microsemi FPGA hierarchy, sitting above the ACT-series FPGAs and using a sea-of-modules antifuse architecture that delivers application-specific-IC-like performance and routing density in a one-time-programmable device. Unlike SRAM FPGAs, the antifuse configuration is non-volatile, radiation-tolerant by nature, and requires no configuration PROM, simplifying the bill of materials and improving design security.
Key features include a 0.35 um process technology with toggle rates up to 280 MHz, dual supply voltage operation (3.0 V to 3.6 V core and 4.75 V to 5.25 V I/O per Microchip USA data), and 128 programmable user I/Os configurable for interfacing with 5 V-tolerant peripheral systems. The -1 speed grade balances performance with power, and the industrial I-suffix rating supports operation in harsh environments.
The sea-of-modules architecture uses two module types, combinational and sequential, in an 8:2 ratio, providing efficient implementation of both wide and narrow logic functions with predictable, low-skew timing. Because routing is fixed at programming time via antifuse links, the device exhibits deterministic interconnect delays that simplify static timing analysis.
Typical applications include industrial control and automation, communications and networking glue logic, bridge and interface logic, and defense/aerospace embedded control where one-time programmability and configuration immunity are valued.
Design consideration: as a one-time-programmable antifuse device, functional errors cannot be re-fixed in the field, so complete simulation with the Libero/Designer flow is mandatory before programming.
This page synthesizes distributor data, family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 A54SX08-1TQG176I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A54SX08-1TQG176I （相同外形與佔位） — 差異在於 System Gates, Series, Process Technology, Package, Package / Case.
A54SX08-2TQG176I
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
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查看資料表 →A54SX16-TQG176I
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查看資料表 →A54SX16-1TQG176I
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查看資料表 →A54SX32-1TQG176I
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查看資料表 →A54SX08-1TQG176I 最大額定值與電氣特性
| Family | Actel SX (54SX) |
| System Gates | 12000 |
| Logic Cells | 512 |
| Logic Array Blocks (LABs) | 768 |
| User I/Os | 128 |
| Speed Grade | -1 |
| Maximum Toggle Rate | 280 MHz |
| Process Technology | 0.35 um |
| Supply Voltage (Core) | 3 V to 3.6 V |
| Supply Voltage (I/O) | 4.75 V to 5.25 V |
| Programming Technology | Antifuse (one-time programmable) |
| 工作溫度 | -40C to +85C (industrial, per I suffix) |
| 封裝 | 176-TQFP (24x24 mm) |
| 安裝類型 | Surface Mount |
| Architecture | Sea-of-modules |
A54SX08-1TQG176I 176-tqfp (24x24 mm) 腳位配置指南
A54SX08-1TQG176I（176-tqfp (24x24 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A54SX08-1TQG176I.
請參閱 資料表 以查看完整腳位配置。
典型應用
A54SX08-1TQG176I 適用於 6 應用s: Industrial Control and Automation, Communications and Networking Glue Logic, Defense and Aerospace Embedded Logic, Legacy Board Continuation and Obsolescence Management, 5V-Tolerant Interface and Bridge Logic, Test and Measurement Instrumentation.
Industrial Control and Automation
The A54SX08-1TQG176I fits industrial control because its industrial temperature rating (-40C to +85C), 5 V-tolerant I/O operation (4.75 V to 5.25 V I/O rail), and non-volatile antifuse configuration remove the boot-time configuration step that SRAM FPGAs require on factory-floor equipment that must be live at power-up. In a PLC or motor-control interface card, the 128 user I/Os and 12,000 gates implement encoder interfaces, PWM generation, and safety-interlock glue logic with deterministic timing (0.35 um fabric toggling to 280 MHz). Because routing is fixed at programming, propagation delays do not vary with reconfiguration, simplifying certification of deterministic control paths.
推薦
Communications and Networking Glue Logic
In line cards, backplane bridges, and telecom adapters, the A54SX08-1TQG176I implements address decoding, bus formatting, and protocol adaptation between processors and PHY devices. Its 280 MHz toggle capability supports high-speed counters and shift-register functions, while the sea-of-modules fabric provides low, predictable interconnect delay for tight setup/hold budgets between the FPGA and companion ASICs. The 176-TQFP 24x24 mm footprint offers a practical 0.5 mm-pitch lead frame for two-layer routing of 128 I/Os, and the one-time-programmable configuration eliminates the configuration PROM that would otherwise occupy board space and add a boot sequence to the link bring-up time.
推薦
Defense and Aerospace Embedded Logic
Antifuse FPGAs are valued in defense and aerospace systems because the one-time-programmed configuration cannot be disturbed by radiation-induced configuration upsets, unlike SRAM fabrics. The A54SX08-1TQG176I provides 12,000 system gates for sensor interfaces, telemetry formatting, and redundant-signal voting logic in upgrade programs where the original Actel SX design must be maintained. The industrial -1 grade part suits ground-based and laboratory defense electronics, while the non-volatile fabric removes power-up configuration risk in mission equipment. Its deterministic routing also eases worst-case timing analysis required by high-reliability design reviews, and Microchip continues to support the family for legacy program continuity.
推薦
Legacy Board Continuation and Obsolescence Management
Programs maintaining boards designed around Actel SX devices rely on the A54SX08-1TQG176I for exact re-creation of the original logic image, since the antifuse bitstream remains archivable and re-programmable onto new dies indefinitely. When a production run needs more logic but cannot change the PCB, drop-in family upgrades in the same 176-TQFP footprint (A54SX16-TQG176I, A54SX32-1TQG176I) absorb design growth without respin. Because the SX08 design database compiles identically across speed-grade variants within the family, obsolescence managers can qualify A54SX08-2TQG176I as a second source with only timing re-verification, protecting against allocation shortages on the -1 grade.
推薦
5V-Tolerant Interface and Bridge Logic
Many industrial and test systems still run 5 V peripheral buses, and the A54SX08-1TQG176I directly accommodates a 4.75 V to 5.25 V I/O supply, eliminating the level-shifting buffers that modern 1.2-3.3 V FPGAs demand at every boundary. The 128 user I/Os connect to legacy SCSI, VME-style backplanes, and TTL sensor clusters, while the 3.0 V to 3.6 V core rail keeps dynamic power manageable. With 512 logic cells, the device implements bus arbitration, wait-state generation, and parallel-to-serial bridging between a 5 V host bus and 3.3 V peripherals, consolidating dozens of 74-series devices into one 24x24 mm TQFP and cutting board area and assembly cost.
推薦
Test and Measurement Instrumentation
Bench instruments and ATE fixtures benefit from the A54SX08-1TQG176I's predictable antifuse timing and instant-on operation: the programmed logic is active the moment power is applied, with no configuration latency that would skew time-stamped measurements. The 280 MHz toggle capability supports frequency counters, event timers, and pattern generators at moderate rates, while 128 I/Os drive probe matrices and relay-control arrays from one device. In fixture electronics that remain configured for years, one-time programming is an advantage because there is no configuration memory to corrupt. The industrial temperature range also permits use in temperature chambers and environmental test stations without derating.
推薦
推薦產品摘要
工程參考資料，適用於 A54SX08-1TQG176I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | A54SX08-2TQG176I | A54SX08-TQG176I | A54SX08-1TQG176 | A54SX16-TQG176I | A54SX32-1TQG176I |
|---|---|---|---|---|---|---|
| Package | 176-TQFP (24x24 mm) | 176-TQFP (24x24 mm) - same | 176-TQFP (24x24 mm) - same | 176-TQFP (24x24 mm) - same | 176-TQFP (24x24 mm) - same | 176-TQFP (24x24 mm) - same |
| Brand | Microsemi (Actel) | Microsemi (Actel) | Microsemi (Actel) | Microsemi (Actel) | Microsemi (Actel) | Microsemi (Actel) |
| System Gates | 12000 | 12000 | 12000 | 12000 | 24000 | 32000 |
| User I/Os | 128 | 128 | 128 | 128 | 128 | 128 |
| Speed Grade | -1 | -2 (faster) | Standard | -1 | Standard | -1 |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Supply Voltage | 3V-3.6V core, 4.75V-5.25V I/O | 3V-3.6V core, 4.75V-5.25V I/O | 3V-3.6V core, 4.75V-5.25V I/O | 3V-3.6V core, 4.75V-5.25V I/O | 3V-3.6V core, 4.75V-5.25V I/O | 3V-3.6V core, 4.75V-5.25V I/O |
| Programming Technology | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) |
| Design Migration Effort | Reference design | None - same die, timing only | None - same die, timing only | None - temp derating review only | Re-fit and timing re-verification | Re-fit and timing re-verification |
主要差異化特點
- Identical die with faster speed grade available (對比A54SX08-2TQG176I)
- Industrial temperature rating (對比A54SX08-1TQG176)
- Lowest-cost footprint-stable option for legacy designs (對比A54SX16-TQG176I)
- 5 V I/O operation eliminated in modern FPGAs (對比Modern SRAM FPGA families)
設計說明
Provide two supply rails: a 3.3 V (3.0-3.6 V) core rail and a 5 V (4.75-5.25 V) I/O rail per Microchip USA data. Decouple each VCC pin pair with 0.1 uF ceramic capacitors placed within 5 mm of the pin, plus bulk 10 uF at the board entry. The VPP/VPCA/VPCB programming pins are used only during antifuse programming; on the production board tie them per the 54SX datasheet programming-pin recommendation (typically grounded through specified networks) and never power them in-system.
The 176-TQFP (24x24 mm) has a 0.5 mm lead pitch; use a 2-layer fan-out or 4-layer board with 5-mil trace/space for escape routing of 128 user I/Os. Place a solid ground plane under the device and flood copper on the signal layers to reduce ground bounce when many 5 V outputs switch simultaneously. The thermal path is through the leads, so generous copper pour on all four sides of the package improves dissipation; at SX08 densities a 4-layer board needs no dedicated heatsink.
The A54SX08-1TQG176I is one-time-programmable: a logic error in a soldered device is unrecoverable. Always run complete post-layout timing simulation in the Actel/Microchip Designer flow and program and functionally test at least one socketed sample before committing a production assembly. Also verify the ordering code suffix carefully - the non-I commercial version (0C to +70C) looks nearly identical on labels but will not meet the -40C to +85C industrial requirement.
When driving 5 V TTL buses from the 128 I/Os, add 22-33 ohm series resistors on lines longer than about 10 cm to damp reflections, since the 5 V-tolerant drivers have fast edges for a 0.35 um process. Keep clock inputs short and route them on an inner layer adjacent to ground. Estimated: with a 50 pF load per output, simultaneous switching of many outputs increases ground bounce - limit concurrent switching groups or spread them across I/O banks.
合規資訊
Compliance status for this specific ordering code is not stated in the verified web data; request a material declaration from Microchip Technology/Microchip USA.
