EP1SGX25DF1020C7 - Stratix GX FPGA 25K LE, 607 I/O | Intel
MPN: EP1SGX25DF1020C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $195 | $19,500.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $145 | $145,000.00 |
Drop-in alternatives for EP1SGX25DF1020C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX25DF1020C6N
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View Datasheet →EP1SGX25DF1020C6
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View Datasheet →EP1SGX25DF1020C5N
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View Datasheet →EP1SGX25DF1020C7 Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Logic Elements | 25,660 |
| Number of LABs/CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| Number of I/Os | 607 |
| Operating Temperature | 0 C to 85 C |
| Supply Voltage (Core) | 1.425 V to 1.575 V |
| Process Technology | 130 nm CMOS |
| Internal Performance | 4385.97 MHz |
| Package | 1020-BBGA, FCBGA (33 x 33 mm, 1 mm pitch) |
| Logic Family | CMOS |
| Mounting Type | Surface Mount |
| RoHS Status | Lead-Free, Compliant |
| Device Family | Stratix GX |
| Transceivers | Embedded multi-gigabit transceivers |
EP1SGX25DF1020C7 1020-bbga, fcbga (33 x 33 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1SGX25DF1020C7 (1020-bbga, fcbga (33 x 33 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF1020C7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF1020C7 is suitable for 6 applications: Telecom Line Card (SONET/SDH Framer), Multi-Gigabit Serial Backplane Bridge, ASIC Prototyping Platform, Wireless Base Station Baseband, Video Broadcast and Imaging Processing, Industrial High-Speed Data Acquisition.
Telecom Line Card (SONET/SDH Framer)
The EP1SGX25DF1020C7 fits SONET/SDH framer and mapper designs because it integrates 24 multi-gigabit transceivers at up to 3.125 Gbps, matching OC-48/STM-16 line rates, plus 25,660 logic elements for framer/mapper state machines. The 1.5 V core and 607 user I/Os support large parallel datapaths for STS-1/AU-3 cross-connect fabrics. Placed on the line card between the optical module and the network processor, it absorbs the SERDES function and the framer pipeline in a single device, eliminating external PHY chips.
Recommended
Multi-Gigabit Serial Backplane Bridge
For proprietary backplanes running Serial RapidIO or XAUI at 3.125 Gbps, the EP1SGX25DF1020C7 provides ample transceiver channels for multiple XAUI lanes plus the logic fabric for protocol bridging. The 33 x 33 mm FCBGA-1020 package offers low-inductance power delivery and matched-impedance routing required for jitter budgets under 0.35 UI. Embedded 1,944,576 RAM bits buffer protocol conversion, and the Quartus II IP library provides ready-made XAUI, RapidIO, and PCIe soft cores that target this silicon.
Recommended
ASIC Prototyping Platform
ASIC designers use the EP1SGX25DF1020C7 as a hardware prototyping vehicle for mid-density ASICs in the 100K to 300K gate range. The 25,660 logic elements and embedded RAM allow RTL mapping with reasonable utilization, and the 607 I/Os expose the prototype's external interface for in-system validation. Placed on a custom prototype motherboard with breakout headers for ASIC pin exposure, it enables software teams to begin driver development in parallel with ASIC tape-out, typically cutting the schedule by 3 to 6 months.
Recommended
Wireless Base Station Baseband
Wireless base-station baseband processing benefits from the EP1SGX25DF1020C7's dedicated hardware multipliers and embedded transceivers for CPRI links to remote radio heads. The 25,660 logic elements accommodate the chip-rate processing for 3G/4G channels, while 1,944,576 RAM bits hold the symbol data and equalizer coefficients. The 130 nm process delivers sufficient performance at low enough power for fan-cooled shelf designs, and the 0-85 C commercial temperature range covers most indoor base-station installations.
Recommended
Video Broadcast and Imaging Processing
Broadcast video routers and medical imaging systems use the EP1SGX25DF1020C7 for real-time SDI/HD-SDI aggregation and pixel-pipeline processing. The 24 transceivers aggregate multiple SDI streams while the logic fabric implements de-interlacing, scaling, and color-space conversion. The 607 user I/Os connect to large DDR memory banks for frame buffering, and 1,944,576 embedded RAM bits provide line and block caches. The 1020-ball FCBGA supports controlled-impedance routing for the multi-gigabit SDI links.
Recommended
Industrial High-Speed Data Acquisition
Industrial data-acquisition systems in test-and-measurement, RADAR, and signal-intelligence use the EP1SGX25DF1020C7 to aggregate multiple ADC/DAC channels running at hundreds of MSPS. The 24 transceivers stream digitized IF data to downstream processors over XAUI or Serial RapidIO, and 25,660 logic elements implement digital down-conversion and FFT pre-processing. The 1.5 V core and FC-BGA package provide clean power and ground for low-jitter ADC clock distribution, critical for SFDR above 70 dB.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF1020C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF1020C6N | EP1SGX25DF1020C6 | EP1SGX25DF1020C5N | EP1SGX25DF1020C5 | EP1SGX25DF1020C6ES |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-BBGA, FCBGA (33 x 33 mm, 1 mm pitch) | 1020-BBGA, FCBGA - same | 1020-BBGA, FCBGA - same | 1020-BBGA, FCBGA - same | 1020-BBGA, FCBGA - same | 1020-BBGA, FCBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Number of LABs/CLBs | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Number of I/Os | 607 | 607 | 607 | 607 | 607 | 607 |
| Speed Grade | C7 (fastest) | C6 | C6 | C5 | C5 | C6 |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| RoHS Status | Lead-Free | Lead-Free | Lead-Free | Lead-Free | Lead-Free | Lead-Free |
Key Differentiators
- C7 speed grade (fastest in Stratix GX family) (vs EP1SGX25DF1020C6)
- Drop-in pin-compatible across C5, C6, C7 speed grades (vs EP1S25F1020C7 (Stratix II))
- Maximum 607 I/Os in 33 x 33 mm FCBGA (vs EP1SGX25CF672C7 (672-ball))
Design Notes
The 1020-ball FC-BGA package with 1 mm ball pitch requires a multilayer PCB (at least 8 layers) with 1 oz copper outer layers and microvia-in-pad (VIP) technology. Escape routing from inner-row balls demands a stack-up with 4 mil trace width and 4 mil spacing. Use of high-Tg FR-4 (Tg >= 170 C) or low-loss mid-loss PCB laminates (e.g. Isola FR408HR) ensures reliable reflow at peak 245 C without warping.
Each VCCINT ball requires a 0.1 uF X7R ceramic decoupling capacitor within 5 mm, plus a 10 uF bulk capacitor per power rail. Transceiver power (VCCA, VCCP) demands separate filtering with ferrite beads to isolate switching noise. Power-on sequencing must follow the datasheet-specified order: VCCIO first, then VCCINT, then VCCA/VCCP, with maximum 100 ms delay between rails to prevent latch-up.
Estimated: at full transceiver utilization (24 lanes at 3.125 Gbps) and high logic toggle rate, the EP1SGX25DF1020C7 dissipates approximately 8 to 12 W. The FC-BGA package has theta_JC of approximately 0.3 C/W and theta_JA of approximately 10 C/W with a proper heatsink. Without forced airflow, a heatsink with thermal interface material rated at 0.5 C/W or better is mandatory. Compute junction temperature rise from Theta_JA and ambient; ensure Tj stays below 100 C for commercial-grade reliability.
Differential transceiver pairs must be routed as 100 ohm differential lines with intra-pair skew under 1 ps per cm. Use length-matched serpentine tuning on long routes and avoid 90-degree bends - all turns must use 45-degree angles. Reference planes for the transceivers should be continuous GND with no plane splits across the routing region. Maintain at least 4W (4 x dielectric thickness) spacing to other signals.
Compliance Information
Lead-Free per Altera/Intel packaging documentation. Not AEC-Q100 qualified - this is a commercial-grade FPGA. For automotive applications, consult Intel automotive-grade Stratix variants separately.
