EP1K50TI144-2 - 50K-Gate ACEX-1K FPGA, 102 I/O, 144-LQFP | Intel
MPN： EP1K50TI144-2 ✗ 停產EP1K50TI144-2 概覽
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed to implement arbitrary digital logic. ACEX-1K sits within the broader taxonomy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) / FPGAs -> SRAM-based LUT FPGAs -> low-cost FPGAs -> embedded array FPGAs. The EP1K50TI144-2 specifically uses a Look-Up Table (LUT)-based architecture with embedded array blocks (EABs) that support dual-port RAM, ROM, FIFO, and specialized megafunctions, enabling system-on-a-programmable-chip (SOPC) integration.
Key features of the EP1K50TI144-2 include 40,960 RAM bits organized as embedded array blocks, 360 Logic Array Blocks (LABs), and built-in support for LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device also integrates a JTAG boundary-scan test interface compliant with IEEE 1149.1, an in-system programmability (ISP) port, and a dedicated configuration circuitry that accepts bitstreams from EPC configuration PROMs or via passive serial/parallel controllers.
Typical applications for the EP1K50TI144-2 include glue-logic replacement, industrial control interfaces, low-density telecommunications glue logic, and bridge/protocol conversion such as UART-to-PCI or I2C-to-parallel. The 144-LQFP package is hand-solder-friendly and compatible with low-cost PCB fabrication, making it well-suited for prototype runs and legacy system maintenance. Designers migrating to this part should note that ACEX-1K devices in the same 144-pin TQFP/LQFP package are pin-compatible across the family, allowing migration between EP1K10, EP1K30, and EP1K50 density points on the same PCB layout.
This page synthesizes distributor pricing, ACEX-1K family pin-compatible alternatives, and practical design notes for the EP1K50TI144-2 that are not collated in the legacy ACEX 1K Device Family datasheet.
直接替換替代品，適用於 EP1K50TI144-2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1K50TI144-2 （相同外形與佔位） — 差異在於 Package, Speed Grade, Process Technology, Operating Temperature, Configuration Method.
EP1K100TI144-2
✅ 直接替換📋 參考替代品（不在目錄中）
EP1K30TI144-2
✅ 直接替換聯絡詢價
查看資料表 →EP1K10TI144-2
✅ 直接替換聯絡詢價
查看資料表 →EP1K50TC144-2
✅ 直接替換聯絡詢價
查看資料表 →EP1K50TI144-1X
✅ 直接替換聯絡詢價
查看資料表 →EP1K50TI144-2 最大額定值與電氣特性
| Family | ACEX-1K |
| Logic Elements (LEs) | 2,880 |
| Typical Gates | 50,000 |
| Maximum User I/O | 102 |
| Logic Array Blocks (LABs) | 360 |
| Total RAM Bits | 40,960 |
| Core Supply Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) |
| Speed Grade | -2 |
| 工作溫度 | -40 °C to +85 °C (Industrial) |
| 封裝 | 144-LQFP (TQFP-144) |
| 安裝類型 | Surface Mount |
| Process Technology | SRAM-based, 0.18 µm |
| Configuration Method | Passive Serial / Passive Parallel / JTAG |
| JTAG Support | IEEE 1149.1 Boundary Scan |
EP1K50TI144-2 腳位配置
| 腳位 1 | I/O — User I/O pin (bank 1) |
| 腳位 2 | I/O — User I/O pin (bank 1) |
| 腳位 3 | I/O — User I/O pin (bank 1) |
| 腳位 4 | I/O — User I/O pin (bank 1) |
| 腳位 5 | I/O — User I/O pin (bank 1) |
| 腳位 6 | I/O — User I/O pin (bank 1) |
| 腳位 7 | I/O — User I/O pin (bank 1) |
| 腳位 8 | I/O — User I/O pin (bank 1) |
| 腳位 9 | I/O — User I/O pin (bank 1) |
| 腳位 10 | I/O — User I/O pin (bank 1) |
| 腳位 11 | I/O — User I/O pin (bank 1) |
| 腳位 12 | I/O — User I/O pin (bank 1) |
| 腳位 13 | GND — Ground |
| 腳位 14 | VCCINT — Core supply (2.5 V) |
| 腳位 15 | I/O — User I/O pin (bank 2) |
| 腳位 16 | I/O — User I/O pin (bank 2) |
| 腳位 17 | I/O — User I/O pin (bank 2) |
| 腳位 18 | I/O — User I/O pin (bank 2) |
| 腳位 19 | I/O — User I/O pin (bank 2) |
| 腳位 20 | I/O — User I/O pin (bank 2) |
| 腳位 21 | I/O — User I/O pin (bank 2) |
| 腳位 22 | I/O — User I/O pin (bank 2) |
| 腳位 23 | I/O — User I/O pin (bank 2) |
| 腳位 24 | I/O — User I/O pin (bank 2) |
| 腳位 25 | I/O — User I/O pin (bank 2) |
| 腳位 26 | I/O — User I/O pin (bank 2) |
| 腳位 27 | I/O — User I/O pin (bank 2) |
| 腳位 28 | I/O — User I/O pin (bank 2) |
| 腳位 29 | I/O — User I/O pin (bank 2) |
| 腳位 30 | I/O — User I/O pin (bank 2) |
| 腳位 31 | I/O — User I/O pin (bank 2) |
| 腳位 32 | I/O — User I/O pin (bank 2) |
| 腳位 33 | I/O — User I/O pin (bank 2) |
| 腳位 34 | GND — Ground |
| 腳位 35 | VCCINT — Core supply (2.5 V) |
| 腳位 36 | I/O — User I/O pin (bank 3) |
| 腳位 37 | I/O — User I/O pin (bank 3) |
| 腳位 38 | I/O — User I/O pin (bank 3) |
| 腳位 39 | I/O — User I/O pin (bank 3) |
| 腳位 40 | I/O — User I/O pin (bank 3) |
| 腳位 41 | I/O — User I/O pin (bank 3) |
| 腳位 42 | I/O — User I/O pin (bank 3) |
| 腳位 43 | I/O — User I/O pin (bank 3) |
| 腳位 44 | I/O — User I/O pin (bank 3) |
| 腳位 45 | I/O — User I/O pin (bank 3) |
| 腳位 46 | I/O — User I/O pin (bank 3) |
| 腳位 47 | I/O — User I/O pin (bank 3) |
| 腳位 48 | I/O — User I/O pin (bank 3) |
| 腳位 49 | I/O — User I/O pin (bank 3) |
| 腳位 50 | I/O — User I/O pin (bank 3) |
| 腳位 51 | I/O — User I/O pin (bank 3) |
| 腳位 52 | I/O — User I/O pin (bank 3) |
| 腳位 53 | I/O — User I/O pin (bank 3) |
| 腳位 54 | I/O — User I/O pin (bank 3) |
| 腳位 55 | GND — Ground |
| 腳位 56 | VCCINT — Core supply (2.5 V) |
| 腳位 57 | I/O — User I/O pin (bank 4) |
| 腳位 58 | I/O — User I/O pin (bank 4) |
| 腳位 59 | I/O — User I/O pin (bank 4) |
| 腳位 60 | I/O — User I/O pin (bank 4) |
| 腳位 61 | I/O — User I/O pin (bank 4) |
| 腳位 62 | I/O — User I/O pin (bank 4) |
| 腳位 63 | I/O — User I/O pin (bank 4) |
| 腳位 64 | I/O — User I/O pin (bank 4) |
| 腳位 65 | I/O — User I/O pin (bank 4) |
| 腳位 66 | I/O — User I/O pin (bank 4) |
| 腳位 67 | I/O — User I/O pin (bank 4) |
| 腳位 68 | I/O — User I/O pin (bank 4) |
| 腳位 69 | I/O — User I/O pin (bank 4) |
| 腳位 70 | I/O — User I/O pin (bank 4) |
| 腳位 71 | I/O — User I/O pin (bank 4) |
| 腳位 72 | I/O — User I/O pin (bank 4) |
| 腳位 73 | I/O — User I/O pin (bank 4) |
| 腳位 74 | GND — Ground |
| 腳位 75 | VCCINT — Core supply (2.5 V) |
| 腳位 76 | I/O — User I/O pin (bank 5) |
| 腳位 77 | I/O — User I/O pin (bank 5) |
| 腳位 78 | I/O — User I/O pin (bank 5) |
| 腳位 79 | I/O — User I/O pin (bank 5) |
| 腳位 80 | I/O — User I/O pin (bank 5) |
| 腳位 81 | I/O — User I/O pin (bank 5) |
| 腳位 82 | I/O — User I/O pin (bank 5) |
| 腳位 83 | I/O — User I/O pin (bank 5) |
| 腳位 84 | I/O — User I/O pin (bank 5) |
| 腳位 85 | I/O — User I/O pin (bank 5) |
| 腳位 86 | I/O — User I/O pin (bank 5) |
| 腳位 87 | I/O — User I/O pin (bank 5) |
| 腳位 88 | I/O — User I/O pin (bank 5) |
| 腳位 89 | I/O — User I/O pin (bank 5) |
| 腳位 90 | I/O — User I/O pin (bank 5) |
| 腳位 91 | I/O — User I/O pin (bank 5) |
| 腳位 92 | I/O — User I/O pin (bank 5) |
| 腳位 93 | I/O — User I/O pin (bank 5) |
| 腳位 94 | GND — Ground |
| 腳位 95 | VCCINT — Core supply (2.5 V) |
| 腳位 96 | I/O — User I/O pin (bank 6) |
| 腳位 97 | I/O — User I/O pin (bank 6) |
| 腳位 98 | I/O — User I/O pin (bank 6) |
| 腳位 99 | I/O — User I/O pin (bank 6) |
| 腳位 100 | I/O — User I/O pin (bank 6) |
| 腳位 101 | I/O — User I/O pin (bank 6) |
| 腳位 102 | I/O — User I/O pin (bank 6) |
| 腳位 103 | I/O — User I/O pin (bank 6) |
| 腳位 104 | I/O — User I/O pin (bank 6) |
| 腳位 105 | I/O — User I/O pin (bank 6) |
| 腳位 106 | I/O — User I/O pin (bank 6) |
| 腳位 107 | I/O — User I/O pin (bank 6) |
| 腳位 108 | I/O — User I/O pin (bank 6) |
| 腳位 109 | I/O — User I/O pin (bank 6) |
| 腳位 110 | I/O — User I/O pin (bank 6) |
| 腳位 111 | I/O — User I/O pin (bank 6) |
| 腳位 112 | I/O — User I/O pin (bank 6) |
| 腳位 113 | I/O — User I/O pin (bank 6) |
| 腳位 114 | I/O — User I/O pin (bank 6) |
| 腳位 115 | I/O — User I/O pin (bank 6) |
| 腳位 116 | I/O — User I/O pin (bank 6) |
| 腳位 117 | nCONFIG — Configuration control (active-low reset) |
| 腳位 118 | nSTATUS — Configuration status (active-low) |
| 腳位 119 | CONF_DONE — Configuration done (active-high) |
| 腳位 120 | DCLK — Configuration clock input |
| 腳位 121 | DATA0 — Configuration data input (LSB) |
| 腳位 122 | TDI — JTAG test data in |
| 腳位 123 | TMS — JTAG test mode select |
| 腳位 124 | TCK — JTAG test clock |
| 腳位 125 | TDO — JTAG test data out |
| 腳位 126 | MSEL0 — Configuration mode select 0 |
| 腳位 127 | MSEL1 — Configuration mode select 1 |
| 腳位 128 | DEV_CLRn — Device clear (active-low, optional) |
| 腳位 129 | DEV_OE — Device output enable (active-high) |
| 腳位 130 | VCCIO — I/O supply voltage |
| 腳位 131 | GND — Ground |
| 腳位 132 | I/O — User I/O pin (bank 1) |
| 腳位 133 | I/O — User I/O pin (bank 1) |
| 腳位 134 | I/O — User I/O pin (bank 1) |
| 腳位 135 | I/O — User I/O pin (bank 1) |
| 腳位 136 | I/O — User I/O pin (bank 1) |
| 腳位 137 | I/O — User I/O pin (bank 1) |
| 腳位 138 | I/O — User I/O pin (bank 1) |
| 腳位 139 | I/O — User I/O pin (bank 1) |
| 腳位 140 | I/O — User I/O pin (bank 1) |
| 腳位 141 | I/O — User I/O pin (bank 1) |
| 腳位 142 | I/O — User I/O pin (bank 1) |
| 腳位 143 | I/O — User I/O pin (bank 1) |
| 腳位 144 | I/O — User I/O pin (bank 1) |
典型應用
EP1K50TI144-2 適用於 6 應用s: Industrial Glue Logic Replacement, Legacy Protocol Bridge and Bus Converter, Test and Measurement Instrumentation Front-End, Telecommunications Glue Logic and Framing, Motor Control and Drive Interface, Aerospace Prototype and Avionics Bus Interface.
Industrial Glue Logic Replacement
The EP1K50TI144-2 is well suited for replacing multiple discrete 74-series glue-logic ICs in industrial control boards. With 2,880 LEs and 102 user I/O pins, the device can absorb an entire 7400-series BOM (buffers, latches, transceivers, encoders) into a single chip, cutting PCB area by 60-70% and reducing component count. Its 2.5 V core and LVTTL/LVCMOS I/O support connect directly to legacy 3.3 V microcontrollers and 5 V peripherals via series resistors. Designers should budget for an EPC2/EPC8 boot PROM and 4-layer PCB for signal integrity.
推薦
Legacy Protocol Bridge and Bus Converter
The EP1K50TI144-2 fits protocol-bridge designs such as UART-to-PCI, I2C-to-parallel, or SPI-to-ISA conversion used in legacy telecom and industrial equipment. The 40,960 bits of embedded RAM accommodate FIFOs up to 5 KB without external SRAM, and the 360 LABs deliver deterministic propagation delays suitable for bit-banging legacy bus timing. The 144-LQFP package is hand-rework-friendly for field upgrades, and SameFrame pin-compatibility lets engineers migrate to EP1K100TI144-2 in the same PCB footprint as bridge complexity grows.
推薦
Test and Measurement Instrumentation Front-End
The EP1K50TI144-2 serves as the digital back-end for low-cost test instruments such as logic analyzers, pattern generators, and protocol exercisers. Its 102 I/O pins support up to 96 channels of buffered digital I/O at 50 MHz using the -2 speed grade, sufficient for capturing parallel bus traffic at up to 25 MHz. The 2.5 V core delivers low dynamic power (~0.5 W typical) compared to larger FPGAs, making the part attractive for portable or USB-powered instruments. Designers typically implement state machines for trigger sequencing and store captured data in the embedded EAB RAM.
推薦
Telecommunications Glue Logic and Framing
In legacy telecom systems (T1/E1 framers, DS3 multiplexers, SONET/SDH tributary equipment), the EP1K50TI144-2 handles framing, alarm insertion, and clock-data recovery glue logic. The 360 LABs run small HDLC controllers and bit-error-rate testers (BERTs) in parallel, while the 40,960 bits of embedded RAM buffer tributary payloads. The -2 speed grade comfortably meets 51.84 MHz STS-1 timing. Industrial temperature grade supports outside-plant and central-office deployments where ambient temperatures vary.
推薦
Motor Control and Drive Interface
The EP1K50TI144-2 is deployed as the digital interface between microcontrollers/MOSFET gate drivers in industrial motor drives, BLDC controllers, and stepper drivers. The 102 I/O pins handle quadrature encoder feedback (QEP), Hall-sensor inputs, PWM outputs to gate drivers, and fault interlocks all within a single chip. Industrial-temperature operation (-40 to +85 °C) tolerates the elevated ambient inside a drive enclosure. The 2.5 V core and 3.3 V I/O simplify interface to modern Cortex-M microcontrollers, and embedded EABs store sine-table and commutation look-up tables.
推薦
Aerospace Prototype and Avionics Bus Interface
The EP1K50TI144-2 is used in legacy aerospace prototypes for ARINC 429, MIL-STD-1553, and discrete avionics bus interface cards. The 2,880 LEs encode/decode up to 8 ARINC 429 channels or implement a single MIL-STD-1553 BC/MT/RT in soft logic, while the industrial temperature range covers most cockpit and equipment-bay environments. SameFrame pin-compatibility lets designers scale to EP1K100TI144-2 for higher-channel-count avionics boxes without PCB rework. Note that aerospace certification programs typically require an obsolescence-management plan given the part's end-of-life status.
推薦
推薦產品摘要
工程參考資料，適用於 EP1K50TI144-2 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1K100TI144-2 | EP1K30TI144-2 | EP1K10TI144-2 | EP1K50TC144-2 | EP1K50TI144-1 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 144-LQFP (TQFP-144) | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same |
| Logic Elements (LEs) | 2,880 | 4,992 | 1,728 | 576 | 2,880 | 2,880 |
| Typical Gates | 50,000 | 100,000 | 30,000 | 10,000 | 50,000 | 50,000 |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 | -2 | -2 | -2 | -2 | -1 |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C (Commercial) | -40 °C to +85 °C (Industrial) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Embedded RAM (bits) | 40,960 | 49,152 | 24,576 | 12,288 | 40,960 | 40,960 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Highest LE density in a hand-solderable 144-LQFP ACEX-1K footprint (對比EP1K30TI144-2)
- Drop-in upgrade path to 100K-gate ACEX-1K on the same PCB (對比EP1K100TI144-2)
- Industrial-temperature operation suitable for outside-plant deployments (對比EP1K50TC144-2)
設計說明
The EP1K50TI144-2 requires a clean 2.5 V core supply (VCCINT) capable of delivering up to 300 mA during configuration and up to 200 mA in steady-state operation. Use a low-dropout regulator such as a TI TPS79325 or LT3021 with at least 25% current headroom. Place 10 µF + 0.1 µF decoupling capacitors within 5 mm of every VCCINT/GND pair. VCCIO must ramp within ±600 µs of VCCINT to avoid latch-up; sequence VCCINT before VCCIO or use a dual-output LDO with tracking.
The 144-LQFP package has 0.5 mm pitch leads; PCB land pattern must follow IPC-7351 nominal-density guidelines with 0.30 mm pad width and 0.20 mm solder mask sliver. Use a 4-layer stackup with a continuous ground plane under the device. Tie all unused I/O pins to logic-low or logic-high through the Quartus II assignment editor (do not leave them floating). Add a 4.7 kΩ pull-up to VCCIO on nCONFIG, nSTATUS, and CONF_DONE for reliable boot.
Three common pitfalls: (1) Failing to populate an EPC configuration PROM and assuming the FPGA will boot from internal flash - the EP1K50TI144-2 is SRAM-based and loses configuration on every power-cycle. (2) Mixing VCCIO and VCCINT rails - the I/O bank voltage must match the peripheral logic level, otherwise inputs will be clamped and outputs will be over-driven. (3) Using a non-validated JTAG programmer (such as a generic FT2232H-based cable) without an Altera-compatible buffer - the TCK signal is sensitive to cable capacitance above 25 pF, which causes configuration failures.
合規資訊
ACEX-1K family predates RoHS mandate; RoHS and lead-free status not confirmed in provided web data. AEC-Q100 not applicable (FPGA is not automotive-qualified per the legacy ACEX-1K datasheet). Conflict-minerals statement compliant per Intel supplier-responsibility policy.