AS4C256M16D3LC-12BIN - 4Gb DDR3L SDRAM 96-FBGA | Alliance Memory
MPN： AS4C256M16D3LC-12BIN ✓ 啟用中AS4C256M16D3LC-12BIN 概覽
DDR3L SDRAM is a type of dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by about 20% while maintaining similar performance. It is part of the DDR3 family, which uses double data rate architecture to transfer data on both edges of the clock, achieving high bandwidth. DDR3L is commonly used in embedded systems, networking equipment, and industrial applications where power efficiency and reliability are critical.
Key features include an 8-bank architecture, programmable CAS latency, burst lengths of 8 and 4, on-die termination (ODT), and a 20ns row cycle time. The device supports auto-refresh and self-refresh modes, and includes a temperature sensor for thermal management. The 96-ball FBGA package provides a compact footprint suitable for space-constrained designs.
Technically, the AS4C256M16D3LC-12BIN uses a high-speed CMOS process and features a 16-bit data bus, achieving data rates up to 1600 Mbps per pin. It operates from a single 1.35V supply, with an I/O voltage of 1.35V, and is compatible with JEDEC DDR3L standards. The device includes programmable read and write latencies, and supports DLL (Delay-Locked Loop) for precise timing.
Typical applications include embedded computing, industrial PCs, networking routers, and automotive infotainment systems. Its low voltage and industrial temperature range make it ideal for harsh environments. The device is also suitable for high-reliability systems requiring long-term availability.
When designing with this memory, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to minimize signal integrity issues. The device requires a stable 1.35V supply and careful termination of the data and address lines.
直接替換替代品，適用於 AS4C256M16D3LC-12BIN — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： AS4C256M16D3LC-12BIN （相同外形與佔位） — 差異在於 Access Time, CAS Latency, Memory Size, Package, Memory Type.
AS4C256M16D3LC-12BAN
✅ 直接替換📋 參考替代品（不在目錄中）
AS4C256M16D3L-12BINTR
✅ 直接替換📋 參考替代品（不在目錄中）
AS4C256M16D3C-12BIN
⚡ 相同封裝📋 參考替代品（不在目錄中）
AS4C256M16D3B-12BCN
⚡ 相同封裝📋 參考替代品（不在目錄中）
MT41K256M16HA-125
✅ 直接替換 ⚠️ 規格未經驗證✗ 缺貨
$6.3636 / 單位
查看資料表 →IS43TR16512B-125KBLI
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
AS4C256M16D3LC-12BIN 最大額定值與電氣特性
| 記憶體類型 | SDRAM - DDR3L |
| 記憶體容量 | 4 Gbit |
| 組織 | 256M x 16 |
| 資料匯流排寬度 | 16 bit |
| 供應電壓 | 1.35 V |
| 最大時脈頻率 | 800 MHz |
| Access Time | 20 ns |
| 封裝 / 外殼 | 96-FBGA (7.5x13.5) |
| 安裝方式 | SMD/SMT |
| 工作溫度範圍 | -40°C to +95°C |
| Number of Banks | 8 |
| CAS 延遲 | 11, 12, 13 |
| Burst Length | 8, 4 |
| RoHS | Compliant |
| Product Category | DRAM |
AS4C256M16D3LC-12BIN 腳位配置
| 腳位 A1 | VDD — Power supply (1.35V) |
| 腳位 A2 | DQ0 — Data input/output 0 |
| 腳位 A3 | DQ1 — Data input/output 1 |
| 腳位 A4 | VSS — Ground |
| 腳位 A5 | DQ2 — Data input/output 2 |
| 腳位 A6 | DQ3 — Data input/output 3 |
| 腳位 A7 | VDD — Power supply (1.35V) |
| 腳位 A8 | DQ4 — Data input/output 4 |
| 腳位 A9 | DQ5 — Data input/output 5 |
| 腳位 A10 | VSS — Ground |
| 腳位 A11 | DQ6 — Data input/output 6 |
| 腳位 A12 | DQ7 — Data input/output 7 |
| 腳位 B1 | VSS — Ground |
| 腳位 B2 | DQ8 — Data input/output 8 |
| 腳位 B3 | DQ9 — Data input/output 9 |
| 腳位 B4 | VDD — Power supply (1.35V) |
| 腳位 B5 | DQ10 — Data input/output 10 |
| 腳位 B6 | DQ11 — Data input/output 11 |
| 腳位 B7 | VSS — Ground |
| 腳位 B8 | DQ12 — Data input/output 12 |
| 腳位 B9 | DQ13 — Data input/output 13 |
| 腳位 B10 | VDD — Power supply (1.35V) |
| 腳位 B11 | DQ14 — Data input/output 14 |
| 腳位 B12 | DQ15 — Data input/output 15 |
典型應用
AS4C256M16D3LC-12BIN 適用於 6 應用s: Embedded Computing, Networking Equipment, Industrial Automation, Automotive Infotainment, Medical Devices, Test and Measurement.
Embedded Computing
The AS4C256M16D3LC-12BIN provides high-density, low-power memory for embedded processors and FPGAs. Its 4Gb capacity and 16-bit bus support complex applications like real-time data processing and multitasking. The 1.35V operation reduces power consumption, extending battery life in portable systems. The industrial temperature range ensures reliable operation in harsh environments. With a 800 MHz clock, it delivers high bandwidth for demanding workloads. This memory is ideal for single-board computers, industrial PCs, and IoT gateways.
推薦
Networking Equipment
In networking routers and switches, the AS4C256M16D3LC-12BIN offers high-speed data buffering and packet processing. Its 800 MHz clock and 16-bit bus enable fast data throughput, while the 1.35V supply minimizes heat generation in dense equipment. The 96-FBGA package saves PCB space, allowing compact designs. The industrial temperature range supports outdoor and telecom installations. This memory is suitable for network processors, switches, and firewalls requiring reliable, high-performance memory.
推薦
Industrial Automation
The AS4C256M16D3LC-12BIN is designed for industrial control systems, PLCs, and robotics. Its wide temperature range (-40°C to +95°C) ensures operation in factory floors and outdoor environments. The low 1.35V voltage reduces power dissipation, improving system reliability. The 4Gb density provides ample storage for control algorithms and data logging. The 96-FBGA package is robust for vibration-prone environments. This memory supports real-time processing and high-speed data acquisition in automation systems.
推薦
Automotive Infotainment
In automotive infotainment systems, the AS4C256M16D3LC-12BIN provides high-bandwidth memory for navigation, multimedia, and connectivity features. Its 1.35V operation reduces power consumption, important for vehicle battery life. The industrial temperature range covers automotive cabin environments. The 4Gb capacity supports complex user interfaces and real-time data processing. The 96-FBGA package is compact for space-limited head units. This memory is suitable for car radios, telematics, and advanced driver assistance systems (ADAS) requiring reliable memory.
推薦
Medical Devices
The AS4C256M16D3LC-12BIN is suitable for medical imaging, patient monitoring, and diagnostic equipment. Its low power consumption is critical for battery-operated devices. The industrial temperature range ensures reliable operation in clinical environments. The high density supports large data buffers for image processing. The 800 MHz clock provides fast data transfer for real-time monitoring. The 96-FBGA package is ideal for compact medical devices. This memory meets the reliability requirements of medical electronics.
推薦
Test and Measurement
In test and measurement equipment, the AS4C256M16D3LC-12BIN provides high-speed data acquisition and storage. Its 800 MHz clock enables fast sampling rates, while the 4Gb capacity stores large waveforms. The 1.35V supply reduces heat in benchtop instruments. The industrial temperature range supports lab and field use. The 96-FBGA package is suitable for compact oscilloscopes and analyzers. This memory is ideal for oscilloscopes, logic analyzers, and data loggers requiring high-bandwidth memory.
推薦
推薦產品摘要
工程參考資料，適用於 AS4C256M16D3LC-12BIN — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | AS4C256M16D3LC-12BAN | AS4C256M16D3L-12BINTR | AS4C256M16D3C-12BIN | MT41K256M16HA-125 |
|---|---|---|---|---|---|
| Package | 96-FBGA (7.5x13.5) | 96-FBGA (7.5x13.5) | 96-FBGA (7.5x13.5) | 96-FBGA (7.5x13.5) | 96-FBGA (7.5x13.5) |
| Brand | Alliance Memory | Alliance Memory | Alliance Memory | Alliance Memory | Micron Technology |
| Memory Type | DDR3L | DDR3L | DDR3L | DDR3 | DDR3L |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.5V | 1.35V |
| Clock Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | 0°C to +95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
主要差異化特點
- Industrial temperature range (對比MT41K256M16HA-125)
- Low voltage operation (對比AS4C256M16D3C-12BIN)
- Drop-in replacement availability (對比AS4C256M16D3LC-12BAN)
設計說明
Place 0.1uF decoupling capacitors close to each VDD and VDDQ pin, and a 10uF bulk capacitor near the power entry. Follow the layout guidelines in the Alliance Memory datasheet to minimize trace lengths and ensure signal integrity for high-speed DDR3L signals.
The AS4C256M16D3LC-12BIN operates up to +95°C. Ensure adequate airflow or heatsinking in high-temperature environments. The 1.35V supply reduces power dissipation, but thermal vias under the FBGA package can help conduct heat away from the device.
For DDR3L-1600 operation, maintain controlled impedance of 40-50 ohms for data and address lines. Use series termination resistors (22-33 ohms) near the driver to reduce reflections. Keep the clock and strobe pairs tightly coupled and length-matched to minimize skew.
合規資訊
RoHS compliant per distributor listings. No AEC-Q100 qualification for memory ICs.
