ATSAME70Q19B-CN - 300MHz Cortex-M7 MCU 512KB Flash | Microchip
MPN： ATSAME70Q19B-CN ✓ 啟用中ATSAME70Q19B-CN 概覽
An ARM Cortex-M7 microcontroller is a 32-bit RISC processor core designed for embedded applications requiring high computational throughput, deterministic interrupt latency, and DSP-class signal processing. The M7 architecture supersedes earlier Cortex-M4/M3 cores by adding a six-stage superscalar pipeline, dual-issue capability, branch prediction, and a single-precision FPU that together deliver roughly twice the CoreMark/mW efficiency of an M4. Within Microchip's wider hierarchy, the SAM E70 series sits between the Cortex-M4-based SAM S70/SAM E70 siblings and the Cortex-M7 high-end portfolio, bridging motor control, industrial automation, and high-speed connectivity.
Key features include 300MHz core frequency, 512KB Flash with ECC, 256KB SRAM, an integrated 12-bit ADC, a 12-bit DAC, multiple UART/SPI/TWI interfaces, HS USB, dual CAN-FD controllers, and an Ethernet MAC. The 144-LFBGA package provides a small footprint suitable for space-constrained designs while exposing a rich peripheral set for system integration. The device operates from a 1.2V internal core supply with wide I/O tolerance.
Architecturally, the SAME70Q19B-CN uses the M7's tightly-coupled memory (TCM) interface with configurable wait states, supports cryptographic accelerators in related family members, and integrates a high-speed bus matrix. Performance analysis shows the device achieves over 1500 CoreMark while maintaining deterministic interrupt response under 12 cycles, making it suitable for hard-real-time control loops.
Typical applications include industrial motor control (BLDC/PMSM drives), factory automation PLCs, automotive body and chassis subsystems, audio processing with the integrated DAC, high-speed connectivity gateways, and graphical HMI terminals. Designers appreciate the SAM E70 family for offering Cortex-M7 performance with mature Microchip ecosystem support (MPLAB X, Harmony 3, ASF).
When designing with this device, ensure the PCB layout adheres to the LFBGA-144 escape routing guidelines and that the 1.2V core is supplied by an internal LDO that requires adequate bulk capacitance on VDDCORE pins. Decoupling must follow the reference schematic in the datasheet.
This page synthesizes distributor pricing, drop-in alternatives within the SAME70 family, and practical design notes that complement the Microchip datasheet with cross-brand sourcing intelligence.
直接替換替代品，適用於 ATSAME70Q19B-CN — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： ATSAME70Q19B-CN （相同外形與佔位） — 差異在於 ADC, Package, USB, Operating Temperature, Ethernet.
ATSAME70Q19A-CN
✅ 直接替換聯絡詢價
查看資料表 →ATSAME70Q19B-CNT
✅ 直接替換📋 參考替代品（不在目錄中）
ATSAME70N21B-CN
✅ 直接替換聯絡詢價
查看資料表 →ATSAME70N20A-CN
✅ 直接替換聯絡詢價
查看資料表 →ATSAME70N19B-AN
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ATSAME70Q19B-CN 最大額定值與電氣特性
| Core Architecture | ARM Cortex-M7 with FPU |
| 最大時脈頻率 | 300 MHz |
| Flash Memory | 512 KB (512K x 8) |
| SRAM | 256 KB |
| 封裝 | 144-LFBGA (10x10 mm) |
| Operating Voltage (Core) | 1.2 V |
| 工作溫度 | -40C to +85C (commercial) |
| ADC | 12-bit |
| DAC | 12-bit |
| CAN-FD | 2 controllers |
| USB | High-Speed USB |
| Ethernet | 10/100 MAC |
| 安裝類型 | Surface Mount (BGA) |
| MSL 等級 | 3 (per JEDEC J-STD-020) |
| RoHS 狀態 | Compliant |
ATSAME70Q19B-CN 144-lfbga (10x10 mm) 腳位配置指南
ATSAME70Q19B-CN（144-lfbga (10x10 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： ATSAME70Q19B-CN.
請參閱 資料表 以查看完整腳位配置。
典型應用
ATSAME70Q19B-CN 適用於 6 應用s: Industrial Motor Control (BLDC / PMSM Drives), Industrial Automation PLCs and Gateways, Automotive Body and Chassis ECUs, Audio Processing with Integrated DAC, High-Speed Connectivity Gateways, Graphical HMI Terminals.
Industrial Motor Control (BLDC / PMSM Drives)
The ATSAME70Q19B-CN is well-suited for industrial BLDC and PMSM motor control where 300MHz Cortex-M7 performance drives field-oriented control (FOC) algorithms in real time. Its dual CAN-FD controllers enable multi-axis coordination across factory floor drives, while the 12-bit ADC with up to 24 channels samples phase currents at sufficient rates for sinusoidal commutation. Unlike Cortex-M4-based MCUs, the M7's dual-issue pipeline and hardware FPU accelerate Park/Clarke transforms so the same 300MHz budget leaves margin for predictive maintenance diagnostics. The 144-LFBGA footprint is small enough to fit inside an integrated servo drive enclosure, and the SAM E70 family's deterministic 12-cycle interrupt latency ensures the FOC loop closes within a single PWM period at 20kHz switching frequency.
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Industrial Automation PLCs and Gateways
In PLC and industrial gateway designs, the ATSAME70Q19B-CN integrates Ethernet MAC, dual CAN-FD, and HS USB so it can terminate fieldbus and industrial Ethernet protocols in a single IC. The 300MHz Cortex-M7 runs full protocol stacks (Modbus TCP, EtherCAT slave, CANopen) while leaving headroom for IEC 61131-3 soft-PLC runtimes. The 256KB SRAM and 512KB Flash accommodate binary ladder-logic images plus firmware updates via Microchip's dual-bank OTA boot scheme. Drop-in compatibility with the ATSAME70N21B-CN enables the same hardware platform to scale from 512KB Flash up to 2MB Flash when customers need richer protocol support. The 144-LFBGA package fits 4-layer PCBs typical of compact industrial controllers without requiring HDI stackups.
推薦
Automotive Body and Chassis ECUs
The ATSAME70Q19B-CN powers automotive body and chassis ECUs such as body control modules, HVAC controllers, and lighting drivers. Its dual CAN-FD interfaces terminate modern vehicle networks at 5 Mbps while supporting backward compatibility with classical CAN 2.0B. The 300MHz Cortex-M7 runs AUTOSAR-style real-time kernels, and the 512KB Flash with ECC plus 256KB SRAM support OTA firmware updates and diagnostic service handlers (UDS/KWP2000). While the ATSAME70Q19B-CN is not AEC-Q100 qualified (the automotive -AN/-MBN suffix variants are), it serves as the engineering reference for designing the AEC-Q100 qualified derivatives. The 144-LFBGA package withstands automotive thermal and vibration profiles when paired with appropriate underfill.
推薦
Audio Processing with Integrated DAC
The ATSAME70Q19B-CN drives cost-sensitive audio applications via its integrated 12-bit DAC running at up to 1 MSPS, suitable for voice prompts, beep generators, and entry-level DAC line outputs. The Cortex-M7 DSP extensions accelerate FFT-based audio processing and FIR filtering without burdening the CPU. Combined with HS USB, the device doubles as a USB audio streaming endpoint at 48kHz/16-bit. The 256KB SRAM serves as audio buffer space for multiple simultaneous streams. Designers appreciate that the SAM E70 family audio middleware in MPLAB Harmony 3 abstracts the I2S/TDM interfaces used for external CODECs, allowing software reuse from the SAME70 Xplained Ultra reference design.
推薦
High-Speed Connectivity Gateways
The ATSAME70Q19B-CN serves as the protocol-conversion brain of connectivity gateways bridging CAN-FD, Ethernet, HS USB, and UART buses. Its 300MHz Cortex-M7 with FPU handles protocol parsing and routing without offloading to a host processor. The 144-LFBGA package integrates this connectivity in a small footprint suitable for DIN-rail gateway enclosures. The 256KB SRAM buffers transient message bursts between buses, while the 512KB Flash holds multiple protocol stacks simultaneously. Designers using the SAM E70 family can leverage MPLAB Harmony 3 networking middleware (TCP/IP, MQTT, HTTP) to reduce time-to-market for IoT-edge gateway products.
推薦
Graphical HMI Terminals
The ATSAME70Q19B-CN drives graphical HMI terminals with TFT LCD displays up to WVGA resolution via its external bus interface. The 300MHz Cortex-M7 sustains 60fps UI rendering for menu navigation, gauge animations, and alarm screens. The 256KB SRAM stores framebuffer tiles plus UI state, while 512KB Flash holds icon sets and translations. The integrated 12-bit ADC reads resistive touchscreens and rotary encoders without external components. Compared with Cortex-M4 HMI controllers, the M7's dual-issue pipeline handles JPEG decode and vector rendering without breaking a sweat. The 144-LFBGA package fits compact HMI panel designs behind 3.5" to 5" displays.
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推薦產品摘要
工程參考資料，適用於 ATSAME70Q19B-CN — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | ATSAME70Q19A-CN | ATSAME70Q19B-CNT | ATSAME70N21B-CN | ATSAME70N20A-CN | ATSAME70N19B-AN |
|---|---|---|---|---|---|---|
| Package | 144-LFBGA (10x10) | 144-LFBGA (10x10) - same | 144-LFBGA (10x10) - same | 144-LFBGA (10x10) - same | 144-LFBGA (10x10) - same | 144-LFBGA (10x10) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU |
| Maximum Clock Frequency | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 2 MB | 1 MB | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 384 KB | 256 KB | 256 KB |
| Silicon Revision | B | A | B | B | A | B |
| Packaging Form | Tray | Tray | Tape & Reel | Tray | Tray | Tray |
主要差異化特點
- B-silicon revision with errata fixes versus A-revision (對比ATSAME70Q19A-CN)
- Lower unit cost and 256KB SRAM fit versus N21 family (對比ATSAME70N21B-CN)
- Standard 144-LFBGA footprint versus QFP variant (對比ATSAME70N19B-AN)
設計說明
The 144-LFBGA package uses 0.8 mm ball pitch. PCB escape routing requires microvia HDI stackup or dog-bone fanout on the top layer; 4-layer PCBs without HDI risk signal integrity loss on high-speed traces. Match the BGA pad diameter and NSMD land pattern to Microchip's reference design. Use a reflow profile consistent with MSL-3 moisture sensitivity (JEDEC J-STD-020).
The 1.2V core is supplied by an internal LDO fed from VDDCORE pins. Place 100nF decoupling capacitors adjacent to every VDDCORE/VDDIO pair and a 4.7uF bulk capacitor on the main VDD rail. Estimated: at 300MHz active CPU, core current peaks at ~120 mA, so the LDO must dissipate (VIN-1.2V) * 0.12A = roughly 0.5W at VIN=5V. Provide adequate copper pour or thermal vias under the die area.
For HS USB and Ethernet signals, maintain 90-ohm differential impedance on the USB pair and 100-ohm on the Ethernet pair. Keep high-speed traces short and reference them to a continuous ground plane. Series ferrite beads on VDDIO near the PHY area reduce common-mode emissions.
Do not confuse the commercial ATSAME70Q19B-CN with the industrial ATSAME70Q19B-MN or automotive AEC-Q100 qualified variants - the operating temperature range and qualification status differ. Also, the A-silicon (ATSAME70Q19A-CN) and B-silicon (ATSAME70Q19B-CN) revisions differ in errata status; review the silicon errata document before committing to a revision in production.
Place the 12 MHz crystal as close as possible to the XIN/XOUT pins with short, symmetric traces surrounded by a ground guard ring. The PLL input impedance is sensitive to stray capacitance; route the crystal traces over a continuous ground plane and avoid crossing other signal traces.
合規資訊
RoHS and REACH compliant per Microchip product page. The ATSAME70Q19B-CN is the commercial -CN variant (not AEC-Q100 qualified); for automotive applications use the ATSAME70Q19B-MN industrial-grade or ATSAME70Q19B-AN/-MBN AEC-Q100 qualified variants.
