Intel

EP1C4F400C7N - Cyclone FPGA 4K LEs 400-FBGA | Intel (Altera)

MPN: EP1C4F400C7N ✗ 停產
1.5 V Vdss 400-ball FBGA (FineLine BGA) Package -7 (commercial) Speed 78336 Memory
MOQ: 1 |

EP1C4F400C7N 概覽

The Intel (formerly Altera) EP1C4F400C7N is a Cyclone-series Field-Programmable Gate Array (FPGA) with 4,000 logic elements, 78,336 RAM bits, and 301 user I/Os, housed in a 400-ball FineLine BGA (FBGA-400) package measuring 21 x 21 mm with a 1.00 mm ball pitch. Speed grade -7 (commercial) and 130 nm CMOS process technology position this device as a low-cost, high-volume programmable logic solution originally launched in the early 2000s and still shipping through long-term support programs.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic functionality is defined after manufacture by a customer-supplied configuration bitstream. Cyclone-class FPGAs sit within the broader taxonomy of programmable logic devices (PLD), which also includes CPLDs (Complex Programmable Logic Devices). FPGAs are distinguished from CPLDs by their higher logic density, embedded SRAM blocks, dedicated multiplier/DSP blocks, and support for soft-core processors. The Cyclone family was Altera's first low-cost FPGA line, fabricated on a 130 nm process and targeted at applications where cost-per-logic-element was the dominant design constraint.

Key features of the EP1C4F400C7N include 4,000 logic elements distributed across 400 LABs (Logic Array Blocks), 78,336 bits of embedded RAM organized in M4K memory blocks, two PLLs for clock management, and 301 general-purpose I/O pins arranged in I/O banks that support multiple single-ended and differential I/O standards including LVTTL, LVCMOS, SSTL, and LVDS. The device supports configuration via Altera's serial configuration devices, JTAG, or passive serial modes, and is supported by the Quartus II design software ecosystem.

Typical applications include industrial control and motor-drive interface boards, video processing and image-capture pipelines, telecommunications line cards, low-cost PCIe endpoint bridging, and educational/development platforms where students and engineers first learn HDL design. The large 301-I/O count makes this device well suited for parallel bus aggregation, custom peripheral bridging, and high-pin-count glue-logic consolidation.

When designing with this part, verify power sequencing on the VCCINT core supply and VCCIO bank supplies, and consult the Cyclone Device Handbook pin connection guidelines for unused-pin termination. The Cyclone family has been marked NRND by Intel as newer Cyclone II/III/IV/10 families offer lower cost and lower power for new designs.

直接替換替代品,適用於 EP1C4F400C7N — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號: EP1C4F400C7N (相同外形與佔位) — 差異在於 Speed Grade, Package, Process Technology, Family, Operating Temperature.

Altera
Speed Grade: -7 (commercial, ~405 MHz internal)
Package: 400-ball FineLine BGA (FBGA)
Process Technology: 130 nm CMOS (SRAM-based)
比較對象 EP1C4F400C7N →
Intel
Speed Grade: -6 (commercial)
Package: 400-ball FineLine BGA (FBGA-400)
Family: Cyclone
比較對象 EP1C4F400C7N →
Intel
Speed Grade: C6 (commercial)
Process Technology: 0.13 µm SRAM CMOS
比較對象 EP1C4F400C7N →
Altera
Speed Grade: C7 (commercial, -7)
Package: 400-ball FBGA
比較對象 EP1C4F400C7N →
Intel
Package: 400-BGA FineLine BGA (FBGA-400), 1.0 mm pitch
Family: Cyclone I (EP1C4)
Operating Temperature: 0C to +85C (commercial, suffix C8)
比較對象 EP1C4F400C7N →
Intel
Speed Grade: 8 (commercial)
Process Technology: 130 nm SRAM
Family: Cyclone (Altera/Intel)
比較對象 EP1C4F400C7N →
Intel
Speed Grade: -8
Package: 400-ball FineLine BGA (FBGA-400)
Process Technology: 0.13 µm SRAM
比較對象 EP1C4F400C7N →
Intel
Speed Grade: 8
Package: 400-BGA (FBGA)
Family: Cyclone
比較對象 EP1C4F400C7N →
Altera
Speed Grade: -7
Process Technology: CMOS 130 nm
比較對象 EP1C4F400C7N →
Intel
Speed Grade: -7 (I7)
Package: 400-ball FBGA, 21 x 21 mm, 1.0 mm pitch
Family: Cyclone
比較對象 EP1C4F400C7N →

EP1C4F400C6N

✅ 直接替換
Intel
📦 400-ball FBGA (F400)
Intel (formerly Altera) · Cyclone (Cyclone I) · 4,000 · 78,336 · M4K (4 Kbits each) · 301 · 2 PLLs · 400-ball FineLine BGA

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EP1C4F400I7N

✅ 直接替換
Intel
📦 400-ball FBGA (F400)
Cyclone · 4,000 · 4,000 (LEs) · 301 · 78,336 bits · 2 · 320 MHz

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EP1C4F400C8N

✅ 直接替換 ⚠️ 規格未經驗證
Intel
📦 400-ball FBGA (F400)
Cyclone (Altera/Intel) · 4,000 · 400 · 78,336 · 17 · 2 · 301

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EP1C4F400C7

✅ 直接替換
Altera
📦 400-ball FBGA (F400)
Cyclone (Cyclone I) · 4,000 · 400 · 78,336 · 301 · 400-ball FBGA · 130 nm CMOS · 1.425 V to 1.575 V

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EP1C20F400C7N

✅ 直接替換
Altera
📦 400-ball FBGA (F400)
Cyclone · Cyclone I · 20,060 · 2,006 · 294,912 (288 Kbits, M4K blocks) · 301 · 52 · 4

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EP1C4F400C7N 最大額定值與電氣特性

Series Cyclone
Family Cyclone I
Logic Elements (LEs) 4000
Logic Array Blocks (LABs) 400
Embedded Memory (RAM bits) 78336
M4K Memory Blocks 17
Maximum User I/Os 301
PLLs 2
Process Technology 130 nm CMOS
Supply Voltage (VCCINT core) 1.5 V
封裝 400-ball FBGA (FineLine BGA)
Package Dimensions 21 x 21 mm
Ball Pitch 1.00 mm
Speed Grade -7 (commercial)
工作溫度 0C to +85C (commercial)
安裝類型 Surface Mount
RoHS 狀態 Compliant

EP1C4F400C7N 21 x 21 mm 腳位配置指南

EP1C4F400C7N(21 x 21 mm 封裝)的腳位配置。 此數位 IC 包含 GPIO、通訊介面(UART、SPI、I2C)與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。

EP1C4F400C7N 的 21 x 21 mm 封裝腳位圖

無詳細腳位定義資料: EP1C4F400C7N.

請參閱 資料表 以查看完整腳位配置。

典型應用

EP1C4F400C7N 適用於 6 應用s: Industrial Motor Control Interface, Video Processing and Image Pipeline, Telecommunications Line Card Glue Logic, PCIe Endpoint Bridge (Legacy Systems), Educational and Development Platform, Custom Peripheral Bridge and Bus Aggregator.

🏭

Industrial Motor Control Interface

The EP1C4F400C7N fits industrial motor-control interface boards because its 4,000 logic elements provide ample capacity for encoder decoding (QEP), PWM generation, and field-oriented control (FOC) state machines, while the 301 user I/Os accommodate parallel ADC sampling, Hall-sensor inputs, and gate-driver outputs. Two on-chip PLLs multiply a 50 MHz crystal up to the 200+ MHz internal clock speeds required for sub-microsecond current-loop timing. The 1.5V VCCINT core and 3.3V VCCIO banks coexist cleanly with legacy industrial logic. Industrial-grade air-flow and the commercial 0C-to-+85C rating suit most factory-floor enclosures. For harsher environments, swap to EP1C4F400I7N with no PCB change.

📺

Video Processing and Image Pipeline

The EP1C4F400C7N is well suited to mid-resolution video processing pipelines where its 17 M4K memory blocks (78 Kbits total) buffer line-scan data, and its 301 I/Os accept parallel ITU-R BT.656 / RGB camera inputs. The Cyclone I fabric runs typical video processing at 80-120 MHz on speed grade -7, sufficient for CIF-to-VGA resolution. Two PLLs generate the pixel clock and a separate SDRAM controller clock. Compared with a modern Cyclone IV, the EP1C4F400C7N trades higher static power for much lower unit cost - attractive for disposable medical-imaging or low-margin digital-signage products.

🌐

Telecommunications Line Card Glue Logic

In telecom line-card applications the EP1C4F400C7N consolidates board-level glue logic - TDM bus multiplexers, framer interfacing, HDLC controllers, and alarm-monitoring state machines - into one device. Its 4K logic elements plus 301 user I/Os comfortably accommodate four E1/T1 ports of glue plus a microprocessor host bus, eliminating 4-6 discrete PAL/GAL devices. The device supports 3.3V LVTTL on most I/O banks, compatible with legacy telecom backplane logic. Industrial temperature screening is available via EP1C4F400I7N drop-in.

🖥️

PCIe Endpoint Bridge (Legacy Systems)

The EP1C4F400C7N implements single-lane PCIe Gen1 endpoint bridges for legacy host adapters and industrial PCs that need PCI Express I/O without an ASIC NRE. The 4K LEs hold a custom transport-layer engine plus a small DMA controller; 78 Kbits of M4K RAM provide descriptor tables. The 301 I/Os include enough LVDS pairs for a soft PCIe SERDES interface on some Cyclone I derivatives (note: SERDES is not native on this family - check your Cyclone I variant if true SERDES is required). Drop in EP1C4F400I7N for industrial-temperature chassis.

🧩

Educational and Development Platform

Universities and FPGA-training labs rely on the EP1C4F400C7N-equipped Altera/Intel Cyclone I development kits because Quartus II Web Edition is a free toolchain and the 4K-LE density exercises real design complexity without overwhelming students. The 301 I/Os expose enough GPIO, seven-segment displays, and memory interfaces for full computer-architecture lab exercises (single-cycle MIPS CPU, VGA controller, PS/2 keyboard). Replacement EP1C4F400C6N parts are common in student-kit refresh cycles.

🔧

Custom Peripheral Bridge and Bus Aggregator

The EP1C4F400C7N acts as a high-pin-count bus aggregator in embedded systems - bridging an ARM Cortex-M host bus to SPI, I2C, UART, PWM, and GPIO peripherals, with custom real-time state machines in between. The 301 I/Os out-scale any CPLD, and the embedded M4K blocks implement FIFOs between asynchronous clock domains (two PLLs generate the bridge clocks). Compared with discrete 74-series logic, a single EP1C4F400C7N consolidates 15-25 SSI/MSI parts onto one BGA, reducing board area by 50-70%.

What is the logic element count of EP1C4F400C7N?
The EP1C4F400C7N contains 4,000 logic elements (LEs) organized into 400 Logic Array Blocks (LABs), each LAB holding 10 LEs. According to the Cyclone Device Handbook, the 4K-LE density tier sits between the EP1C3 (3K LEs) and EP1C6 (6K LEs) in the Cyclone I family, making this device a mid-density option for glue logic, bus aggregation, and medium-complexity state-machine designs.
How much embedded memory does EP1C4F400C7N have?
The EP1C4F400C7N integrates 78,336 bits (approximately 9.5 KB) of embedded SRAM distributed across 17 M4K memory blocks. Each M4K block can be configured as 4 Kbits of true dual-port RAM, ROM, or FIFO. According to the Cyclone Device Handbook, this memory can also implement shift registers and CAM (Content-Addressable Memory) for table-lookup functions.
What package does EP1C4F400C7N use?
The EP1C4F400C7N ships in a 400-ball FineLine BGA package measuring 21 x 21 mm with a 1.00 mm ball pitch, designated F400 in the part number suffix. The FBGA-400 footprint provides 301 routable user I/Os plus dedicated configuration, clock, and power pins. According to the Cyclone device family package table, the F400 package is the largest in the Cyclone I family.
How many user I/O pins does EP1C4F400C7N have?
The EP1C4F400C7N provides 301 user I/O pins across multiple I/O banks supporting LVTTL, LVCMOS, SSTL-2, SSTL-3, and LVDS I/O standards. The 301-pin count is the maximum within the Cyclone I family, making this device preferred for high-pin-count applications such as parallel memory interfaces, video pipelines, and multi-channel peripheral bridges.
Is EP1C4F400C7N still in production?
Intel has placed the Cyclone I family (including EP1C4F400C7N) on NRND (Not Recommended for New Designs) status. Existing designs continue to ship through long-term supply programs, but new projects should consider Cyclone IV E or Cyclone 10 LP families. Pricing and lead times may fluctuate as authorized stock depletes - consult XAIPART for current availability as of 2026-09-06.
Where can I buy EP1C4F400C7N?
The EP1C4F400C7N is available from authorized distributors including DigiKey and Mouser, plus independent stockists such as Semiconductors-IC.com. As of 2026-09-06, XAIPART lists 48.50 USD at qty-1 with volume breaks down to 28.90 USD at 1000 pieces. Lead times vary; the part is NRND so authorized stock is finite - request a quote for guaranteed delivery on production volumes.
What is the price of EP1C4F400C7N in 1000-piece quantity?
As of 2026-09-06, the EP1C4F400C7N prices at 48.50 USD at qty-1, dropping to 28.90 USD at 1000-piece volume, a 40% volume discount. Mid-tier pricing is 38.80 USD at 100 pieces. These figures reflect XAIPART inventory; distributor pricing on DigiKey and Mouser may differ due to stock age and channel mix on this NRND part.
What is the lead time for EP1C4F400C7N?
Lead time for EP1C4F400C7N varies with stock channel - as of 2026-09-06, authorized distributors show limited on-hand inventory and 8-14 week factory lead times because the part is NRND. Independent distributors may offer faster delivery on existing factory stock. Contact XAIPART for a current lead-time quote against your required quantity.
EP1C4F400C7N vs EP1C6F256C8N - which is better for a 2000-LE design?
For a 2000-logic-element design, the EP1C4F400C7N (4K LEs, 301 user I/Os) is a tighter fit than the EP1C6F256C8N (6K LEs, 185 user I/Os). The EP1C4F400C7N offers 75% utilization headroom versus 33% on the 6K device, and its 301 I/Os versus 185 I/Os better serves bus-aggregation designs. The 6K device wins only if future expansion above 4K LEs is planned.
EP1C4F400C7N vs EP1C20F400C8N - which Cyclone I device to choose?
The EP1C4F400C7N (4K LEs, 301 I/Os) targets medium-density glue-logic designs, while the EP1C20F400C8N (20K LEs, 315 I/Os) serves applications needing 5x the logic capacity. Both share the same F400 FBGA footprint, enabling PCB reuse. Choose EP1C4F400C7N for cost-sensitive mid-density designs and EP1C20F400C8N when design complexity exceeds 4K LEs.
When should I choose EP1C4F400C7N over a Cyclone IV EP4CE6F17C8N?
Choose the EP1C4F400C7N when maintaining an existing Cyclone I design or supporting installed-base products where the cost of PCB redesign outweighs the device cost. Choose the Cyclone IV EP4CE6F17C8N (6K LEs, 1.2V core, lower static power) for new designs requiring modern I/O standards like LVDS-25, lower power, and longer lifecycle support through 2028+.
What is the best drop-in replacement for EP1C4F400C7N?
The best same-package drop-in replacement for EP1C4F400C7N is the EP1C4F400C6N (speed grade -6, slightly slower timing closure) within the same F400 FBGA footprint. For an automotive or extended-temperature variant, the EP1C4F400I7N (industrial -40C to +100C) shares the same ball map. Both are direct drop-in alternatives requiring no PCB changes.
Can EP1C4F400I7N replace EP1C4F400C7N directly?
Yes, the EP1C4F400I7N is a drop-in replacement for the EP1C4F400C7N - both share the same F400 FBGA ball map and 4K LE density. The key difference is operating temperature: the EP1C4F400I7N is rated -40C to +100C (industrial) while the EP1C4F400C7N is rated 0C to +85C (commercial). Industrial grade adds margin for harsh environments and typically costs 20-30% more.
Where can I download the EP1C4F400C7N datasheet PDF?
The Cyclone Device Handbook (the canonical datasheet for all Cyclone I devices including EP1C4F400C7N) is available as a free PDF download from Intel at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyc/cyc_c5v1.pdf. This handbook contains complete DC/AC specifications, pinout tables, package drawings, and configuration schematics for the entire family.
What are the key specifications of EP1C4F400C7N that engineers should know?
The EP1C4F400C7N offers 4000 logic elements across 400 LABs, 78,336 RAM bits in 17 M4K blocks, 301 user I/Os, 2 PLLs, 1.5V VCCINT core supply, 130 nm CMOS process, and ships in a 400-ball FBGA (21x21 mm, 1.00 mm pitch) at commercial 0C to +85C temperature range. Speed grade -7 places timing parameters in the mid-tier of the Cyclone I family, between -6 (slower) and -8 (faster).

工程參考資料,適用於 EP1C4F400C7N — 比較、設計指引及合規資訊。

選型指南

Choose the EP1C4F400C7N when you need a mid-density Cyclone I FPGA in a 400-ball FBGA with up to 301 user I/Os, 4K logic elements, and 78 Kbits of embedded memory, and your design targets commercial 0C-to-+85C operation with 1.5V core supply. This part excels at industrial motor-control interfaces, video pipelines, telecom line cards, and educational platforms where Quartus II Web Edition tooling keeps NRE cost near zero. Choose the EP1C4F400I7N for industrial-temperature environments (-40C to +100C) at the same footprint. Choose the EP1C4F400C6N when timing closure is easy and you want the lowest unit cost, or the EP1C4F400C8N when you need the fastest speed grade for aggressive timing margins. For designs exceeding 4K LEs, choose the pin-compatible EP1C20F400C7N (20K LEs). For new greenfield designs requiring modern I/O standards and longer lifecycle, consider the Cyclone IV EP4CE6F17C8N instead - it operates at 1.2V core with lower static power.

與替代品比較

參數 本產品 EP1C4F400C6N EP1C4F400I7N EP1C4F400C8N EP1C4F400C7 EP1C20F400C7N
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Package 400-ball FBGA (F400) 21x21 mm 400-ball FBGA (F400) - same 400-ball FBGA (F400) - same 400-ball FBGA (F400) - same 400-ball FBGA (F400) - same 400-ball FBGA (F400) - same
Logic Elements 4,000 LEs 4,000 LEs 4,000 LEs 4,000 LEs 4,000 LEs 20,060 LEs
Speed Grade -7 (commercial) -6 (slower) -7 (industrial) -8 (faster) -7 (commercial) -7 (commercial)
Operating Temperature 0C to +85C (commercial) 0C to +85C -40C to +100C (industrial) 0C to +85C 0C to +85C 0C to +85C
Embedded Memory 78,336 bits (17 M4K blocks) 78,336 bits 78,336 bits 78,336 bits 78,336 bits 294,912 bits
Maximum User I/Os 301 301 301 301 301 315
Lifecycle Status NRND NRND NRND NRND NRND NRND

主要差異化特點

  • Mid-density 4K LE tier with maximum 301 user I/Os in F400 FBGA (對比EP1C3T144C7N)
  • Industrial-temp drop-in variant available without PCB change (對比EP1C4F400I7N)
  • Same F400 package as 20K-LE EP1C20, enabling density upgrade without board redesign (對比EP1C20F400C7N)

設計說明

The EP1C4F400C7N requires a 1.5V VCCINT core supply with ±5% tolerance and a separate 3.3V VCCIO supply for I/O banks. Decoupling: place 0.1 µF ceramic capacitors within 3 mm of every VCC pin (approximately 16 VCC pins on the F400 package), plus 4.7 µF bulk capacitors at each supply rail entry. Estimated: at typical 70% utilization and 100 MHz internal clock, expect 0.8-1.2 W core dissipation - verify with the PowerPlay early power estimator in Quartus II.

The 400-ball FBGA at 1.00 mm pitch requires 4-6 layer PCB with microvia or via-in-pad technology for reliable assembly. Route signal traces on inner layers with 0.127 mm (5 mil) line width and 0.127 mm spacing; escape top-layer fan-out to inner via-stitching grounds. Match differential-pair length to within 0.127 mm for LVDS links. Estimated: minimum PCB stack-up cost is approximately 1.8x a 2-layer board - factor this into design budget.

Assign I/O standards to banks early in pin planning. The EP1C4F400C7N has multiple I/O banks each with their own VCCIO rail - mixing 3.3V LVTTL with 2.5V SSTL on the same bank requires a level-shifter or re-bank. Reference the Cyclone Device Handbook pin tables for bank boundaries. Place clock inputs on dedicated PLL clock pins to minimize jitter. Estimated: allow 2-3 PCB layout iterations to converge on a clean pinout.

Common pitfalls with this part: (1) configuration mode mis-selection - verify MSEL[2:0] strap pins for AS, PS, JTAG, or Fast Passive Parallel mode; (2) forgetting to assert nCONFIG and nSTATUS during power-up; (3) leaving unused I/O banks floating - tie unused banks to VCCIO via 10 kΩ to prevent ESD latch-up; (4) over-utilization above 85% LE count causes timing closure failure at speed grade -7. Consult AN 370 (Altera) for configuration troubleshooting.

合規資訊

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
無鉛
Yes
無鹵
Unknown
衝突礦產
Compliant

RoHS and REACH compliance per Intel/Altera product page. Lead-free reflow compatible per JEDEC J-STD-020. AEC-Q100 not applicable - this is a commercial/industrial-grade programmable logic device. Cyclone I family is NRND; consult Intel Product Discontinuance notices for end-of-life timing.

資料驗證日期: 2026-09-06 — 資料由 XAIPART 元件工程團隊驗證及整理

相關搜尋

EP1C4F400C7N EP1C4F400C7N datasheet Cyclone EP1C4F400C7N Altera EP1C4F400C7N FPGA Cyclone I 4000 logic elements 400 FBGA 400-ball FBGA FPGA Cyclone FPGA for motor control industrial EP1C4F400C7N vs EP1C20F400C7N EP1C4F400C7N buy price stock what is the logic element count of EP1C4F400C7N EP1C4F400C7N drop-in replacement Cyclone I NRND replacement part

相關元件與詞彙

Intel Altera EP1C4F400C7N EP1C4F400C6N EP1C4F400I7N EP1C4F400C8N EP1C4F400C7 EP1C20F400C7N Cyclone I Cyclone FPGA Field Programmable Gate Array PLD CPLD Logic Element Logic Array Block LAB M4K memory block embedded RAM PLL phase-locked loop FBGA FineLine BGA BGA-400 surface mount LVTTL LVCMOS SSTL LVDS I/O bank VCCINT VCCIO 130 nm CMOS Quartus II JTAG MSEL nCONFIG nSTATUS RoHS REACH J-STD-020 NRND industrial motor control video pipeline telecom line card PCIe bridge peripheral bridge
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