NT5CC256M16CP-DIB1 - 4Gb DDR3L SDRAM 256Mx16 | Nanya
MPN： NT5CC256M16CP-DIB1 ✓ 啟用中NT5CC256M16CP-DIB1 概覽
DDR3L SDRAM is a type of dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption while maintaining high bandwidth. It is part of the memory hierarchy in computing systems, serving as the main system memory for processors, and is widely used in embedded systems, networking equipment, and automotive infotainment.
Key features include a 4Gb density, 16-bit I/O width, 8 internal banks, programmable CAS latency (CL) and write latency (CWL), on-die termination (ODT), and a configurable output drive strength. The device supports a burst length of 8 and a burst chop of 4, with a self-refresh mode for low-power standby. The -DIB1 speed grade indicates DDR3L-1600 with timing parameters of CL=11, CWL=8, and tRCD/tRP=11.
The architecture uses a 70nm process technology, providing a balance of performance and power efficiency. The differential clock inputs and data strobes ensure signal integrity for high-speed operation. The device includes programmable mode registers for flexible configuration, and it supports DLL-off mode for reduced power consumption in low-frequency applications.
Typical applications include solid-state drives (SSDs), network routers, industrial automation controllers, automotive infotainment systems, and embedded computing platforms. The low 1.35V operation makes it ideal for power-sensitive designs, while the industrial and automotive temperature grades ensure reliability in harsh environments.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the PCB layout guidelines for DDR3 routing to maintain signal integrity. The device requires a 1.35V supply and a separate VDDQ, with careful attention to the reference voltage (VREF) for the address and control signals.
直接替換替代品，適用於 NT5CC256M16CP-DIB1 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： NT5CC256M16CP-DIB1 （相同外形與佔位） — 差異在於 Package, Data Rate, Supply Voltage, Burst Length, CAS Latency.
NT5CB256M16CP-DII
✅ 直接替換✗ 缺貨
$5.5682 / 單位
查看資料表 →NT5CB256M16CP-DIH
✅ 直接替換聯絡詢價
查看資料表 →NT5CB256M16CP-DI
✅ 直接替換聯絡詢價
查看資料表 →AS4C256M16D3LC-12BIN
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →IS43TR16256A-125KBLA2
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MT41K256M16HA-125IT:E
✅ 直接替換 ⚠️ 規格未經驗證✓ 有庫存
$4.5 / 單位
查看資料表 →NT5CC256M16CP-DIB1 最大額定值與電氣特性
| 記憶體類型 | DDR3L SDRAM |
| Density | 4Gb |
| 組織 | 256M x 16 |
| 供應電壓 | 1.35V |
| 資料速率 | 1600Mbps (DDR3L-1600) |
| 封裝 | TFBGA-96, 9x13mm, 0.8mm pitch |
| Number of Banks | 8 |
| CAS Latency (CL) | 11 |
| Write Latency (CWL) | 8 |
| tRCD/tRP | 11 |
| Burst Length | 8 (BL8) and 4 (BC4) |
| 工作溫度 | 0C to +95C (Tcase) |
| RoHS | Compliant |
| 無鹵素 | Yes |
| Lead Free | Yes |
NT5CC256M16CP-DIB1 腳位配置
| 腳位 A1 | VDD — Power supply (1.35V) |
| 腳位 A2 | VSS — Ground |
| 腳位 A3 | DQ0 — Data input/output 0 |
| 腳位 A4 | DQ1 — Data input/output 1 |
| 腳位 A5 | VDDQ — DQ power supply |
| 腳位 A6 | DQ2 — Data input/output 2 |
| 腳位 A7 | DQ3 — Data input/output 3 |
| 腳位 A8 | VSSQ — DQ ground |
| 腳位 A9 | DQ4 — Data input/output 4 |
| 腳位 A10 | DQ5 — Data input/output 5 |
| 腳位 A11 | VDDQ — DQ power supply |
| 腳位 A12 | DQ6 — Data input/output 6 |
| 腳位 A13 | DQ7 — Data input/output 7 |
| 腳位 A14 | VSS — Ground |
| 腳位 A15 | VDD — Power supply |
典型應用
NT5CC256M16CP-DIB1 適用於 6 應用s: Embedded Computing, Networking Equipment, Automotive Infotainment, Industrial Automation, Solid-State Drives (SSD), Test and Measurement.
Embedded Computing
The NT5CC256M16CP-DIB1 provides 4Gb of DDR3L memory for embedded processors, offering high bandwidth and low power. Its 1.35V operation reduces thermal load, making it suitable for compact industrial PCs and single-board computers. The 256Mx16 organization simplifies board layout with fewer chips, and the industrial temperature range ensures reliability in factory automation and outdoor kiosks.
推薦
Networking Equipment
In routers, switches, and network appliances, the NT5CC256M16CP-DIB1 provides fast packet buffering and routing table storage. Its 1600Mbps data rate supports high-throughput processing, while the low 1.35V supply minimizes power in always-on equipment. The 8 internal banks enable efficient interleaving for reduced latency, and the TFBGA package allows dense PCB layouts in space-constrained line cards.
推薦
Automotive Infotainment
The NT5CC256M16CP-DIB1 is designed for automotive infotainment systems, providing reliable memory for navigation, audio, and display processing. Its automotive temperature grade (-40C to +95C) ensures operation in extreme environments, and the 1.35V supply reduces heat in sealed dashboards. The high bandwidth supports smooth graphics rendering and quick boot times, while the JEDEC compliance ensures compatibility with automotive SoCs.
推薦
Industrial Automation
For PLCs, robotics, and industrial controllers, the NT5CC256M16CP-DIB1 offers robust memory with a wide temperature range and low power consumption. Its 4Gb density supports complex control algorithms and data logging, while the 1.35V operation reduces energy costs in 24/7 operation. The device's reliability in harsh environments makes it suitable for factory floors and outdoor installations.
推薦
Solid-State Drives (SSD)
The NT5CC256M16CP-DIB1 is used as DRAM cache in SSDs, improving random read/write performance and extending flash lifespan. Its high bandwidth and low latency enable fast data buffering, while the 1.35V supply reduces power in portable SSDs. The small TFBGA package allows compact drive designs, and the industrial temperature grade supports enterprise and automotive storage.
推薦
Test and Measurement
In oscilloscopes, signal analyzers, and data acquisition systems, the NT5CC256M16CP-DIB1 provides high-speed data buffering for capturing and processing signals. Its 1600Mbps data rate supports real-time sampling, while the 8 banks enable efficient data interleaving. The low power consumption is beneficial for portable instruments, and the industrial temperature range ensures accuracy in varying environments.
推薦
推薦產品摘要
工程參考資料，適用於 NT5CC256M16CP-DIB1 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | NT5CB256M16CP-DII | AS4C256M16D3LC-12BIN | IS43TR16256A-125KBLA2 |
|---|---|---|---|---|
| Package | TFBGA-96 | TFBGA-96 | TFBGA-96 | TFBGA-96 |
| Brand | Nanya Technology | Nanya Technology | Alliance Memory | ISSI |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1600Mbps | 1866Mbps | 1600Mbps | 1600Mbps |
| CAS Latency | 11 | 13 | 11 | 11 |
| Operating Temperature | 0C to +95C | 0C to +95C | -40C to +95C | -40C to +95C |
主要差異化特點
- Lower voltage operation (對比Standard DDR3 parts)
- Automotive and industrial temperature grades (對比Commercial-only parts)
- High density in a small package (對比Lower density alternatives)
設計說明
For DDR3L routing, maintain 50-ohm single-ended and 100-ohm differential impedance for DQ, DQS, and clock signals. Keep trace lengths matched within 50 mils for each byte lane. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin, and use a solid ground plane beneath the memory device to minimize noise.
The NT5CC256M16CP-DIB1 requires a clean 1.35V supply for VDD and VDDQ. Use a low-dropout regulator or a switching regulator with low ripple (<50mV) to avoid data corruption. Ensure the VREF voltage is set to 0.675V (half of VDDQ) with a precision resistor divider and bypass capacitor.
Although the device operates at 1.35V, it can dissipate significant power during heavy read/write activity. Ensure adequate airflow or a thermal pad on the PCB to keep the case temperature below 95C. For industrial applications, consider derating the data rate if ambient temperatures exceed 85C.
合規資訊
RoHS and halogen-free per datasheet. AEC-Q100 not applicable for DRAM; automotive grade is per Nanya's own qualification.
