EP1SGX40FF1020I5 - Stratix GX FPGA, 41,250 LEs | Intel
MPN： EP1SGX40FF1020I5 ✗ 停產EP1SGX40FF1020I5 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP blocks. FPGAs sit within the broader hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field via SRAM-based configuration bitstreams, which makes them ideal for prototyping, low-volume production, and applications requiring hardware-level parallelism.
Key features include dedicated full-duplex transceivers supporting CPRI, OBSAI, GigE, SerialLite, and PCI Express, embedded tri-matrix memory for distributed RAM/ROM, a robust PLL and clock network, and support for high-speed external memory interfaces such as DDR SDRAM, QDR SRAM, and RLDRAM. The 1020-ball FineLine BGA package provides a 1.0 mm pitch, optimizing signal integrity while keeping board area manageable for high-I/O designs.
Architecturally, the Stratix GX family integrates hardened transceiver channels with the programmable fabric, dramatically reducing logic utilization for serial I/O and lowering latency compared to soft IP implementations. The 130 nm CMOS process enables a balance of density, performance, and power efficiency suited to telecom, networking, and high-end signal-processing designs.
Typical applications include 10 Gbps telecom backhaul, multi-gigabit serial interface bridging, baseband processing, test and measurement instrumentation, and high-speed data acquisition. The hardened transceivers are particularly valuable where deterministic latency and protocol compliance (such as CPRI/OBSAI in wireless base stations) are required.
When designing with this device, pay careful attention to PCB layout for the 1.0 mm-pitch BGA: matched-length routing, controlled impedance (typically 50 ohm differential for transceivers), and adequate thermal management are essential. Power sequencing must follow the Stratix GX guidelines to avoid latch-up or in-rush damage during configuration.
This page synthesizes distributor pricing, verified drop-in alternatives from the Stratix GX family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a one-stop reference for sourcing and applying this legacy high-performance FPGA.
直接替換替代品，適用於 EP1SGX40FF1020I5 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX40FF1020I5 （相同外形與佔位） — 差異在於 Operating Temperature, Package, Speed Grade, Family, Process Technology.
EP1SGX40FF1020I5N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP1SGX40FF1020I7N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP1SGX40FF1020I6N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP1SGX40FF1020C7
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1SGX40FF1020C6
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1SGX40FF1020C5
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1SGX40FF1020I5 最大額定值與電氣特性
| Family | Stratix GX |
| Logic Elements (LEs) | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Process Technology | 130 nm CMOS |
| Configuration | SRAM-based LUT |
| Nominal Core Supply Voltage | 1.5 V |
| 封裝 | 1020-ball FineLine BGA (FF1020) |
| Terminal Pitch | 1.00 mm |
| Package Shape | Square |
| 工作溫度 | -40C to +100C (Industrial) |
| Speed Grade | I5 |
| 安裝類型 | Surface Mount (BGA) |
| Logic Family | CMOS |
| Hardened Transceivers | 3.125 Gbps multi-channel (per Stratix GX family) |
EP1SGX40FF1020I5 square 腳位配置指南
EP1SGX40FF1020I5（square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX40FF1020I5.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX40FF1020I5 適用於 6 應用s: 10 Gbps Telecom Backhaul Equipment, Multi-Gigabit Serial Interface Bridging, Baseband Signal Processing, Test and Measurement Instrumentation, High-Speed Data Acquisition Systems, Legacy Network Switch and Router Line Cards.
10 Gbps Telecom Backhaul Equipment
The EP1SGX40FF1020I5 is well-suited to telecom backhaul applications where its hardened 3.125 Gbps multi-channel transceivers provide native support for CPRI and OBSAI protocols commonly used between base station radio units and baseband units. With 41,250 logic elements and 4,125 CLBs, the device can implement baseband processing, framer/mapper logic, and protocol adaptation alongside the serial I/O, reducing the bill of materials. The industrial -40C to +100C temperature range lets the part operate in outdoor cabinet environments. For new designs, expect to use this part in legacy backhaul upgrades where the existing PCB layout, BOM, and qualification work have already been done.
推薦
Multi-Gigabit Serial Interface Bridging
The EP1SGX40FF1020I5's hardened transceiver channels make it ideal for protocol-bridging cards that aggregate multiple lower-speed serial links (GigE, SerialLite, PCI Express) into a higher-speed uplink. The 41,250 LEs provide ample fabric for custom bridging state machines, packet buffering, and clock-domain crossing, while the embedded tri-matrix memory absorbs transient buffering. Design teams can place this part on a line card to bridge legacy interfaces without needing an external PHY per channel. Latency is deterministic because the transceiver IP is hardened rather than implemented in soft logic.
推薦
Baseband Signal Processing
The EP1SGX40FF1020I5's 41,250 logic elements, combined with Stratix GX-family DSP blocks and embedded memory, enable real-time baseband processing for wireless systems including channel coding, modulation/demodulation, and FFT/iFFT operations. The 1.5 V core supply keeps dynamic power manageable, while the industrial temperature grade allows deployment in outdoor radio units. For designs already qualified on this part, the same Quartus II tool flow can be reused, preserving IP investment.
推薦
Test and Measurement Instrumentation
Test and measurement equipment such as logic analyzers, protocol exercisers, and high-speed digitizers benefit from the EP1SGX40FF1020I5's combination of high logic density, dedicated transceivers for stimulus/response channels, and abundant embedded memory for trace capture. The 1020-ball FF1020 BGA provides the I/O count needed to drive wide parallel buses alongside multi-channel serial links. Because the part is well-characterized in long-standing design tools, instrument vendors can re-use existing firmware and IP libraries to minimize time-to-market for new platforms.
推薦
High-Speed Data Acquisition Systems
High-speed data acquisition cards for radar, lidar, medical imaging, and scientific instrumentation require parallel ADC interfaces plus high-speed serial uplinks, both of which the EP1SGX40FF1020I5 supports. The 41,250 LEs and embedded memory blocks can implement front-end DSP, decimation, and packetization, while the hardened transceivers move data off-card at multi-gigabit rates. The industrial temperature range supports outdoor and laboratory environments. Designers should plan for FPGA configuration storage (typically EPCS or compatible serial flash) and JTAG access for production programming.
推薦
Legacy Network Switch and Router Line Cards
The EP1SGX40FF1020I5 is well-suited to legacy switch and router line cards where multi-gigabit serial interfaces aggregate network traffic and custom forwarding logic is implemented in FPGA fabric. The 3.125 Gbps transceivers handle uplinks, while the 41,250 LEs implement classification, queuing, and traffic management. Because the part is in the same Stratix GX family as older designs, engineers can leverage existing reference designs and qualification data, accelerating maintenance and upgrade cycles for installed equipment.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX40FF1020I5 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX40FF1020I5N | EP1SGX40FF1020I7N | EP1SGX40FF1020I6N | EP1SGX40FF1020C7 | EP1SGX40FF1020C6 | EP1SGX40FF1020C5 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FineLine BGA (FF1020) | 1020-ball FineLine BGA (FF1020) - same | 1020-ball FineLine BGA (FF1020) - same | 1020-ball FineLine BGA (FF1020) - same | 1020-ball FineLine BGA (FF1020) - same | 1020-ball FineLine BGA (FF1020) - same | 1020-ball FineLine BGA (FF1020) - same |
| Logic Elements | 41,250 | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) |
| Configurable Logic Blocks (CLBs) | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I5 | I5 | I7 (faster) | I6 (faster than I5) | C7 (slower, commercial) | C6 (slower, commercial) | C5 (slower, commercial) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Hardened Transceivers | 3.125 Gbps multi-channel | 3.125 Gbps multi-channel | 3.125 Gbps multi-channel | 3.125 Gbps multi-channel | 3.125 Gbps multi-channel | 3.125 Gbps multi-channel | 3.125 Gbps multi-channel |
主要差異化特點
- Lead-free terminal finish (RoHS-compliant variant) (對比EP1SGX40FF1020I5 (base part))
- Faster speed grade (I7 vs I5) (對比EP1SGX40FF1020I5)
- Lower-density alternative with same family IP (對比EP1SGX40FF1020I5)
設計說明
The 1020-ball FineLine BGA has a 1.00 mm ball pitch and requires a high-density PCB with microvia or via-in-pad construction for reliable breakout routing. Use a multi-layer stackup with dedicated ground and power planes adjacent to the BGA, and follow Altera's Stratix GX package pinout documentation for ball-map assignments. Decoupling capacitors should be placed as close to each power pin as the breakout allows, with a mix of bulk, mid-frequency, and high-frequency values to cover the device's wide switching spectrum. Trace impedance targets: 50 ohm single-ended for general-purpose I/O and 100 ohm differential for transceiver channels.
The Stratix GX family at full utilization can dissipate 5 to 15 W depending on clock rate and toggle activity; the FF1020 package offers a moderate thermal path via the BGA balls. Use thermal vias in the BGA land pattern to conduct heat to internal copper planes, and consider a heatsink or heat-spreader for designs operating at sustained high utilization. Estimate: at 10 W dissipation and 15 C/W theta-JA, junction rise is approximately 150 C above ambient, so a thermal management strategy is critical for industrial-grade (-40C to +100C) deployments.
Configuration bitstream storage and JTAG access must be planned at board level: use an Altera EPCS serial configuration device or compatible flash, and bring out the JTAG TDI/TDO/TMS/TCK pins to a header for factory programming and field updates. Power sequencing must follow the Stratix GX datasheet: bring up VCCINT before VCCIO and VCCHIP, in the order specified, to avoid latch-up. Do not assume the I5 temperature grade is interchangeable with C-grade variants when re-spinning legacy designs, and verify that any speed-grade substitution (e.g., I5 to I7) is supported in your Quartus II fitter settings.
合規資訊
RoHS/lead-free status not explicitly stated in the verified web data; the 'N' suffix on variants such as EP1SGX40FF1020I5N indicates lead-free terminal finish per Altera/Intel part-number convention. AEC-Q100 not applicable (FPGA logic device).
