EP1SGX25DF800I7N - 25,660 LEs Stratix GX FPGA, 16 GXB, FBGA-800 | Intel / Altera
MPN: EP1SGX25DF800I7N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265.5 | $2,655.00 |
| 25 | $248 | $6,200.00 |
| 50 | $230 | $11,500.00 |
| 100 | $215 | $21,500.00 |
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View Datasheet →EP1SGX25DF800I7N Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family Name | Stratix GX (EP1SGX25) |
| Logic Elements | 25,660 |
| Registers | 26,274 |
| Embedded Memory | 1,944,576 bits |
| GXB Transceiver Channels | 16 (max) |
| GXB Data Rate | Up to 3.125 Gbps per channel |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Standards Supported | LVDS, LVTTL, LVPECL, PCI, PCI-X, SSTL, HSTL, 1.5 V PCML/PECL |
| PLLs | Up to 12 |
| Package | FBGA-800 (FineLine BGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (industrial, 'I' grade) |
| Speed Grade | -7 (industrial) |
| Configuration | JTAG or Passive Serial (EPCSxx) |
EP1SGX25DF800I7N fbga-800 (fineline bga) Pin Configuration Guide
Complete pinout information for EP1SGX25DF800I7N (fbga-800 (fineline bga) package) with [DATA_NEEDED: I/O pin count] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF800I7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: [DATA_NEEDED: I/O pin count] pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF800I7N is suitable for 6 applications: Multi-Gigabit Backplane SERDES, SONET/SDH Framer Interface, Broadcast Video Processing, Custom Protocol Bridge / ASIC Prototype, PCI Express Endpoint / Root Complex, High-Speed Data Acquisition Front-End.
Multi-Gigabit Backplane SERDES
The EP1SGX25DF800I7N integrates 16 CDR-based GXB transceiver channels at up to 3.125 Gbps, making it ideal for backplane SERDES across ATCA or custom chassis backplanes. Designers can implement protocols such as Gigabit Ethernet, XAUI, or proprietary serial links directly into the fabric without external CDR chips. The industrial -40C to +100C junction range and 800-ball FBGA package support high-density line-card designs; the part consumes more power than smaller Stratix GX members but delivers the full 16-channel transceiver count in a single device, simplifying board area versus a two-chip solution.
Recommended
SONET/SDH Framer Interface
Telecom framer and mapper designs at OC-48/STM-16 (2.488 Gbps) rates fit naturally into the EP1SGX25DF800I7N's 16 GXB channels. The fabric can host channelized mapping logic, while the GXB blocks serialize/deserialize the optical payload to SFP or SFP+ modules. According to the Stratix GX family datasheet, the embedded CDR and 8B/10B-compatible transceiver support built-in clock-comma alignment, reducing external PHY complexity. The 25,660 LE fabric is sufficient for an OC-48 mapper plus overhead processing; for OC-192 (9.95 Gbps), the Stratix II GX family is the appropriate migration target.
Recommended
Broadcast Video Processing
Broadcast studio and contribution video systems use the EP1SGX25DF800I7N to drive multi-link SDI (SMPTE 259M/292M/424M) and HDMI/DisplayPort bridges with on-chip clock recovery. The 1.5 V core and integrated GXBs route serialized video at 270 Mbps, 1.485 Gbps, or 2.97 Gbps per link across 16 simultaneous channels, while the 1,944,576 bits of embedded memory buffer active video frames. The device's 26,274 registers support line-rate pixel processing without external FIFOs. Industrial temperature grade suits outside-broadcast trucks and air-conditioned studio racks.
Recommended
Custom Protocol Bridge / ASIC Prototype
OEMs prototyping proprietary chip-to-chip links (RapidIO, Aurora, custom LVDS SERDES) use the EP1SGX25DF800I7N as a software-defined bridge. The 25,660 LE fabric and TriMatrix memory host full protocol stacks, while the 16 GXB channels implement the physical layer with built-in pre-emphasis and equalization. Compared to ASIC NRE, the FPGA approach reduces upfront cost and shortens time-to-prototype. The FBGA-800 footprint requires high-density PCB layout with controlled-impedance SERDES traces; designers typically use Mentor Graphics Hyperlynx or Cadence Sigrity for channel simulation.
Recommended
PCI Express Endpoint / Root Complex
The EP1SGX25DF800I7N is suitable for implementing PCI Express x4 or x8 endpoints using its 3.125 Gbps GXB channels as the PHY, paired with a soft IP core in the fabric. The 25,660 LE fabric and 1,944,576 memory bits are sufficient for endpoint controllers plus DMA engines. According to Altera's IP library, the Stratix GX family supports PCIe 1.0a-compliant endpoints with the appropriate hard IP. Industrial temperature grade suits embedded computing cards in industrial PCs; the FBGA-800 package requires careful lane routing to meet PCIe signal-integrity masks.
Recommended
High-Speed Data Acquisition Front-End
Test-and-measurement digitizers, radar IF digitizers, and medical imaging front-ends use the EP1SGX25DF800I7N to aggregate multiple LVDS or LVPECL ADC lanes into the fabric. The 16 GXB channels accept serialized ADC output, while the 25,660 LE fabric performs decimation, filtering, and packetization. Industrial temperature grade supports deployment in vibration-prone or temperature-extreme test environments. The 1.5 V VCCINT and 12 PLLs provide flexible clocking for multi-rate sampling architectures; the FBGA-800 package supports mixed I/O voltage banks for direct interface to 1.8 V and 2.5 V ADCs.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF800I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF800I6N | EP1SGX25DF800C6N | EP1SGX25DF800C5N | EP1SGX25DF672I7N | EP1SGX25CF672I7N | EP1SGX10DF672I6N |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | FBGA-800 | FBGA-800 (same) | FBGA-800 (same) | FBGA-800 (same) | FBGA-672 (smaller) | FBGA-672 (smaller) | FBGA-672 (smaller) |
| Logic Elements | 25,660 | 25,660 (same) | 25,660 (same) | 25,660 (same) | 25,660 (same) | 25,660 (same) | 10,570 (-59%) |
| GXB Transceiver Channels | 16 | 16 (same) | 16 (same) | 16 (same) | 16 (same) | 16 (same) | 6 (-62%) |
| GXB Data Rate (max) | 3.125 Gbps | 3.125 Gbps (same) | 3.125 Gbps (same) | 3.125 Gbps (same) | 3.125 Gbps (same) | 3.125 Gbps (same) | 3.125 Gbps (same) |
| Embedded Memory | 1,944,576 bits | 1,944,576 bits (same) | 1,944,576 bits (same) | 1,944,576 bits (same) | 1,944,576 bits (same) | 1,944,576 bits (same) | 920,448 bits (-53%) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | -7 | -6 | -6 | -5 | -7 (same) | -7 (same) | -6 |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Key Differentiators
- Industrial temperature grade at full -7 speed bin (vs EP1SGX25DF800C7N (hypothetical commercial-only sibling))
- Highest speed bin in the FBGA-800 Stratix GX family (vs EP1SGX25DF800I6N)
- Largest FBGA package preserves maximum user I/O (vs EP1SGX25DF672I7N)
Design Notes
The FBGA-800 package uses a 0.8 mm or 1.0 mm ball pitch and requires microvia or stacked-via PCB technology. Use a high-Tg FR-4 or low-loss PCB material (such as Megtron 6 or Isola FR408HR) to control SERDES channel loss. Route all 16 GXB differential pairs with 100 ohm differential impedance and matched length within 0.5 mm (about 50 ps) to preserve eye-diagram margin. Provide dedicated analog power planes (VCCA_PLL, VCCA_TX, VCCA_RX) physically separated from digital VCCINT to suppress coupling noise into the CDR circuits.
Estimated: with all 16 GXB channels active at 3.125 Gbps and a typical 50% logic utilization, the EP1SGX25DF800I7N consumes roughly 8-12 W from a 1.5 V VCCINT supply. A 1.5 V DC-DC converter rated for at least 15 W with low output ripple (<30 mVpp) is recommended. Decouple VCCINT with 100 nF X7R ceramic capacitors placed within 5 mm of every VCCINT pin group, and add bulk 47-100 uF polymer or tantalum capacitors on each supply island. Use the Quartus PowerPlay early-power-estimator spreadsheet for a board-specific budget.
Each GXB transceiver channel exposes TX and RX pairs that require AC-coupling capacitors (typically 100 nF X7R) in series on the transmit path. Reference-clock inputs to the GXB PLLs must be routed as 100 ohm differential pairs with 0.1 mm length matching. According to the Stratix GX family datasheet, the built-in pre-emphasis and equalization compensate for up to 18 inches of FR-4 backplane trace, but signal-integrity simulations with IBIS-AMI models in HyperLynx or Sigrity are mandatory for first-pass success.
Do not confuse the EP1SGX25DF800I7N (Stratix GX with 16 GXB channels) with the EP1S25F780C7N (Stratix non-GX with no transceivers) - they share the 25K logic element class but are architecturally different. Verify configuration mode carefully: the device supports both passive serial (using an EPCSxx flash) and JTAG programming; incorrect MSEL pin strapping locks the part in the wrong mode. Lastly, since the family is mature, check Altera / Intel's product-discontinuance notices before committing to long-life-cycle production designs.
Compliance Information
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not present in the verified web data and are marked unknown. AEC-Q100 is not applicable - this is an FPGA in an FBGA package, not an automotive-qualified IC. Always request the manufacturer's full material declaration before using in regulated applications.
