DSPIC33CK32MP502T-I/2N - 100MHz 16-bit DSC CAN-FD | Microchip
MPN： DSPIC33CK32MP502T-I/2N ✓ 啟用中DSPIC33CK32MP502T-I/2N 概覽
A digital signal controller combines the computational power of a DSP with the peripheral integration and control architecture of a microcontroller. Within the power-management hierarchy, the dsPIC33CK family sits in the embedded processor category: silicon -> semiconductor -> microcontroller/DSC -> digital power and motor-control processing unit. The Modified Harvard architecture with DSP instruction support makes it distinct from general-purpose MCUs.
Key features include DC to 100 MIPS execution, dual-panel Flash enabling Live Update firmware switching, integrated CAN Flexible Data (CAN FD) for modern industrial and automotive networks, three on-chip operational amplifiers and three comparators that reduce external analog component count, and 12-bit ADCs feeding high-resolution PWM peripherals for digital power conversion. The Functional Safety (FuSa) documentation package supports IEC 61508-class developments.
Technically, the dsPIC33CK core uses DSP engine instructions, four DMA channels, and memory built-in self-test (MBIST) on the SRAM. The high-resolution PWM with fine edge placement achieves switching frequencies suited to LLC, totem-pole PFC, and synchronous buck topologies with effective resolutions beyond standard 16-bit counters.
Typical applications include digital switched-mode power supplies, brushless DC and PMSM motor control with sensorless field-oriented control, power-factor-correction stages, and advanced sensing nodes on CAN FD networks.
For design, maintain the 3.0V to 3.6V supply range and place 0.1 uF decoupling on every VDD pin pair; use the dual-partition Flash to stage OTA firmware safely.
This page adds distributor pricing, drop-in alternatives, pin-compatible family cross-references, and design notes beyond what the Microchip datasheet alone provides.
直接替換替代品，適用於 DSPIC33CK32MP502T-I/2N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： DSPIC33CK32MP502T-I/2N （相同外形與佔位） — 差異在於 Operating Temperature, Package, Data SRAM, Core, Architecture.
DSPIC33CK32MC102T-I/2N
✅ 直接替換聯絡詢價
查看資料表 →DSPIC33CK128MP202T-I/2N
✅ 直接替換聯絡詢價
查看資料表 →DSPIC33CK64MP502T-I/2N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →DSPIC33CK32MP502-I/2N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →DSPIC33CK32MP502T-E/2N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
DSPIC33CK32MP502T-I/2N 最大額定值與電氣特性
| Core | dsPIC33CK 16-bit DSC core |
| CPU Speed | 100 MHz (DC to 100 MIPS) |
| Program Flash | 32 KB with ECC and dual-partition Live Update |
| Data SRAM | 8 KB with MBIST |
| Operating Voltage | 3.0 V to 3.6 V |
| 工作溫度 | -40C to +150C |
| 封裝 | 28-UQFN (6x6 mm), package code 2N |
| 安裝類型 | Surface Mount |
| Connectivity | CAN FD, I2C, SPI, UART |
| On-chip Op Amps | 3 |
| Comparators | 3 |
| ADC | 12-bit |
| PWM | High-Resolution PWM |
| DMA Channels | 4 |
| Architecture | Modified Harvard, DSP-enhanced |
| Functional Safety | dsPIC33CK FuSa package supported |
| Supply Nominal | 3.3 V |
DSPIC33CK32MP502T-I/2N 28-uqfn (6x6 mm), package code 2n 腳位配置指南
DSPIC33CK32MP502T-I/2N（28-uqfn (6x6 mm), package code 2n 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： DSPIC33CK32MP502T-I/2N.
請參閱 資料表 以查看完整腳位配置。
典型應用
DSPIC33CK32MP502T-I/2N 適用於 6 應用s: Digital Switch-Mode Power Supplies, BLDC and PMSM Motor Control, Power Factor Correction Stages, CAN FD Industrial Networking Nodes, Advanced Sensing and Control Systems, Wireless Charging and Battery Chargers.
Digital Switch-Mode Power Supplies
The DSPIC33CK32MP502T-I/2N fits digital SMPS designs because its high-resolution PWM delivers fine duty-cycle and phase resolution for LLC, totem-pole PFC, and synchronous buck topologies, while the 12-bit ADC samples voltage and current feedback with the precision needed for tight regulation. The three on-chip op amps condition shunt-current signals directly, and three comparators provide hardware cycle-by-cycle overcurrent shutdown without CPU latency, protecting power stages during faults. In a typical 3.3V-supplied design, the 100 MIPS core executes the compensation loop far faster than the switching frequency, leaving headroom for telemetry and housekeeping tasks. Dual-partition Flash with Live Update lets firmware be upgraded in the field without stopping the converter, an important serviceability feature for deployed power infrastructure.
推薦
BLDC and PMSM Motor Control
Sensorless field-oriented control of brushless DC and permanent-magnet synchronous motors is a core use case for the DSPIC33CK32MP502T-I/2N. The 100 MHz 16-bit DSP core executes FOC current loops with single-cycle multiply-accumulate instructions, sustaining loop rates well above typical 20-50 kHz PWM frequencies. The high-resolution PWM generates precisely placed complementary edges for three-phase inverters, while the integrated op amps amplify low-side shunt currents and the comparators implement fast overcurrent trip. The 12-bit ADC synchronizes phase-current sampling to PWM centers to avoid switching noise, improving torque-loop accuracy. Three-phase inverter boards benefit from the compact 6x6 mm UQFN package, which fits dense gate-driver layouts, and CAN FD connects the drive to higher-level industrial or vehicle networks.
推薦
Power Factor Correction Stages
Active power-factor-correction circuits demand fast current-shaping loops, which the DSPIC33CK32MP502T-I/2N delivers with its 100 MIPS core and high-resolution PWM. In boost-PFC or totem-pole PFC designs, the controller samples input voltage, inductor current, and bus voltage through the 12-bit ADC each switching cycle, computing duty updates that force the input current to track the rectified line waveform for power factors above 0.99. The three analog comparators provide instant overcurrent protection for inrush and short-circuit events, independent of firmware timing. Because the part runs from a single 3.3V rail over 3.0V to 3.6V, it integrates cleanly into the auxiliary bias supply, and its CAN FD interface reports PFC health metrics to system supervisors in server and telecom power shelves.
推薦
CAN FD Industrial Networking Nodes
With an integrated CAN Flexible Data controller, the DSPIC33CK32MP502T-I/2N serves as an intelligent end node in industrial and automotive-adjacent networks that require higher data-phase bandwidth than classical CAN provides. The 100 MHz core handles CAN FD framing, application protocol stacks, and local control loops concurrently, while four DMA channels move message payloads between the CAN peripheral and SRAM without CPU intervention, keeping jitter low. Its 32 KB ECC Flash with dual-partition Live Update supports field firmware updates over the network safely, and the SRAM MBIST supports functional-safety analysis per the dsPIC33CK FuSa package. Typical nodes include sensor aggregators, actuator controllers, and gateways bridging CAN FD to I2C or UART-based peripherals.
推薦
Advanced Sensing and Control Systems
The DSPIC33CK32MP502T-I/2N suits advanced sensing nodes where analog signal conditioning and digital processing must coexist on one chip. Three operational amplifiers can be configured as gain stages or filters for sensor front ends, the three comparators implement window thresholds for fast event detection, and the 12-bit ADC digitizes results with selectable timing control. The 100 MHz DSP core applies filtering algorithms such as IIR/FIR or FFT-based analysis in real time, benefiting vibration, acoustic, and current-signature monitoring systems. The Modified Harvard architecture keeps instruction and data fetches concurrent, sustaining deterministic sampling behavior. Dual-partition Flash enables algorithm updates in deployed instruments, while the small 6x6 mm UQFN package allows the sensing electronics to be placed close to the transducer.
推薦
Wireless Charging and Battery Chargers
Wireless power transmitters and smart battery chargers require precisely controlled resonant converters with fast protection, a combination the DSPIC33CK32MP502T-I/2N addresses well. The high-resolution PWM adjusts operating frequency and phase of the resonant half-bridge to regulate power transfer and manage foreign-object detection algorithms running on the 100 MHz core. The 12-bit ADC monitors coil current, temperature via NTC inputs, and battery voltage, while comparators enforce hard overcurrent and overtemperature limits in hardware. Three op amps reduce external conditioning components around shunt sensors, cutting BOM cost in consumer charger form factors. The compact 28-UQFN (6x6 mm) footprint and 3.3V single supply fit tightly integrated charger PCBs, and Live Update firmware supports evolving wireless power standards post-deployment.
推薦
推薦產品摘要
工程參考資料，適用於 DSPIC33CK32MP502T-I/2N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | DSPIC33CK32MC102T-I/2N | DSPIC33CK128MP202T-I/2N | DSPIC33CK64MP502T-I/2N |
|---|---|---|---|---|
| Package | 28-UQFN (6x6, 2N) | 28-UQFN (6x6, 2N) - same | 28-UQFN (6x6, 2N) - same | 28-UQFN (6x6, 2N) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Program Flash | 32 KB (ECC, dual partition) | 32 KB | 128 KB | 64 KB |
| CAN FD | Yes | Yes | Yes | Yes |
主要差異化特點
- Integrated analog front end (3 op amps, 3 comparators) (對比DSPIC33CK128MP202T-I/2N)
- Memory headroom on identical footprint (對比DSPIC33CK64MP502T-I/2N)
- Tape-and-reel flow for automated production (對比DSPIC33CK32MP502-I/2N)
設計說明
The 28-UQFN (2N) has a small pitch and central thermal pad. Place at least one 0.1 uF ceramic decoupling capacitor within 2 mm of each VDD/VSS pair, and connect the exposed pad to a solid ground plane through a 3x3 via array for both heat dissipation and ground return. Keep the CAN FD transceiver within 20 mm of the CANTX/CANRX pins with a series resistor matched to the transceiver datasheet recommendation to control ringing.
Supply must remain within 3.0V to 3.6V. In digital power converters, keep the DSC's 3.3V rail isolated from switching-node noise using an LDO or filtered buck output, and add a bulk 10 uF capacitor near the UQFN in addition to the 0.1 uF decouplers. Estimated: a 100 MHz core drawing tens of milliamps produces only a few millivolts of drop at 0.1 ohm rail impedance, but PWM pin transient currents can inject noise into the ADC reference, so route AVDD/ANALOG supplies separately where the layout allows.
Do not assume package-code compatibility across suffixes: /2N (UQFN 6x6) and /SS (SSOP) are the same die but NOT the same footprint, so a layout change is required. When using Live Update, verify that both Flash partitions are erased and programmed before activating the swap; a partial panel write can brick the unit in the field. Finally, confirm the compiler device selection matches the exact MPN in MPLAB X, since MC-series and MP-series register maps differ for op amps and high-resolution PWM.
合規資訊
The -I temperature suffix with tape-and-reel Microchip standard flow is lead-free per Microchip naming convention. RoHS/REACH status not stated in the retrieved web data - confirm on the Microchip product page.
