EP1M350F780I7 - Mercury PLD 350K Gates FPGA | Altera (Intel)
MPN: EP1M350F780I7 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $252.5 | $2,525.00 |
| 100 | $218.75 | $21,875.00 |
| 500 | $189.4 | $94,700.00 |
| 1,000 | $165.2 | $165,200.00 |
Drop-in alternatives for EP1M350F780I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1M350F780I6N
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View Datasheet →EP1M350F780I6AA
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View Datasheet →EP1M350F780I6
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View Datasheet →EP1M350F780C7
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View Datasheet →EP1M350F780C8
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View Datasheet →EP1M350F780C7N
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View Datasheet →EP1M350F780I7 Maximum Ratings & Electrical Characteristics
| Family | Mercury PLD |
| System Gates | 350,000 |
| High-Speed Serial Channels | 18 (up to 8 channels at 1.25 Gbps) |
| Maximum Serial Data Rate | 1.25 Gbps |
| Process Technology | 0.15 µm CMOS |
| Configuration Memory | SRAM-based (requires external configuration device) |
| Package | 780-pin FineLine BGA (F780) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Speed Grade | I7 |
| MSL Level | 3 (168 hours) |
EP1M350F780I7 780-pin fineline bga (f780) Pin Configuration Guide
Complete pinout information for EP1M350F780I7 (780-pin fineline bga (f780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1M350F780I7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1M350F780I7 is suitable for 6 applications: SONET/SDH Telecom Line-Card Glue Logic, Gigabit Ethernet Switch Backplane Bridging, Custom Protocol Converter / Bridge ASIC Prototyping, Industrial Factory Automation Controller, High-Speed Test & Measurement Equipment, Aerospace & Defense Ruggedized Embedded System.
SONET/SDH Telecom Line-Card Glue Logic
The EP1M350F780I7 Mercury PLD is well suited for SONET/SDH telecom line-card glue-logic applications where 350K system gates and 1.25 Gbps multi-gigabit transceivers provide the integration density and serial bandwidth required for framer-to-mapper interfaces. Eight channels at full 1.25 Gbps enable redundant protection switching and multi-rate payload mapping without external SERDES ICs, reducing BOM cost and board area. Industrial temperature grade (-40 °C to +100 °C) supports central-office and outdoor-cabinet deployment, while the 780-pin BGA allows high pin-count fan-out for parallel telecom buses and LVDS interconnect to companion framers.
Recommended
Gigabit Ethernet Switch Backplane Bridging
For gigabit Ethernet switch backplane bridging, the EP1M350F780I7 provides chip-to-chip SERDES at 1.25 Gbps, directly compatible with gigabit Ethernet PHY interfaces and backplane serial standards. Its 350K gates absorb bridging logic, MAC address tables, and protocol conversion between switch ASICs without an external processor. Industrial-grade silicon ensures reliable operation in enterprise and industrial Ethernet switches mounted in temperature-controlled but vibration-prone enclosures, while the FineLine BGA package enables controlled-impedance routing essential for 1.25 Gbps signal integrity.
Recommended
Custom Protocol Converter / Bridge ASIC Prototyping
The EP1M350F780I7 Mercury FPGA serves as a high-fidelity ASIC prototyping platform for custom protocol-converter ASICs, since 350K gates approximate mid-range ASIC complexity and the built-in multi-gigabit transceivers model the SERDES blocks of the target ASIC. Engineers can validate custom bus protocols, custom serial framing, and proprietary backplane standards in real silicon before committing to NRE mask charges. The 780-pin BGA exposes enough I/O to replicate wide ASIC pad rings, while SRAM-based configuration allows rapid design iteration via JTAG reconfiguration during development.
Recommended
Industrial Factory Automation Controller
For industrial factory automation controllers, the EP1M350F780I7 delivers 350K gates of deterministic logic with industrial temperature rating, suitable for real-time motion control, high-speed sensor aggregation, and fieldbus bridging. The multi-gigabit transceivers enable SERCOS, EtherCAT, or proprietary high-speed fieldbus links to remote I/O racks, while abundant logic implements custom safety and control algorithms. The Mercury family's SRAM configuration allows field firmware updates via JTAG, supporting long-life industrial installations where the FPGA may outlive its original controller firmware.
Recommended
High-Speed Test & Measurement Equipment
The EP1M350F780I7 Mercury FPGA enables high-speed test and measurement instruments such as protocol analyzers, BERT testers, and high-speed data acquisition front-ends, where 1.25 Gbps SERDES capture and 350K gates of pattern-matching logic are required. The 780-pin BGA supports parallel LVDS connections to high-speed ADCs and DACs, while the multi-gigabit transceivers provide direct serial test access to 1 Gbps and below data streams. Industrial temperature grade supports benchtop and field-deployed test equipment.
Recommended
Aerospace & Defense Ruggedized Embedded System
For aerospace and defense ruggedized embedded systems, the EP1M350F780I7 provides industrial-temperature-grade logic with multi-gigabit serial links suitable for mission computers, avionics databuses, and radar signal preprocessing. The 350K gate density supports complex DSP preprocessing, custom MIL-STD-1553 or ARINC 429 bridges, and high-speed serial links to RF front-ends. The Mercury family's robust 0.15 µm CMOS process and industrial temperature range are well matched to ruggedized enclosures, while SRAM configuration supports secure bitstream updates through approved channels.
Recommended
Recommended Products Summary
Engineering reference data for EP1M350F780I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1M350F780I6N | EP1M350F780I6AA | EP1M350F780I6 | EP1M350F780C7 | EP1M350F780C8 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-pin FineLine BGA (F780) | 780-pin FineLine BGA (F780) | 780-pin FineLine BGA (F780) | 780-pin FineLine BGA (F780) | 780-pin FineLine BGA (F780) | 780-pin FineLine BGA (F780) |
| Family | Mercury PLD | Mercury PLD | Mercury PLD | Mercury PLD | Mercury PLD | Mercury PLD |
| System Gates | 350,000 | 350,000 | 350,000 | 350,000 | 350,000 | 350,000 |
| Serial Channels (max 1.25 Gbps) | 8 channels at 1.25 Gbps + 10 at ≤1.0 Gbps | 8 channels at 1.25 Gbps + 10 at ≤1.0 Gbps | 8 channels at 1.25 Gbps + 10 at ≤1.0 Gbps | 8 channels at 1.25 Gbps + 10 at ≤1.0 Gbps | 8 channels at 1.25 Gbps + 10 at ≤1.0 Gbps | 8 channels at 1.25 Gbps + 10 at ≤1.0 Gbps |
| Temperature Grade | Industrial (-40 °C to +100 °C) | Industrial | Industrial | Industrial | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) |
| Speed Grade | I7 | I6N | I6AA | I6 | C7 | C8 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Industrial temperature grade with same Mercury silicon as commercial variants (vs EP1M350F780C7)
- I7 speed grade (top-bin industrial) versus I6 speed-grade alternates (vs EP1M350F780I6N)
- Member of Mercury PLD family with built-in multi-gigabit transceivers (vs EP1K100FC484-2 (ACEX-1K))
Design Notes
The Mercury EP1M350F780I7 requires multiple supply rails (VCCINT core, VCCIO I/O banks, VCCA_PLL PLL analog, and VTT for SERDES termination). Estimated: at full toggle rate with all 8 SERDES channels active at 1.25 Gbps, core current can exceed 1.5 A. Use a star-ground topology and separate regulator zones for PLL analog (VCCA_PLL) to minimize jitter; per the Mercury datasheet, VCCA_PLL must be filtered with a ferrite bead and 10 µF + 0.1 µF decoupling.
The 780-pin FineLine BGA requires a multilayer PCB with microvia stack-ups for breakout routing. Maintain 100 Ω differential impedance on SERDES lanes (1.25 Gbps) and 50 Ω single-ended on LVCMOS pairs. Estimated: trace-length matching within ±10 mil across all SERDES lanes is necessary for reliable multi-gigabit operation; the Mercury datasheet provides length-matching guidelines per differential pair.
Because the EP1M350F780I7 is SRAM-based, the device loses configuration on power-down and requires an external EPC configuration PROM (e.g., EPC16 or EPC8). A common pitfall is omitting the JTAG header for in-system reprogramming, which prevents field firmware updates. Per the Mercury datasheet, the nSTATUS, nCONFIG, and CONF_DONE pins must be pulled correctly per Altera reference design to ensure clean configuration.
Estimated: at industrial ambient (85 °C) with full SERDES activity, the EP1M350F780I7 BGA can dissipate 3–5 W; thermal management requires a 4-layer or higher PCB with continuous ground planes beneath the BGA to spread heat. For high-junction-temperature applications, attach a heatsink with thermal interface material to the package top, and ensure adequate airflow.
Compliance Information
Detailed RoHS/REACH/lead-free status not present in verified web data; marked unknown. Mercury family predates many modern compliance declarations, so verify with authorized distributor documentation before placing new orders.
