EP1SGX25DF800C6N - Stratix GX FPGA, 25K LE, 3.1875 Gbps SERDES | Intel / Altera
MPN： EP1SGX25DF800C6N ✗ 停產EP1SGX25DF800C6N 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic function is defined after manufacturing by a customer-supplied configuration bitstream. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic devices (PLDs), which sit alongside ASICs and ASSPs in the digital IC hierarchy. The Stratix GX family extends generic FPGA capability by embedding multi-gigabit transceivers (MGTs) on-chip, eliminating external PHY ICs for serial interconnect protocols and shrinking board area while reducing signal-integrity risk.
Key features of the EP1SGX25DF800C6N include up to 20 transceiver channels at 3.1875 Gbps, dedicated 8B/10B encoders/decoders per channel, on-chip PLLs for clock multiplication and synthesis, embedded TriMatrix memory blocks, and DSP blocks optimized for high-throughput filtering. The device also supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL through its True-LVDS and enhanced PLL architecture.
Stratix GX devices combine a 1.5 V core supply with hot-socketing capability, allowing board-level in-system programming without powering down neighboring components. Configuration is supported through passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), active serial (AS), and JTAG modes. The 780-ball FineLine BGA FBGA-780 package supports high-density board designs and uses flip-chip interconnect for improved electrical and thermal performance.
Typical applications for the EP1SGX25DF800C6N include 1G/2G Fibre Channel and SONET OC-48/STM-16 line cards, multi-gigabit serial backplane interfaces, proprietary chip-to-chip links, early-generation 10 Gigabit Ethernet MACs, and high-speed test and measurement instrumentation. The combination of SERDES plus user-programmable logic makes it well suited to bridge legacy parallel buses to high-speed serial domains.
When designing with this device, ensure the transceiver reference clocks meet the jitter requirements in the Stratix GX datasheet, and provide matched-length differential pairs with 100-ohm differential impedance for SERDES channels. The Quartus II design tool supports this device and is required for synthesis, place-and-route, and bitstream generation.
This page aggregates distributor pricing, same-package drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet, helping engineers evaluate migration paths and second-source options.
直接替換替代品，適用於 EP1SGX25DF800C6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX25DF800C6N （相同外形與佔位） — 差異在於 Package, Speed Grade, DSP Blocks, Logic Elements, Operating Temperature.
EP1SGX25DF800C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF800C7N
✅ 直接替換📋 參考替代品（不在目錄中）
EP1SGX25DF800I6N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1SGX25CF780C6
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP1SGX25DF800C6N 最大額定值與電氣特性
| Family | Stratix GX |
| Logic Elements | 25,560 LEs |
| Maximum Transceiver Channels | 20 channels |
| Maximum Transceiver Data Rate | 3.1875 Gbps |
| 封裝 | FBGA-780 (FineLine BGA, 800-ball per JEDEC ordering code) |
| Core Voltage | 1.5 V |
| 工作溫度 | Commercial (0 C to +85 C) |
| Speed Grade | 6 |
| Configuration Method | Passive Serial / Passive Parallel / Active Serial / JTAG |
| Transceiver Encoding | 8B/10B |
| Clock Data Recovery (CDR) | Yes, integrated per channel |
| 記憶體類型 | TriMatrix embedded SRAM |
| DSP Blocks | Yes, embedded multiplier blocks |
| 安裝類型 | Surface Mount (BGA) |
EP1SGX25DF800C6N fbga-780 (fineline bga, 800-ball per jedec ordering code) 腳位配置指南
EP1SGX25DF800C6N（fbga-780 (fineline bga, 800-ball per jedec ordering code) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX25DF800C6N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX25DF800C6N 適用於 6 應用s: SONET/SDH OC-48 / STM-16 Line Card, 1G/2G Fibre Channel Switch Fabric, Multi-Gigabit Serial Backplane, High-Speed Test and Measurement Instrumentation, Wireless Base Station Signal Processing, Video Broadcast Routing and Processing.
SONET/SDH OC-48 / STM-16 Line Card
The EP1SGX25DF800C6N is well suited to OC-48/STM-16 line cards operating at 2.488 Gbps per direction. Its 3.1875 Gbps SERDES headroom plus integrated CDR and 8B/10B encoding match the SONET framer interface, while the 25,560 LEs provide capacity for STS-1 path overhead processing and concatenation logic. Designers typically instantiate a soft MII/UTOPIA bridge between the SERDES and an external framer, simplifying the BOM.
推薦
1G/2G Fibre Channel Switch Fabric
The EP1SGX25DF800C6N's 3.1875 Gbps transceivers natively support 1 Gbps and 2 Gbps Fibre Channel rates defined by FC-PI-2, allowing designers to build a complete FC switch port in a single chip. The fabric implements cut-through or store-and-forward forwarding across up to 20 ports using on-chip TriMatrix memory for buffer credits. The 1.5 V core and hot-socketing make it deployable in hot-swappable FC switch chassis.
推薦
Multi-Gigabit Serial Backplane
Backplane links running proprietary multi-gigabit protocols from 1 Gbps to 3.125 Gbps can be implemented on the EP1SGX25DF800C6N, leveraging its on-chip CDR to recover clock from data and eliminate external PHY components. The 25,560 LEs support custom 8B/10B-aware link-layer state machines, while DSP blocks enable pre-emphasis and equalization adjustment at the FPGA side. This reduces board complexity versus discrete SERDES approaches.
推薦
High-Speed Test and Measurement Instrumentation
Test equipment such as protocol analyzers, BERT systems, and pattern generators benefit from the EP1SGX25DF800C6N's combination of multi-gigabit SERDES and programmable logic for custom trigger and capture sequences. Up to 20 channels can be aggregated for parallel bus protocol analysis at 2.5 Gbps, while TriMatrix memory buffers large capture windows. The FBGA-780 package supports high-density probe cards and ATE load boards.
推薦
Wireless Base Station Signal Processing
The DSP blocks and TriMatrix memory on the EP1SGX25DF800C6N enable digital up/down-conversion, crest-factor reduction, and digital predistortion for 3G/4G base station radios. The SERDES interface connects to CPRI or OBSAI framer ASICs at 1.228 Gbps, 2.457 Gbps, or 3.072 Gbps, while the fabric implements baseband filtering and DPD feedback loops. This architecture consolidates what previously required separate DSP + FPGA designs.
推薦
Video Broadcast Routing and Processing
SMPTE 259M and SMPTE 292M SDI links at 270 Mbps and 1.485 Gbps can be deserialized using the EP1SGX25DF800C6N's transceivers, with the fabric implementing line doubling, color-space conversion, and frame synchronization. The 25 KLE fabric supports real-time processing of SD and HD streams, and the SERDES headroom allows future migration to 3G-SDI (2.97 Gbps) on the same hardware platform.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX25DF800C6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX25DF800C5N | EP1SGX25DF800C7N | EP1SGX25DF800I6N | EP1SGX25CF780C6 |
|---|---|---|---|---|---|
| Package | FBGA-780 (FineLine BGA, flip-chip) | FBGA-780 (same) | FBGA-780 (same) | FBGA-780 (same) | FBGA-780 (same) |
| Brand | Intel (formerly Altera) | Intel (same) | Intel (same) | Intel (same) | Intel (same) |
| Logic Elements | 25,560 LEs | 25,560 LEs (same) | 25,560 LEs (same) | 25,560 LEs (same) | 25,560 LEs (same) |
| Max Transceiver Data Rate | 3.1875 Gbps | 3.1875 Gbps (same) | 3.1875 Gbps (same) | 3.1875 Gbps (same) | 3.1875 Gbps (same) |
| Speed Grade | 6 | 5 (faster Fmax) | 7 (slower Fmax) | 6 (same) | 6 (same) |
| Operating Temperature | Commercial 0 C to +85 C | Commercial 0 C to +85 C | Commercial 0 C to +85 C | Industrial -40 C to +100 C | Commercial 0 C to +85 C |
| SERDES Channels | Up to 20 | Up to 20 (same) | Up to 20 (same) | Up to 20 (same) | Up to 20 (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Speed grade 6 hits the cost/performance sweet spot for most designs (對比EP1SGX25DF800C5N)
- Industrial temperature option available in same package (對比EP1SGX25DF800I6N)
- Standard silicon revision with widest legacy support (對比EP1SGX25CF780C6)
設計說明
Estimated: the FBGA-780 FineLine BGA pitch is 1.0 mm with 0.6 mm pads, requiring laser-drilled microvias and a 6+ layer stackup with full power/ground planes. Each SERDES lane must route as 100-ohm differential with intra-pair length matching under 0.1 mm and lane-to-lane matching within 0.7 mm to meet 3.1875 Gbps jitter budgets. Reference the Altera Stratix GX PCB Design Guidelines for the recommended stackup and de-embedding recommendations.
Estimated: the Stratix GX core supply (VCCINT) is 1.5 V with a typical ICCINT around 0.5 A-1.5 A depending on utilization; SERDES supply (VCCE) is 1.5 V and PLL analog (VCCA) requires a low-noise LDO such as a 3.3 V to 1.5 V LT3021 or similar with <10 uVrms noise. Decoupling must include 0.1 uF X7R placed within 100 mil of every supply pin plus bulk 220 uF tantalums at the regulator outputs.
The Quartus II 13.0sp1 is the final release supporting the Stratix GX family - newer Quartus Prime releases drop these devices. Use legacy project archives (.qpf/.qsf) and lock the tool version to avoid synthesis regressions. Verify configuration mode pin strapping against the active configuration device (EPC16, EPC8, or EPC4) and confirm CONF_DONE goes high within 100 ms after nCONFIG release.
Estimated: at 100% SERDES utilization and high logic toggle rates, the FBGA-780 can dissipate 3 W to 5 W, requiring thermal vias beneath the BGA and a moderate airflow of 200 LFM. The exposed die (flip-chip) path through the package top demands heatsink attachment with thermal interface material rated for 1.0 W/m-K minimum. Monitor junction temperature via the on-die TSD sensor at -40 C / +85 C corners.
合規資訊
RoHS, REACH, lead-free, and halogen-free status are not documented in the public distributor data or Altera Stratix GX datasheet. The device predates widely enforced RoHS declarations and was likely ordered as a RoHS-5/6 compliant variant in many sources. Verify date code with your distributor before purchasing for any compliance-driven program.
