EP1S60F1020C6N - Stratix FPGA, 57K Logic Elements, FBGA-1020 | Intel
MPN： EP1S60F1020C6N ✗ 停產EP1S60F1020C6N 概覽
What is a Stratix FPGA? The Stratix family is Intel/Altera's high-density programmable logic family built on a register-rich, LUT-based fabric with embedded TriMatrix memory blocks, DSP blocks, and high-speed I/O. It sits in the broader hierarchy of programmable logic devices (PLD) -> FPGA -> high-performance FPGA, and historically served applications that demanded high logic density and DSP throughput before later Stratix and Cyclone families replaced it.
Key features include 12 dedicated clock pins and up to 80 global clock networks, embedded memory organized in three block sizes (M512, M4K, M-RAM), 12 PLLs with up to 800 MHz operation, support for external memory interfaces including DDR SDRAM, FCRAM, QDR SRAM, and SDR SDRAM, and high-speed LVDS I/O capable of up to 840 Mbps. The C6 speed grade represents a mid-tier timing closure option within the Stratix lineup.
Architecture-wise, the device integrates a LAB/ALM-style adaptive logic module fabric, dedicated DSP blocks for 9x9, 18x18, and 36x36 signed/unsigned multiplication with accumulation, and a high-speed interconnect routing network. The 'N' suffix indicates lead-free / Pb-free termination. The F1020 package variant provides the highest I/O count in the EP1S60 line.
Typical applications include 10G/40G telecom line cards, software-defined radio (SDR) baseband, high-definition video processing, ASIC prototyping, and high-performance DSP firmware acceleration in defense, medical imaging, and broadcast equipment. The wide embedded multiplier count (773) and large TriMatrix memory (5.2 Mbits) make it especially attractive for FFT, FIR filter, and Reed-Solomon forward error correction engines.
Design consideration: ensure proper decoupling with multiple 0.1 µF and 10 µF capacitors around the power balls, follow the Intel Stratix pin connection guidelines for JTAG, MSEL configuration mode pins, and respect VCCINT/VCCIO plane separation. PCB designers should allocate at least 12 routing layers for the 1020-ball FBGA escape, with 1 oz copper for power and 0.5 oz for signals. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the standalone datasheet.
直接替換替代品，適用於 EP1S60F1020C6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1S60F1020C6N （相同外形與佔位） — 差異在於 Package, Speed Grade, Family, Operating Temperature, Process Technology.
EP1S60F1020C5N
✅ 直接替換✗ 缺貨
$2050 / 單位
查看資料表 →EP1S60F1020C6
✅ 直接替換聯絡詢價
查看資料表 →EP1S60F1020C5
✅ 直接替換聯絡詢價
查看資料表 →EP1S60F1020I6N
✅ 直接替換聯絡詢價
查看資料表 →EP1S40F1020C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1S60F1020C6N 最大額定值與電氣特性
| Series | Stratix |
| Family | Stratix (EP1S) |
| Logic Elements (LEs) | 57,120 |
| Logic Cells | 6,570 blocks (per chipdig datasheet summary) |
| Embedded RAM (Total Bits) | 5,215,104 bits |
| Embedded Multipliers | 773 (18x18) |
| Maximum User I/O Pins | Per datasheet, package-dependent (F1020 variant) |
| Package Type | 1020-ball FBGA (FineLine BGA), 33 x 33 mm, 1 mm pitch |
| Logic Family / Process | CMOS, 0.13 µm |
| 工作溫度 | 0°C to +85°C (Commercial) |
| 供應電壓 | Per datasheet (Stratix Device Handbook Vol. 1) |
| Speed Grade | C6 (mid-tier) |
| Lead-Free / Pb-Free | Yes (suffix 'N') |
| RoHS 狀態 | Compliant (per 'N' suffix) |
| 安裝類型 | Surface Mount (BGA) |
| Configuration | JTAG / Passive Serial / Fast Passive Parallel via MSEL pins |
| PLL Count | 12 (per Stratix family datasheet) |
| Memory Block Types | TriMatrix (M512, M4K, M-RAM) |
EP1S60F1020C6N 1020-ball fbga (fineline bga), 33 x 33 mm, 1 mm pitch 腳位配置指南
EP1S60F1020C6N（1020-ball fbga (fineline bga), 33 x 33 mm, 1 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1S60F1020C6N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1S60F1020C6N 適用於 6 應用s: 10G/40G Telecom Line Card Processing, Software Defined Radio (SDR) Baseband, High-Definition Video Processing, ASIC Prototyping and Emulation, Medical Imaging Reconstruction, Industrial Automation Motion Control.
10G/40G Telecom Line Card Processing
The EP1S60F1020C6N fits 10G/40G telecom line card processing because its 57,120 logic elements, 5.2 Mbits of TriMatrix embedded RAM, and 773 18x18 multipliers deliver the throughput required for packet classification, traffic management, and forward error correction. The 12 PLLs and high-speed LVDS I/O (up to 840 Mbps per channel) enable clean clocking of multi-rate SerDes and switch-fabric interfaces. Placed on a line card between the network processor and the framer, the part performs layer-2/3 header parsing and Reed-Solomon FEC at line rate. The trade-off versus an ASIC is lower per-unit throughput but much faster NRE turnaround for evolving protocol standards like OTU2 and FlexE.
推薦
Software Defined Radio (SDR) Baseband
The EP1S60F1020C6N is well suited to SDR baseband processing, where its 773 dedicated 18x18 multipliers and large embedded memory deliver the FIR filter taps, FFT butterfly operations, and channelization buffers required for wideband digital down-conversion. Combined with external high-speed ADCs and DACs, the device can implement 100+ MHz instantaneous bandwidth waveforms such as LTE, WiMAX, or proprietary military waveforms. The TriMatrix M-RAM blocks (512 Kbit each) are ideal for storing FFT window coefficients. Unlike a DSP processor, the FPGA achieves deterministic latency critical for TDD half-duplex switching, at the cost of higher power consumption.
推薦
High-Definition Video Processing
The EP1S60F1020C6N suits high-definition video processing pipelines including 1080p60 broadcast format conversion, scaling, deinterlacing, and color-space conversion. Its 5.2 Mbits of embedded RAM holds multiple video line buffers (M4K and M-RAM blocks) needed for 2D FIR filtering and motion-adaptive deinterlacing, while the 773 multipliers handle polyphase scaler taps at full HD rates. The high LVDS bandwidth is sufficient for dual-channel DVI/HDMI input bridges at 1.65 Gbps per link. Designers pair this part with external DDR SDRAM for frame store and use the Stratix ALM fabric for the scaler state machine.
推薦
ASIC Prototyping and Emulation
The EP1S60F1020C6N is frequently used in ASIC prototyping platforms where its 57K LEs and abundant multipliers map a sizeable portion of a mid-complexity ASIC block. Multiple Stratix FPGAs can be cascaded via LVDS to emulate multi-million-gate ASICs, with the JTAG chain providing unified programming. The embedded TriMatrix memory and PLL count permit accurate emulation of clock trees and SRAM macros. Compared with dedicated emulation systems like Cadence Palladium, the Stratix array offers lower per-cycle cost but slower debug visibility. Designers map timing-critical paths first and use TimeQuest SDC constraints to verify setup/hold across the array.
推薦
Medical Imaging Reconstruction
The EP1S60F1020C6N fits medical imaging reconstruction algorithms such as CT filtered back-projection and MRI FFT-based reconstruction. The 773 multipliers perform parallel ray summation and voxel interpolation at diagnostic frame rates, while the embedded memory buffers 512x512 image slices with sufficient bandwidth. The commercial temperature range (0 to +85°C) is adequate for controlled-room imaging cabinets, though the EP1S60F1020I6N variant should be selected for mobile cart or bedside platforms. Compared with GPU implementations, the FPGA delivers deterministic per-patient scan latency, critical for synchronized X-ray source triggering.
推薦
Industrial Automation Motion Control
The EP1S60F1020C6N supports industrial automation motion control with multi-axis servo loops and high-speed deterministic response. The 57K LEs handle PID loops for 16+ axes simultaneously at 32 kHz loop rates, while the LVDS I/O interfaces directly to resolver-to-digital converters and incremental encoder inputs. The 12 PLLs generate synchronized PWMs for IGBT-based motor drivers and the TriMatrix memory stores trajectory tables. The 1020-ball BGA provides sufficient user I/O for parallel axis expansion. Compared with a microcontroller, the FPGA delivers deterministic multi-axis latency below 1 µs at the cost of higher quiescent power.
推薦
推薦產品摘要
工程參考資料，適用於 EP1S60F1020C6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1S60F1020C5N | EP1S60F1020C6 | EP1S60F1020C5 | EP1S60F1020I6N | EP1S40F1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-1020 (33x33 mm, 1 mm pitch) | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same (verify I/O mapping) |
| Logic Elements | 57,120 | 57,120 (same) | 57,120 (same) | 57,120 (same) | 57,120 (same) | ~41,250 (-28%) |
| Embedded RAM (bits) | 5,215,104 | 5,215,104 (same) | 5,215,104 (same) | 5,215,104 (same) | 5,215,104 (same) | 3,423,744 (-34%) |
| Embedded Multipliers (18x18) | 773 | 773 (same) | 773 (same) | 773 (same) | 773 (same) | 448 (-42%) |
| Speed Grade | C6 (commercial) | C5 (slower) | C6 (same) | C5 (slower) | I6 (industrial) | C6 (same) |
| Operating Temperature | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) |
| Lead-Free (Pb-Free) | Yes (N suffix) | Yes | No (leaded) | No (leaded) | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- C6 speed grade offers higher Fmax than the C5 variant for timing-critical DSP paths (對比EP1S60F1020C5N)
- Lead-free (Pb-free) termination suitable for RoHS-compliant assemblies (對比EP1S60F1020C6)
- Full 57,120-LE density vs 41,250 LEs in the EP1S40 package twin (對比EP1S40F1020C6N)
設計說明
Estimated: At typical Stratix EP1S60 utilization of 70% LEs and 50% RAM switching at 200 MHz, total power consumption is approximately 4-6 W. Decouple all VCCINT balls with 0.1 µF X7R ceramics placed within 50 mils of each ball cluster, and add four bulk 220 µF tantalum capacitors around the package perimeter. Separate VCCINT and VCCIO planes must be split under the BGA escape to avoid simultaneous switching noise coupling into the core logic. Follow the Stratix Device Handbook PowerPlay section for accurate early-stage power estimation.
The 1020-ball FBGA at 1 mm pitch requires at least 12 PCB layers with 1 oz copper power planes. Use laser-drilled microvias (4-6 mil pad) with 0.5 oz signal layers and 1 oz power/ground layers. Fan-out routing should follow a dog-bone or via-in-pad escape pattern, and all 1020 balls should be connected with 0.5 oz copper traces minimum. Reference Intel AN-224 (Stratix Board Design Guidelines) for via-in-pad recommendations and matched-length LVDS pair routing within 5 mil tolerance.
Three common pitfalls when bringing up the EP1S60F1020C6N: (1) leaving MSEL configuration pins floating - they MUST be tied high or low per the desired configuration mode (AS, PS, JTAG); (2) using a non-1.8V VCCPD supply with the wrong JTAG voltage causing programming failure - verify VCCPD matches the I/O bank reference; (3) ignoring nCONFIG and nSTATUS reset sequencing - hold nCONFIG low for at least 2 µs after power stable. Always use the latest Quartus II Service Pack and the matching BSDL file for boundary-scan testing.
Estimated: At 5 W dissipation and the FBGA-1020 theta-JA of approximately 12-15 °C/W (still air, JEDEC 4-layer board), junction-to-ambient rise is 60-75 °C. For commercial-temperature (0-85°C) operation, internal junction temperature must remain below 85°C, so ambient must stay under 10-25°C without airflow. Add 200 LFM forced-air cooling, or a heat spreader (e.g., 30 x 30 mm copper pad bonded to the BGA top with thermal epoxy), to keep junction below 100°C. For industrial applications using the EP1S60F1020I6N variant, thermal headroom is even tighter.
合規資訊
RoHS compliance inferred from 'N' suffix per Altera/Intel legacy packaging convention. REACH, halogen-free, and conflict-minerals status not stated in verified data and should be requested from the supplier. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.
