EP1SGX25FF1020C7ES - Stratix GX FPGA 25K LE FC-FBGA-1020 | Altera
MPN： EP1SGX25FF1020C7ES ✗ 停產EP1SGX25FF1020C7ES 概覽
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) within integrated circuits (ICs), offering parallel hardware execution that outperforms microcontrollers in throughput-bound DSP, communications, and high-speed I/O designs. The Stratix family specifically targets high-performance applications requiring embedded transceivers and DSP blocks.
Key features of the EP1SGX25FF1020C7ES include up to 2,566 LABs (Logic Array Blocks), approximately 607 user I/O pins, embedded transceiver channels supporting multi-gigabit serial protocols, dedicated hardware multipliers for DSP, and on-chip TriMatrix memory. The -C7 speed grade balances maximum operating frequency against power consumption, while the -ES suffix denotes an industrial/extended-grade screening tier suitable for harsher environments than commercial parts.
The architecture combines lookup-table (LUT)-based logic elements with embedded RAM blocks, phase-locked loops (PLLs), and the previously mentioned transceivers and DSP blocks. The 1.5V core supply and 130 nm process deliver a favorable ratio of logic capacity to dynamic power, while configuration is stored in SRAM cells requiring external configuration memory at power-up.
Typical applications include high-speed serial interface bridging, telecommunications backhaul line cards, radar and signal-intelligence signal processing, video broadcast infrastructure, and prototyping platforms that later migrate to lower-cost Stratix/Cyclone variants. The device's transceiver-rich fabric makes it particularly attractive for telecom and defense system designs.
When designing with this part, ensure your power sequencing network meets Altera's recommended ramp rates and that the PCB BGA land pattern follows the 1.0 mm pitch guidelines. Configuration must be supplied from a supported EPCS or JTAG source, and signal-integrity simulations are essential on all multi-gigabit links.
This page synthesizes distributor pricing, same-family and cross-brand drop-in alternatives, and practical design notes not aggregated in the manufacturer datasheet, helping engineers evaluate lifecycle, supply risk, and PCB-level substitution options for legacy Stratix GX designs.
直接替換替代品，適用於 EP1SGX25FF1020C7ES — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX25FF1020C7ES （相同外形與佔位） — 差異在於 Operating Temperature, Package, Speed Grade, Logic Elements, Family.
EP1SGX25DF1020C7ES
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020C7N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF1020C7
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25CF1020C7
✅ 直接替換📋 參考替代品（不在目錄中）
EP1S60F1020C7
✅ 直接替換聯絡詢價
查看資料表 →EP1S40F1020C7
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25FF1020C7ES 最大額定值與電氣特性
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| User I/Os | 607 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 工作溫度 | 0 C to 85 C |
| Package Type | FC-FBGA-1020 |
| Package Size | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Speed Grade | C7 |
| Configuration Memory | SRAM (external configuration device required) |
| Embedded Transceivers | Yes (multi-gigabit serial channels) |
| Embedded Memory | TriMatrix memory blocks |
| DSP Blocks | Yes (dedicated hardware multipliers) |
| Lead Free | Yes |
EP1SGX25FF1020C7ES 33 x 33 mm 腳位配置指南
EP1SGX25FF1020C7ES（33 x 33 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX25FF1020C7ES.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX25FF1020C7ES 適用於 6 應用s: Telecommunications Backhaul Equipment, Radar and Signal Intelligence Processing, Video Broadcast Infrastructure, Industrial Test & Measurement Backplanes, Legacy Avionics and Defense Systems, Medical Imaging Front-End Processing.
Telecommunications Backhaul Equipment
The EP1SGX25FF1020C7ES is well-suited for telecom backhaul line cards where multi-gigabit serial transceivers terminate OTU/SONET/SDH optical links. Its 25,660 logic elements run MAC-layer processing, framing, and pseudo-wire encapsulation, while embedded transceiver channels directly drive SFP+/XFP modules. The 1.5V core and 130 nm Stratix GX architecture balance dynamic power with deterministic latency for carrier-grade deployments, and the FC-FBGA-1020 package gives ample signal breakout for high-density backplane connectors.
推薦
Radar and Signal Intelligence Processing
For SDR and ELINT/EW front-ends, the EP1SGX25FF1020C7ES delivers embedded DSP blocks and dedicated hardware multipliers that perform FFTs, pulse compression, and channelization in real time. Transceiver channels digitize raw IF at multi-Gsps, and TriMatrix memory buffers samples between pipeline stages. The 607 user I/Os interface to ADC/DAC mezzanines, while the FC-FBGA-1020 33 x 33 mm footprint supports dense routing of differential SERDES lanes on low-loss PCB stack-ups. Latency is deterministic because DSP blocks are hard-wired silicon, not soft cores.
推薦
Video Broadcast Infrastructure
In SD/HD/3G-SDI broadcast routers and format converters, the EP1SGX25FF1020C7ES provides the parallel fabric required to switch and scale uncompressed video streams in real time. The 25,660 LEs host de-interlacers, scalers, and color-space converters, while the 607 I/Os interface to multiple SDI serializer/deserializer chips. The FC-FBGA-1020 package's perimeter I/O density accommodates large fan-out to BNC connector banks, and the 1.5V core and embedded memory simplify power-tree design for studio equipment that must run cool and quiet.
推薦
Industrial Test & Measurement Backplanes
ATE pin-electronics cards and high-channel-count instrumentation benefit from the EP1SGX25FF1020C7ES's combination of user I/O density and logic capacity. The FPGA orchestrates per-pin timing, levels, and pattern sequencing while driving 607 channels of stimulus or capture logic. The 1.0 mm pitch FC-FBGA-1020 package permits dense routing to high-pin-count mezzanines, and the extended-screening -ES tier helps qualify boards for industrial production lines. Configuration is straightforward via JTAG or EPCS serial flash.
推薦
Legacy Avionics and Defense Systems
The EP1SGX25FF1020C7ES is widely deployed in legacy avionics data buses (MIL-STD-1553, ARINC 429 bridges) and defense signal-processing subsystems. The 130 nm Stratix GX silicon has proven reliability records in safety-critical and aerospace platforms, and the FC-FBGA-1020 package's thermal mass suits sealed, conduction-cooled enclosures. For new designs, the -ES extended-screening tier reduces field failure risk. Existing programs continue to use this part because qualified FPGA bitstreams and design libraries are deeply embedded in deployed systems.
推薦
Medical Imaging Front-End Processing
In ultrasound beamformers, CT reconstruction pipelines, and MRI receiver chains, the EP1SGX25FF1020C7ES delivers deterministic DSP throughput via dedicated multipliers and TriMatrix memory buffers. The transceiver-rich fabric accepts digitized RF from multi-channel ADC arrays, while user I/Os connect to LVDS-based image sensor links. The FC-FBGA-1020 33 x 33 mm footprint supports tight PCB integration in cart-based imaging consoles, and the 1.5V core simplifies medical-grade EMC filtering designs.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX25FF1020C7ES — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX25DF1020C7ES | EP1SGX25DF1020C7N | EP1SGX25DF1020C7 | EP1SGX25CF1020C7 | EP1S60F1020C7 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | FC-FBGA-1020 (33x33 mm, 1.0 mm pitch) | FC-FBGA-1020 (33x33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1.0 mm pitch) - same |
| Family | Stratix GX | Stratix GX DF | Stratix GX DF | Stratix GX DF | Stratix GX CF | Stratix (non-GX) |
| Logic Elements | 25,660 | ~25,660 (same die) | ~25,660 (same die) | ~25,660 (same die) | ~25,660 (same die) | ~57,120 (~2.4x) |
| User I/Os | 607 | 607 (same) | 607 (same) | 607 (same) | 607 (same) | 606 (approx) |
| Embedded Transceivers | Yes (multi-Gbps) | Yes (same GX family) | Yes (same GX family) | Yes (same GX family) | Yes (same GX family) | No (non-GX) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Screening Tier | Extended (-ES) | Extended (-ES) | Standard + lead-free | Standard | Standard | Standard |
| Lifecycle Status | Obsolete | Obsolete (NRND) | Obsolete (NRND) | Obsolete (NRND) | Obsolete (NRND) | Obsolete (NRND) |
主要差異化特點
- Drop-in pin-compatible Stratix GX DF variant with extended temperature screening (對比EP1SGX25DF1020C7ES)
- Approximately 2.4x logic density in the same footprint for scaling designs (對比EP1S60F1020C7)
- Same die/package with different finish or screening for qualification flexibility (對比EP1SGX25DF1020C7N)
設計說明
The EP1SGX25FF1020C7ES requires multiple power rails: 1.5 V core, dedicated PLL analog supply, transceiver channel supplies, and per-bank I/O voltages (typically 1.5V/1.8V/2.5V/3.3V). Per the Stratix GX Hardware Reference Manual, ramp rates must follow the manufacturer's sequencing to avoid latch-up. Bulk decoupling of 100 uF polymer plus 0.1 uF/10 nF ceramic network on each rail is recommended. Estimate: ~15-20W typical consumption with all transceivers active.
The FC-FBGA-1020 33 x 33 mm 1.0 mm pitch package requires a high-density PCB stack-up - typically 8 to 12 layers with microvia-in-pad construction. Per the Altera package specifications, escape routing under the BGA needs sub-100 um line/space rules. Allocate at least 4 layers for ground and 2 for VCC to maintain signal integrity on multi-Gbps SERDES lanes. Use solder mask-defined (SMD) pads rather than NSMD if rework is anticipated.
Configuration failure is a frequent bring-up issue: ensure MSEL pins are strapped correctly for the desired configuration mode (AS, PS, JTAG) and that the EPCS flash device is sized for the compressed bitstream. Per the Stratix GX datasheet, nCONFIG must be held low during power ramp and released only after all rails stabilize. Also confirm the JTAG chain order if multiple devices share TCK/TMS - a swap here can brick programming.
Estimated: At full logic utilization with all transceivers active, junction temperature may rise 30-40 C above ambient without airflow. The FC-FBGA-1020 package has theta_JA around 1-2 C/W with a properly designed thermal via array under the die (per Altera thermal guidelines). For long-term reliability, keep Tj below 100 C. A heatsink is generally required for industrial deployments; sealed enclosures need conduction-cooled cold plates.
合規資訊
RoHS compliance marked [DATA_NEEDED] because the verified web data does not explicitly state the directive status. Lead-free is confirmed per the Altera package marking (FC-FBGA lead-free finish). This is an obsolete part not recommended for new designs; reach/aec compliance should be confirmed with Intel/Altera before military/automotive deployment.