EP1S80B956C5N - Stratix 79K Logic Elements 956-FCBGA FPGA | Intel
MPN： EP1S80B956C5N ✗ 停產EP1S80B956C5N 概覽
A Field-Programmable Gate Array (FPGA) is a programmable logic device (PLD) that lets engineers implement arbitrary digital logic, memory, DSP, and high-speed serial functions on a single silicon die. Within the broader semiconductor taxonomy, FPGAs sit under programmable logic devices (PLDs) -> field programmable gate arrays (FPGAs) -> programmable semiconductors, and they are the device-of-choice when design requirements outgrow fixed-function ASICs or microcontrollers in logic density, parallelism, or I/O bandwidth.
Key features of the EP1S80B956C5N include the Stratix TriMatrix on-chip memory architecture, dedicated DSP blocks for high-throughput multiply-accumulate operations, multiple phase-locked loops (PLLs) for clock synthesis, and high-speed LVDS I/O support. The 956-ball FCBGA package exposes a very large user-I/O count and dedicated global clock routing, enabling the device to interface to external DDR SDRAM memories and multiple high-speed parallel buses simultaneously.
Architecturally, the Stratix family introduced a look-up-table (LUT) based logic element combined with embedded array blocks (EABs) and DSP blocks. The 1.5 V core reduces dynamic power relative to earlier 2.5 V Stratix predecessors, while the 130 nm process provides mature, well-characterized timing closure for complex synchronous designs.
Typical applications include high-performance digital signal processing, telecom baseband processing, industrial video and image processing, networking line-card prototyping, and ASIC prototyping/emulation platforms. Designers also use this device in test & measurement front-ends and in military/aerospace prototypes that demand high logic density with commercial-grade screening.
When designing with this device, pay attention to power budgeting: the 1.5 V core combined with up to 500 MHz clock domains means multi-amp core currents and the need for extensive decoupling. The 956-ball FCBGA also requires multi-layer PCB stack-ups with buried vias and controlled-impedance routing for LVDS pairs.
This page synthesizes distributor inventory, current market pricing, same-family drop-in Stratix alternatives, and practical engineering guidance not bundled in the manufacturer datasheet.
直接替換替代品，適用於 EP1S80B956C5N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1S80B956C5N （相同外形與佔位） — 差異在於 Package, DSP Blocks, Operating Temperature, PLLs, Speed Grade.
EP1S80B956C6N
✅ 直接替換📋 參考替代品（不在目錄中）
EP1S80B956C7N
✅ 直接替換📋 參考替代品（不在目錄中）
EP1S80B956I7N
✅ 直接替換📋 參考替代品（不在目錄中）
EP1S80B956C5N 最大額定值與電氣特性
| Family | Altera Stratix |
| Logic Elements | 79,040 |
| Maximum Internal Clock Frequency | 500 MHz |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 封裝 | 956-ball FCBGA |
| 工作溫度 | 0 °C to +85 °C (commercial, 'C' grade) |
| Speed Grade | 5 |
| 安裝類型 | Surface Mount (BGA) |
| Memory Architecture | TriMatrix on-chip memory |
| DSP Blocks | Yes (dedicated hardware multipliers) |
| PLLs | Yes (multiple) |
| I/O Standard Support | LVDS, LVTTL, LVCMOS, SSTL, HSTL (per Stratix family) |
EP1S80B956C5N 956-ball fcbga 腳位配置指南
EP1S80B956C5N（956-ball fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1S80B956C5N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1S80B956C5N 適用於 6 應用s: Telecom Baseband Signal Processing, ASIC Prototyping and Emulation, Industrial Video and Image Processing, Networking Line-Card Packet Processing, Test and Measurement Instrumentation, Military and Aerospace Prototyping.
Telecom Baseband Signal Processing
The EP1S80B956C5N's 79,040 logic elements, dedicated DSP blocks, and 500 MHz internal clock performance make it well-suited for telecom baseband processing. With TriMatrix on-chip memory, the device can buffer multiple symbol windows while DSP blocks execute multiply-accumulate operations for channel estimation, equalization, and turbo decoding. The 956-ball FCBGA exposes high LVDS I/O counts needed to interface to external ADCs, DACs, and CPRI/OBSAI framer ASICs in 3G/4G base-station prototyping.
推薦
ASIC Prototyping and Emulation
With 79K logic elements and abundant on-chip memory, the EP1S80B956C5N serves as an effective ASIC prototyping vehicle for designs in the 50K-200K gate range. Multiple EP1S80 devices can be paralleled on a multi-FPGA prototyping board to emulate larger ASICs, taking advantage of LVDS-based chip-to-chip communication and the Stratix family's deterministic timing. Quartus II design partitioning tools simplify the multi-FPGA split.
推薦
Industrial Video and Image Processing
The EP1S80B956C5N's DSP blocks and high I/O bandwidth support real-time video pipelines at SD, HD, and early 4K resolutions. The 956-ball FCBGA exposes sufficient LVDS pairs to drive multiple Camera Link channels or HDMI/DVI interfaces, while TriMatrix memory buffers line buffers and frame stores. Designers implement motion-estimation, filtering, and color-space conversion directly in FPGA fabric, offloading the host processor.
推薦
Networking Line-Card Packet Processing
In networking line cards the EP1S80B956C5N performs header parsing, classification, and traffic shaping at line rate. Its abundant LVDS I/O and on-chip memory enable wire-speed processing of 1G and 10G Ethernet streams, while dedicated DSP blocks accelerate hash and CRC operations. The 1.5 V core reduces power per lookup compared to older 2.5 V Stratix predecessors, easing line-card thermal budgets.
推薦
Test and Measurement Instrumentation
The EP1S80B956C5N enables custom logic-analyzer, protocol-analyzer, and arbitrary-waveform-generator front-ends. Its 500 MHz fabric, multiple PLLs, and LVDS I/O support pattern generation at hundreds of megahertz with precise edge placement. The high logic density allows a single FPGA to implement both the pattern generator and the compare/verification engine, replacing multiple discrete test chips on the same board.
推薦
Military and Aerospace Prototyping
Although the EP1S80B956C5N is commercial-temperature grade (0 °C to +85 °C), it is widely used in military/aerospace prototype and bench development where the engineering environment is controlled. Designers prototype algorithms intended for later porting to radiation-hardened FPGAs, taking advantage of the Stratix architecture's deterministic timing. The industrial-grade variant EP1S80B956I7N is preferred when -40 °C operation is required.
推薦
推薦產品摘要
工程參考資料，適用於 EP1S80B956C5N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1S80B956C6N | EP1S80B956C7N | EP1S80B956I7N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 956-ball FCBGA | 956-ball FCBGA - same | 956-ball FCBGA - same | 956-ball FCBGA - same |
| Logic Elements | 79,040 | 79,040 | 79,040 | 79,040 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | 5 (fastest commercial) | 6 | 7 (slowest commercial) | 7 (industrial) |
| Temperature Range | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) |
| Maximum Internal Clock | 500 MHz | slightly slower than C5 | slower than C6 | similar to C7 |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
主要差異化特點
- Fastest speed grade in the EP1S80 commercial family (對比EP1S80B956C6N)
- Pure commercial temperature range (對比EP1S80B956I7N)
- High logic density at 79K LEs (對比EP1S60F1508C7N)
設計說明
Estimated: The EP1S80B956C5N at 500 MHz core clock with full I/O switching typically draws 3-5 A on the 1.5 V VCCINT rail, plus 1-2 A on the 3.3 V VCCIO rails. Design the regulator stage with at least 30% headroom and place low-ESR ceramic decoupling (10 µF + 0.1 µF per supply pin group) within 5 mm of each BGA via. For 956-ball FCBGA layouts, use a 6- or 8-layer PCB stack-up with dedicated power and ground planes to suppress core-noise coupling onto LVDS pairs.
Estimated: At full 500 MHz operation the die dissipation can exceed 8 W, requiring junction-to-ambient thermal management. Although the FCBGA package has a modest theta_JA, in practice attach a small heat-spreader or thermal pad covering the die shadow on the top of the BGA. For enclosed chassis, derate by 20% above 60 °C ambient. Industrial-grade EP1S80B956I7N variants are recommended above 85 °C ambient.
The 956-ball FCBGA mandates a high-density interconnect (HDI) PCB. Use microvias (laser-drilled, 0.1 mm pad) or stacked microvias for breakout routing from inner balls. Maintain at least 4 ground vias adjacent to the BGA perimeter for return-path integrity, and follow the Altera Stratix Board Design Guidelines for skew-matched LVDS routing (max 10 mil within-pair mismatch). Add a keep-out region beneath the BGA to allow for the heat-spreader attachment.
Do not confuse the EP1S80B956C5N with the Stratix II EP2S80 (different die, different BGA ball-map, not pin-compatible). Always verify the full MPN, especially the speed-grade digit, before ordering - EP1S80B956C5, C6, C7 and I5/I7 are distinct part numbers with different timing. Configuration mode (Passive Serial, Fast Passive Parallel, JTAG) must match the board's boot PROM to avoid lockup at power-up.
合規資訊
The 'N' suffix in the MPN indicates lead-free packaging per Altera/Intel legacy naming convention. RoHS and REACH compliance status are not present in the verified web data; consult Intel's PCN archive for the specific date code.
