EP1SGX25DF800I7N - 25,660 LEs Stratix GX FPGA, 16 GXB, FBGA-800 | Intel / Altera
MPN： EP1SGX25DF800I7N ⚠ 最後購買機會EP1SGX25DF800I7N 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement custom digital logic. FPGAs sit within the broader taxonomy: FPGA -> programmable logic device (PLD) -> digital logic IC -> integrated circuit -> semiconductor. FPGAs are widely used in communications, signal processing, prototyping, and any application where custom high-speed digital logic is required. The Stratix GX family specifically targets applications that need multi-gigabit serial I/O, integrating SERDES-based transceiver blocks alongside the programmable fabric.
Key features of the EP1SGX25DF800I7N include up to 16 high-speed transceiver channels (GXBs) with embedded clock-data-recovery (CDR) and SERDES capability at data rates up to 3.125 Gbps per channel. The fabric includes dedicated DSP blocks, TriMatrix embedded memory, and a hierarchical clock network with up to 12 PLLs. The device also supports LVDS, LVTTL, LVPECL, PCI, PCI-X, SSTL, HSTL, and several other I/O standards, and provides true LVDS transmit, receive, and on-chip termination. Designers typically configure the part with the Altera / Intel Quartus II design suite.
The architecture pairs a 1.5 V core (VCCINT) with separate VCCIO banks for flexible I/O voltage mixing. The device operates from a 1.5 V core supply and includes 1.5 V PCML or 1.5 V PECL reference voltages for the transceiver blocks. Power estimation and signal-integrity analysis are typically performed in the Quartus PowerPlay and SignalTap II tools. The industrial-grade speed grade '7' (as indicated by 'I7') corresponds to a -7 speed bin for the industrial temperature range.
Typical applications for the EP1SGX25DF800I7N include multi-gigabit serial backplanes, SONET/SDH framer interfaces, PCI Express base designs, custom protocol bridges, broadcast video processing, and high-speed data acquisition front-ends. The integrated GXBs let designers connect directly to SFP/SFP+ optical modules or backplane SERDES without external CDR chips.
When designing with this device, note that the FBGA-800 package requires high-density PCB layout with microvia/stacked-via technology, controlled-impedance routing for all transceiver channels, and strict power-plane isolation between the digital fabric and the analog PLL/transceiver supply domains. In-system programming is supported via JTAG or passive serial configuration using a serial configuration device such as the EPCS16 or EPCS64.
直接替換替代品，適用於 EP1SGX25DF800I7N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX25DF800I7N （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, Logic Elements, DSP Blocks.
EP1SGX25DF800I6N
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查看資料表 →EP1SGX25DF800C6N
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查看資料表 →EP1SGX25DF800C5N
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查看資料表 →EP1SGX25DF672I7N
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查看資料表 →EP1SGX25CF672I7N
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查看資料表 →EP1SGX10DF672I6N
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查看資料表 →EP1SGX25DF800I7N 最大額定值與電氣特性
| Series | Stratix GX |
| Family Name | Stratix GX (EP1SGX25) |
| Logic Elements | 25,660 |
| Registers | 26,274 |
| Embedded Memory | 1,944,576 bits |
| GXB Transceiver Channels | 16 (max) |
| GXB Data Rate | Up to 3.125 Gbps per channel |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Standards Supported | LVDS, LVTTL, LVPECL, PCI, PCI-X, SSTL, HSTL, 1.5 V PCML/PECL |
| PLLs | Up to 12 |
| 封裝 | FBGA-800 (FineLine BGA) |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +100C (industrial, 'I' grade) |
| Speed Grade | -7 (industrial) |
| Configuration | JTAG or Passive Serial (EPCSxx) |
EP1SGX25DF800I7N fbga-800 (fineline bga) 腳位配置指南
EP1SGX25DF800I7N（fbga-800 (fineline bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX25DF800I7N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX25DF800I7N 適用於 6 應用s: Multi-Gigabit Backplane SERDES, SONET/SDH Framer Interface, Broadcast Video Processing, Custom Protocol Bridge / ASIC Prototype, PCI Express Endpoint / Root Complex, High-Speed Data Acquisition Front-End.
Multi-Gigabit Backplane SERDES
The EP1SGX25DF800I7N integrates 16 CDR-based GXB transceiver channels at up to 3.125 Gbps, making it ideal for backplane SERDES across ATCA or custom chassis backplanes. Designers can implement protocols such as Gigabit Ethernet, XAUI, or proprietary serial links directly into the fabric without external CDR chips. The industrial -40C to +100C junction range and 800-ball FBGA package support high-density line-card designs; the part consumes more power than smaller Stratix GX members but delivers the full 16-channel transceiver count in a single device, simplifying board area versus a two-chip solution.
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SONET/SDH Framer Interface
Telecom framer and mapper designs at OC-48/STM-16 (2.488 Gbps) rates fit naturally into the EP1SGX25DF800I7N's 16 GXB channels. The fabric can host channelized mapping logic, while the GXB blocks serialize/deserialize the optical payload to SFP or SFP+ modules. According to the Stratix GX family datasheet, the embedded CDR and 8B/10B-compatible transceiver support built-in clock-comma alignment, reducing external PHY complexity. The 25,660 LE fabric is sufficient for an OC-48 mapper plus overhead processing; for OC-192 (9.95 Gbps), the Stratix II GX family is the appropriate migration target.
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Broadcast Video Processing
Broadcast studio and contribution video systems use the EP1SGX25DF800I7N to drive multi-link SDI (SMPTE 259M/292M/424M) and HDMI/DisplayPort bridges with on-chip clock recovery. The 1.5 V core and integrated GXBs route serialized video at 270 Mbps, 1.485 Gbps, or 2.97 Gbps per link across 16 simultaneous channels, while the 1,944,576 bits of embedded memory buffer active video frames. The device's 26,274 registers support line-rate pixel processing without external FIFOs. Industrial temperature grade suits outside-broadcast trucks and air-conditioned studio racks.
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Custom Protocol Bridge / ASIC Prototype
OEMs prototyping proprietary chip-to-chip links (RapidIO, Aurora, custom LVDS SERDES) use the EP1SGX25DF800I7N as a software-defined bridge. The 25,660 LE fabric and TriMatrix memory host full protocol stacks, while the 16 GXB channels implement the physical layer with built-in pre-emphasis and equalization. Compared to ASIC NRE, the FPGA approach reduces upfront cost and shortens time-to-prototype. The FBGA-800 footprint requires high-density PCB layout with controlled-impedance SERDES traces; designers typically use Mentor Graphics Hyperlynx or Cadence Sigrity for channel simulation.
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PCI Express Endpoint / Root Complex
The EP1SGX25DF800I7N is suitable for implementing PCI Express x4 or x8 endpoints using its 3.125 Gbps GXB channels as the PHY, paired with a soft IP core in the fabric. The 25,660 LE fabric and 1,944,576 memory bits are sufficient for endpoint controllers plus DMA engines. According to Altera's IP library, the Stratix GX family supports PCIe 1.0a-compliant endpoints with the appropriate hard IP. Industrial temperature grade suits embedded computing cards in industrial PCs; the FBGA-800 package requires careful lane routing to meet PCIe signal-integrity masks.
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High-Speed Data Acquisition Front-End
Test-and-measurement digitizers, radar IF digitizers, and medical imaging front-ends use the EP1SGX25DF800I7N to aggregate multiple LVDS or LVPECL ADC lanes into the fabric. The 16 GXB channels accept serialized ADC output, while the 25,660 LE fabric performs decimation, filtering, and packetization. Industrial temperature grade supports deployment in vibration-prone or temperature-extreme test environments. The 1.5 V VCCINT and 12 PLLs provide flexible clocking for multi-rate sampling architectures; the FBGA-800 package supports mixed I/O voltage banks for direct interface to 1.8 V and 2.5 V ADCs.
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推薦產品摘要
工程參考資料，適用於 EP1SGX25DF800I7N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX25DF800I6N | EP1SGX25DF800C6N | EP1SGX25DF800C5N | EP1SGX25DF672I7N | EP1SGX25CF672I7N | EP1SGX10DF672I6N |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | FBGA-800 | FBGA-800 (same) | FBGA-800 (same) | FBGA-800 (same) | FBGA-672 (smaller) | FBGA-672 (smaller) | FBGA-672 (smaller) |
| Logic Elements | 25,660 | 25,660 (same) | 25,660 (same) | 25,660 (same) | 25,660 (same) | 25,660 (same) | 10,570 (-59%) |
| GXB Transceiver Channels | 16 | 16 (same) | 16 (same) | 16 (same) | 16 (same) | 16 (same) | 6 (-62%) |
| GXB Data Rate (max) | 3.125 Gbps | 3.125 Gbps (same) | 3.125 Gbps (same) | 3.125 Gbps (same) | 3.125 Gbps (same) | 3.125 Gbps (same) | 3.125 Gbps (same) |
| Embedded Memory | 1,944,576 bits | 1,944,576 bits (same) | 1,944,576 bits (same) | 1,944,576 bits (same) | 1,944,576 bits (same) | 1,944,576 bits (same) | 920,448 bits (-53%) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | -7 | -6 | -6 | -5 | -7 (same) | -7 (same) | -6 |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
主要差異化特點
- Industrial temperature grade at full -7 speed bin (對比EP1SGX25DF800C7N (hypothetical commercial-only sibling))
- Highest speed bin in the FBGA-800 Stratix GX family (對比EP1SGX25DF800I6N)
- Largest FBGA package preserves maximum user I/O (對比EP1SGX25DF672I7N)
設計說明
The FBGA-800 package uses a 0.8 mm or 1.0 mm ball pitch and requires microvia or stacked-via PCB technology. Use a high-Tg FR-4 or low-loss PCB material (such as Megtron 6 or Isola FR408HR) to control SERDES channel loss. Route all 16 GXB differential pairs with 100 ohm differential impedance and matched length within 0.5 mm (about 50 ps) to preserve eye-diagram margin. Provide dedicated analog power planes (VCCA_PLL, VCCA_TX, VCCA_RX) physically separated from digital VCCINT to suppress coupling noise into the CDR circuits.
Estimated: with all 16 GXB channels active at 3.125 Gbps and a typical 50% logic utilization, the EP1SGX25DF800I7N consumes roughly 8-12 W from a 1.5 V VCCINT supply. A 1.5 V DC-DC converter rated for at least 15 W with low output ripple (<30 mVpp) is recommended. Decouple VCCINT with 100 nF X7R ceramic capacitors placed within 5 mm of every VCCINT pin group, and add bulk 47-100 uF polymer or tantalum capacitors on each supply island. Use the Quartus PowerPlay early-power-estimator spreadsheet for a board-specific budget.
Each GXB transceiver channel exposes TX and RX pairs that require AC-coupling capacitors (typically 100 nF X7R) in series on the transmit path. Reference-clock inputs to the GXB PLLs must be routed as 100 ohm differential pairs with 0.1 mm length matching. According to the Stratix GX family datasheet, the built-in pre-emphasis and equalization compensate for up to 18 inches of FR-4 backplane trace, but signal-integrity simulations with IBIS-AMI models in HyperLynx or Sigrity are mandatory for first-pass success.
Do not confuse the EP1SGX25DF800I7N (Stratix GX with 16 GXB channels) with the EP1S25F780C7N (Stratix non-GX with no transceivers) - they share the 25K logic element class but are architecturally different. Verify configuration mode carefully: the device supports both passive serial (using an EPCSxx flash) and JTAG programming; incorrect MSEL pin strapping locks the part in the wrong mode. Lastly, since the family is mature, check Altera / Intel's product-discontinuance notices before committing to long-life-cycle production designs.
合規資訊
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not present in the verified web data and are marked unknown. AEC-Q100 is not applicable - this is an FPGA in an FBGA package, not an automotive-qualified IC. Always request the manufacturer's full material declaration before using in regulated applications.
