ATSAMHA1G14A-MBT-BVAO - Automotive LIN SiP MCU 32KB Flash | Microchip
MPN： ATSAMHA1G14A-MBT-BVAO ✓ 啟用中ATSAMHA1G14A-MBT-BVAO 概覽
A System-in-Package (SiP) is a single component that integrates multiple bare dies into one molded package, allowing the combined silicon to behave like one IC. In the ATSAMHA1G14A-MBT-BVAO the MCU die, LIN SBC (System Basis Chip) die, and LDO die are co-packaged, saving PCB area and BOM cost versus a discrete MCU plus external LIN transceiver design. The SAM HA1 family sits within the broader Automotive MCU hierarchy: Cortex-M0+ -> SAM family -> SAM HA1 sub-family -> automotive body-comfort SiPs.
Key features of this part include a -40C to +105C (or +125C) operating temperature range, integrated LIN 2.x/SAE J2602 transceiver, integrated 5V or 3.3V LDO, up to 48 MHz Cortex-M0+ core, and 16 KB Flash. The exposed-pad VQFN-48 (7x7 mm) package provides a low thermal resistance path, essential for automotive under-hood and body-control environments. FuSa documentation supports ISO 26262 system-level integration.
Architecturally the device couples the Cortex-M0+ core's Thumb-2 instruction efficiency with a peripheral set that includes timers, ADC, I2C, SPI, USART, and a LIN-capable UART. The integrated LIN SBC handles bus dominant/recessive state decoding, slope control, and thermal shutdown, reducing firmware load.
Typical applications include automotive body control modules, HVAC control panels, seat-control switches, mirror adjusters, lighting nodes (LIN-driven), and wiper/door modules. The wide operating range also suits industrial sensor nodes and HVAC fan controllers. When designing with this SiP, follow Microchip's LIN SBC layout guidelines: keep the LIN bus trace short, place a reverse-polarity and TVS protection diode near the bus pin, and provide a stable VBAT input with bulk decoupling of at least 10 uF plus 100 nF close to the VLIN pin.
直接替換替代品，適用於 ATSAMHA1G14A-MBT-BVAO — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： ATSAMHA1G14A-MBT-BVAO （相同外形與佔位） — 差異在於 Package, Operating Temperature, Automotive Qualification, Core Processor, Functional Safety.
ATSAMHA1G14A-MBT
✅ 直接替換聯絡詢價
查看資料表 →ATSAMHA1E15A-MBT-BVAO
✅ 直接替換聯絡詢價
查看資料表 →ATSAMHA0G16A-MZT-BVAO
✅ 直接替換聯絡詢價
查看資料表 →ATSAMDA1G14B-MBT
✅ 直接替換聯絡詢價
查看資料表 →ATSAMHA1E16A-MBT-BVAO
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ATSAMHA1G14A-MBT-BVAO 最大額定值與電氣特性
| Manufacturer | Microchip Technology |
| Series | SAM HA1, Functional Safety (FuSa), Automotive, AEC-Q100 |
| Core Processor | ARM Cortex-M0+ 32-bit |
| CPU Speed | 48 MHz |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Read-While-Write Data Flash | 0.5 KB |
| SRAM | 4 KB |
| Integrated Peripherals | LIN Transceiver (SBC), Voltage Regulator (LDO) |
| 封裝 | 48-VQFN (7x7 mm) with exposed thermal pad |
| 腳位數 | 48 |
| 工作溫度範圍 | -40C to +105C (automotive grade 1) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| AEC-Q100 Qualification | Qualified (automotive grade) |
| Communication Interfaces | LIN (master/slave), UART, I2C, SPI |
ATSAMHA1G14A-MBT-BVAO 腳位配置
| 腳位 1 | PA00 — GPIO / ADC input / IRQ |
| 腳位 2 | PA01 — GPIO / ADC input |
| 腳位 3 | PA02 — GPIO / ADC input |
| 腳位 4 | GND — Ground |
| 腳位 5 | PA03 — GPIO / ADC input / REF |
| 腳位 6 | PA04 — GPIO / SERCOM0 PAD0 |
| 腳位 7 | PA05 — GPIO / SERCOM0 PAD1 |
| 腳位 8 | PA06 — GPIO / SERCOM0 PAD2 |
| 腳位 9 | PA07 — GPIO / SERCOM0 PAD3 |
| 腳位 10 | PA08 — GPIO / SERCOM1 PAD0 / I2C SDA |
| 腳位 11 | PA09 — GPIO / SERCOM1 PAD1 / I2C SCL |
| 腳位 12 | PA10 — GPIO / SERCOM1 PAD2 |
| 腳位 13 | PA11 — GPIO / SERCOM1 PAD3 |
| 腳位 14 | PA14 — GPIO / SERCOM2 PAD0 |
| 腳位 15 | PA15 — GPIO / SERCOM2 PAD1 |
| 腳位 16 | PA16 — GPIO / SERCOM2 PAD2 / LIN_TX (SBC) |
| 腳位 17 | PA17 — GPIO / SERCOM2 PAD3 / LIN_RX (SBC) |
| 腳位 18 | PA18 — GPIO |
| 腳位 19 | PA19 — GPIO |
| 腳位 20 | VDD — Digital supply output (LDO regulated 3.3V/5V) |
| 腳位 21 | GND — Ground |
| 腳位 22 | PA20 — GPIO |
| 腳位 23 | PA21 — GPIO / RESET |
| 腳位 24 | PA22 — GPIO / TC0 WO[0] |
| 腳位 25 | PA23 — GPIO / TC0 WO[1] |
| 腳位 26 | PA24 — GPIO / TC1 WO[0] |
| 腳位 27 | PA25 — GPIO / TC1 WO[1] |
| 腳位 28 | PA27 — GPIO |
| 腳位 29 | PA28 — GPIO |
| 腳位 30 | PA30 — GPIO / SWCLK |
| 腳位 31 | PA31 — GPIO / SWDIO |
| 腳位 32 | PB00 — GPIO |
| 腳位 33 | PB01 — GPIO |
| 腳位 34 | PB02 — GPIO |
| 腳位 35 | PB03 — GPIO |
| 腳位 36 | VBAT — Battery supply input to integrated SBC |
| 腳位 37 | VLIN — LIN bus line (to vehicle LIN network) |
| 腳位 38 | WAKE — Wake-up input for SBC from sleep mode |
| 腳位 39 | EN — SBC enable control |
| 腳位 40 | TJA1027_NS — No-connect / reserved |
| 腳位 41 | NC — Not connected |
| 腳位 42 | NC — Not connected |
| 腳位 43 | NC — Not connected |
| 腳位 44 | GND — Ground |
| 腳位 45 | NC — Not connected |
| 腳位 46 | NC — Not connected |
| 腳位 47 | NC — Not connected |
| 腳位 48 | EP — Exposed thermal pad - connect to GND |
典型應用
ATSAMHA1G14A-MBT-BVAO 適用於 6 應用s: Automotive Body Control Module, HVAC Control Panel, Seat Control Switch Module, LED Interior Lighting Node, Mirror Adjustment Module, Industrial Sensor Node.
Automotive Body Control Module
The ATSAMHA1G14A-MBT-BVAO is well suited for body control modules because its integrated LIN SBC removes the need for an external TJA1027/MCP2003B transceiver, reducing BOM cost by approximately 30%. With 16 KB Flash and 4 KB SRAM, it can manage switch-matrix debouncing, LED PWM dimming, and door/window state machines while communicating via LIN 2.x to a central BCM. The AEC-Q100 Grade 1 qualification ensures reliable operation at -40C to +105C under-hood thermal exposure.
推薦
HVAC Control Panel
For HVAC control panels the ATSAMHA1G14A-MBT-BVAO combines Cortex-M0+ processing for display/keypad scanning with integrated LIN bus interface for communication to the HVAC ECU. The 48 MHz CPU can service a 7-segment or small LCD driver, drive backlight PWM, and process temperature sensor ADC readings at sub-100 ms intervals. The integrated 5V LDO directly powers external potentiometers and encoder circuits, eliminating the need for a separate voltage regulator IC.
推薦
Seat Control Switch Module
The ATSAMHA1G14A-MBT-BVAO is an ideal LIN slave node for seat-control switch modules in premium vehicle cabins. Its compact 7x7 mm VQFN-48 footprint fits inside the switch housing, while the integrated LIN SBC handles bus collision detection and thermal shutdown for short-to-battery events. The 16 KB Flash can store debounce lookup tables for multi-position memory seat switches and communicates position changes via LIN frames every 20 ms.
推薦
LED Interior Lighting Node
Interior RGB or single-color LED lighting modules benefit from the ATSAMHA1G14A-MBT-BVAO's combination of a Cortex-M0+ with hardware PWM timers and integrated LIN transceiver. The MCU can drive 3-channel 16-bit PWM outputs at 1 kHz update rate for smooth color mixing, while the LIN interface receives brightness/color commands from the central body controller. The automotive qualification ensures reliable operation across the full -40C to +105C ambient range.
推薦
Mirror Adjustment Module
Power-folding mirror modules use the ATSAMHA1G14A-MBT-BVAO with its integrated LIN SBC to control X/Y mirror position motors and fold actuators over a single LIN bus. The MCU's 4 KB SRAM is sufficient for storing last-known mirror position in EPROM emulation, allowing restoration after battery disconnect. The integrated LDO supplies 5V to the H-bridge drivers directly, reducing external components.
推薦
Industrial Sensor Node
In industrial sensor networks the ATSAMHA1G14A-MBT-BVAO's LIN interface can serve as a low-cost RS-485 alternative for short-distance (<40m) sensor bus connections, suitable for factory automation peripherals. The Cortex-M0+ core processes analog sensor data from the integrated ADC and broadcasts measurements via LIN frames. Operating at -40C to +105C it tolerates industrial cabinet temperatures without derating.
推薦
推薦產品摘要
工程參考資料，適用於 ATSAMHA1G14A-MBT-BVAO — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | ATSAMHA1G14A-MBT | ATSAMHA1E15A-MBT-BVAO | ATSAMHA0G16A-MZT-BVAO |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-VQFN (7x7 mm) | 48-VQFN (7x7 mm) - same | 48-VQFN (7x7 mm) - same | 48-VQFN (7x7 mm) - same |
| Flash Memory | 16 KB | 16 KB | 32 KB | 16 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 4 KB |
| CPU Core | Cortex-M0+ | Cortex-M0+ | Cortex-M0+ | Cortex-M0+ |
| Integrated LIN SBC | Yes | Yes | Yes | Yes |
| AEC-Q100 Qualification | Yes (Grade 1) | No (industrial grade) | Yes (Grade 1) | Yes |
| Functional Safety (FuSa) | Yes | Yes | Yes | No |
主要差異化特點
- Integrated LIN SBC with automotive qualification (對比ATSAMDA1G14B-MBT)
- Functional Safety (FuSa) documentation for ISO 26262 (對比ATSAMHA0G16A-MZT-BVAO)
- AEC-Q100 PPAP and full automotive traceability (對比ATSAMHA1G14A-MBT)
設計說明
Place the VBAT bulk capacitor (>=10 uF) and a 100 nF decoupling capacitor as close as possible to the VBAT pin of the integrated SBC. The LIN bus trace should be kept as short as possible (under 50 mm recommended) and routed away from switching nodes to minimize radiated emissions. The exposed thermal pad must be soldered to a contiguous copper pour connected to GND - this is both the primary heat dissipation path and the low-impedance ground reference for the LIN SBC.
Always include a reverse-polarity protection diode (e.g., SS34) and a TVS diode (e.g., SMBJ24CA) on the VBAT input to protect the integrated SBC from load-dump transients (ISO 7637-2). Conformal coating is recommended for harsh-environment applications. Do not assume the integrated 5V/3.3V LDO can supply external loads above its rated current (typically 50-100 mA for the SBC LDO); add an external LDO for higher-current rails.
The LIN bus pin must include a series termination resistor (typically 30 ohm or per LIN SBC datasheet) and a reverse-polarity blocking diode at the bus connector. Keep LIN bus capacitance below 220 pF to meet the LIN 2.x slew-rate requirement of 1-3 V/us. The internal pull-up on the WAKE pin may need an external pull-up to VBAT through a current-limiting resistor for proper wake-up behavior in sleep mode.
Estimated: At VBAT=12V and VOUT=5V with the integrated LDO sourcing 100 mA to external loads, the SBC dissipates approximately 0.7 W. The VQFN-48 (7x7 mm) package has a junction-to-ambient thermal resistance of approximately 30-35 C/W on a standard 4-layer JEDEC test board, resulting in a 21-25 C junction temperature rise above ambient. The integrated MCU core adds typically 50-100 mW at 48 MHz active. Ensure the PCB copper pour is sized to keep junction temperature below 150 C for AEC-Q100 Grade 1 compliance.
合規資訊
AEC-Q100 Grade 1 qualified per automotive SAM HA1 family documentation. PPAP and IMDS documentation available from Microchip. Functional Safety (FuSa) support per ISO 26262 for ASIL-A/ASIL-B integration.
