EP1SGX25FF1020C7ES - Stratix GX FPGA 25K LE FC-FBGA-1020 | Altera
MPN: EP1SGX25FF1020C7ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 50 | $1620 | $81,000.00 |
| 100 | $1540 | $154,000.00 |
| 500 | $1395 | $697,500.00 |
Drop-in alternatives for EP1SGX25FF1020C7ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25FF1020C7ES Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| User I/Os | 607 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Operating Temperature | 0 C to 85 C |
| Package Type | FC-FBGA-1020 |
| Package Size | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Speed Grade | C7 |
| Configuration Memory | SRAM (external configuration device required) |
| Embedded Transceivers | Yes (multi-gigabit serial channels) |
| Embedded Memory | TriMatrix memory blocks |
| DSP Blocks | Yes (dedicated hardware multipliers) |
| Lead Free | Yes |
EP1SGX25FF1020C7ES 33 x 33 mm Pin Configuration Guide
Complete pinout information for EP1SGX25FF1020C7ES (33 x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25FF1020C7ES.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25FF1020C7ES is suitable for 6 applications: Telecommunications Backhaul Equipment, Radar and Signal Intelligence Processing, Video Broadcast Infrastructure, Industrial Test & Measurement Backplanes, Legacy Avionics and Defense Systems, Medical Imaging Front-End Processing.
Telecommunications Backhaul Equipment
The EP1SGX25FF1020C7ES is well-suited for telecom backhaul line cards where multi-gigabit serial transceivers terminate OTU/SONET/SDH optical links. Its 25,660 logic elements run MAC-layer processing, framing, and pseudo-wire encapsulation, while embedded transceiver channels directly drive SFP+/XFP modules. The 1.5V core and 130 nm Stratix GX architecture balance dynamic power with deterministic latency for carrier-grade deployments, and the FC-FBGA-1020 package gives ample signal breakout for high-density backplane connectors.
Recommended
Radar and Signal Intelligence Processing
For SDR and ELINT/EW front-ends, the EP1SGX25FF1020C7ES delivers embedded DSP blocks and dedicated hardware multipliers that perform FFTs, pulse compression, and channelization in real time. Transceiver channels digitize raw IF at multi-Gsps, and TriMatrix memory buffers samples between pipeline stages. The 607 user I/Os interface to ADC/DAC mezzanines, while the FC-FBGA-1020 33 x 33 mm footprint supports dense routing of differential SERDES lanes on low-loss PCB stack-ups. Latency is deterministic because DSP blocks are hard-wired silicon, not soft cores.
Recommended
Video Broadcast Infrastructure
In SD/HD/3G-SDI broadcast routers and format converters, the EP1SGX25FF1020C7ES provides the parallel fabric required to switch and scale uncompressed video streams in real time. The 25,660 LEs host de-interlacers, scalers, and color-space converters, while the 607 I/Os interface to multiple SDI serializer/deserializer chips. The FC-FBGA-1020 package's perimeter I/O density accommodates large fan-out to BNC connector banks, and the 1.5V core and embedded memory simplify power-tree design for studio equipment that must run cool and quiet.
Recommended
Industrial Test & Measurement Backplanes
ATE pin-electronics cards and high-channel-count instrumentation benefit from the EP1SGX25FF1020C7ES's combination of user I/O density and logic capacity. The FPGA orchestrates per-pin timing, levels, and pattern sequencing while driving 607 channels of stimulus or capture logic. The 1.0 mm pitch FC-FBGA-1020 package permits dense routing to high-pin-count mezzanines, and the extended-screening -ES tier helps qualify boards for industrial production lines. Configuration is straightforward via JTAG or EPCS serial flash.
Recommended
Legacy Avionics and Defense Systems
The EP1SGX25FF1020C7ES is widely deployed in legacy avionics data buses (MIL-STD-1553, ARINC 429 bridges) and defense signal-processing subsystems. The 130 nm Stratix GX silicon has proven reliability records in safety-critical and aerospace platforms, and the FC-FBGA-1020 package's thermal mass suits sealed, conduction-cooled enclosures. For new designs, the -ES extended-screening tier reduces field failure risk. Existing programs continue to use this part because qualified FPGA bitstreams and design libraries are deeply embedded in deployed systems.
Recommended
Medical Imaging Front-End Processing
In ultrasound beamformers, CT reconstruction pipelines, and MRI receiver chains, the EP1SGX25FF1020C7ES delivers deterministic DSP throughput via dedicated multipliers and TriMatrix memory buffers. The transceiver-rich fabric accepts digitized RF from multi-channel ADC arrays, while user I/Os connect to LVDS-based image sensor links. The FC-FBGA-1020 33 x 33 mm footprint supports tight PCB integration in cart-based imaging consoles, and the 1.5V core simplifies medical-grade EMC filtering designs.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FF1020C7ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF1020C7ES | EP1SGX25DF1020C7N | EP1SGX25DF1020C7 | EP1SGX25CF1020C7 | EP1S60F1020C7 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | FC-FBGA-1020 (33x33 mm, 1.0 mm pitch) | FC-FBGA-1020 (33x33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1.0 mm pitch) - same |
| Family | Stratix GX | Stratix GX DF | Stratix GX DF | Stratix GX DF | Stratix GX CF | Stratix (non-GX) |
| Logic Elements | 25,660 | ~25,660 (same die) | ~25,660 (same die) | ~25,660 (same die) | ~25,660 (same die) | ~57,120 (~2.4x) |
| User I/Os | 607 | 607 (same) | 607 (same) | 607 (same) | 607 (same) | 606 (approx) |
| Embedded Transceivers | Yes (multi-Gbps) | Yes (same GX family) | Yes (same GX family) | Yes (same GX family) | Yes (same GX family) | No (non-GX) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Screening Tier | Extended (-ES) | Extended (-ES) | Standard + lead-free | Standard | Standard | Standard |
| Lifecycle Status | Obsolete | Obsolete (NRND) | Obsolete (NRND) | Obsolete (NRND) | Obsolete (NRND) | Obsolete (NRND) |
Key Differentiators
- Drop-in pin-compatible Stratix GX DF variant with extended temperature screening (vs EP1SGX25DF1020C7ES)
- Approximately 2.4x logic density in the same footprint for scaling designs (vs EP1S60F1020C7)
- Same die/package with different finish or screening for qualification flexibility (vs EP1SGX25DF1020C7N)
Design Notes
The EP1SGX25FF1020C7ES requires multiple power rails: 1.5 V core, dedicated PLL analog supply, transceiver channel supplies, and per-bank I/O voltages (typically 1.5V/1.8V/2.5V/3.3V). Per the Stratix GX Hardware Reference Manual, ramp rates must follow the manufacturer's sequencing to avoid latch-up. Bulk decoupling of 100 uF polymer plus 0.1 uF/10 nF ceramic network on each rail is recommended. Estimate: ~15-20W typical consumption with all transceivers active.
The FC-FBGA-1020 33 x 33 mm 1.0 mm pitch package requires a high-density PCB stack-up - typically 8 to 12 layers with microvia-in-pad construction. Per the Altera package specifications, escape routing under the BGA needs sub-100 um line/space rules. Allocate at least 4 layers for ground and 2 for VCC to maintain signal integrity on multi-Gbps SERDES lanes. Use solder mask-defined (SMD) pads rather than NSMD if rework is anticipated.
Configuration failure is a frequent bring-up issue: ensure MSEL pins are strapped correctly for the desired configuration mode (AS, PS, JTAG) and that the EPCS flash device is sized for the compressed bitstream. Per the Stratix GX datasheet, nCONFIG must be held low during power ramp and released only after all rails stabilize. Also confirm the JTAG chain order if multiple devices share TCK/TMS - a swap here can brick programming.
Estimated: At full logic utilization with all transceivers active, junction temperature may rise 30-40 C above ambient without airflow. The FC-FBGA-1020 package has theta_JA around 1-2 C/W with a properly designed thermal via array under the die (per Altera thermal guidelines). For long-term reliability, keep Tj below 100 C. A heatsink is generally required for industrial deployments; sealed enclosures need conduction-cooled cold plates.
Compliance Information
RoHS compliance marked [DATA_NEEDED] because the verified web data does not explicitly state the directive status. Lead-free is confirmed per the Altera package marking (FC-FBGA lead-free finish). This is an obsolete part not recommended for new designs; reach/aec compliance should be confirmed with Intel/Altera before military/automotive deployment.
