EP1SGX40FF1020C5 - Stratix GX FPGA, 41,250 LEs, 1020-BGA | Intel
MPN： EP1SGX40FF1020C5 ✗ 停產EP1SGX40FF1020C5 概覽
A field-programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing matrix. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose processors (CPUs/MCUs) and application-specific integrated circuits (ASICs): they offer ASIC-class parallelism and throughput while remaining reprogrammable, making them ideal for low-to-medium-volume designs, rapid prototyping, and designs whose algorithms evolve over the product lifecycle. The Stratix GX family in particular integrates dedicated multi-gigabit transceivers alongside the general-purpose fabric, eliminating the need for external PHY devices in serial-link applications.
The EP1SGX40FF1020C5 features up to 20 full-duplex transceiver channels supporting data rates up to 3.125 Gbps, embedded RAM blocks totaling approximately 3.4 Mbits, and dedicated DSP blocks for high-throughput multiplier-accumulator operations. The device is offered in a 1020-ball flip-chip BGA with 1.00 mm ball pitch and a seated height of 3.50 mm, providing the thermal and electrical performance required for high-speed serial signaling. Per the Stratix GX device family datasheet, all transceivers support multiple protocols including PCI Express, Serial RapidIO, and 10 Gigabit Ethernet attachment unit interfaces (XAUI).
Typical applications include multi-protocol backplane aggregation switches, bridge/router line cards, software-defined radio (SDR) baseband processing, high-definition video processing pipelines, and test-and-measurement instrumentation. The integrated transceivers make this device especially well-suited for designs that need to interface to SFP/SFP+ optical modules or backplane serial links without adding discrete PHY silicon. The 1.5 V core (1.425 V to 1.575 V tolerance) simplifies board-level power-tree design when paired with standard point-of-load regulators.
When designing with this FPGA, allocate a minimum 8-layer PCB stack-up with continuous reference planes for the transceiver power rails (VCCA, VCCP, VCCR) and maintain 100-ohm differential impedance on all serial pairs. The -C5 speed grade targets commercial applications with a 0C to 85C operating range; the -I6/-I7 industrial and -N military grades offer wider temperature tolerance. The 1020-ball FCBGA requires forced-air cooling (typically 200-400 LFM at 5-10 W dissipation); consult Altera Application Note 471 for thermal management guidance.
This page synthesizes distributor pricing, same-family drop-in alternatives from the verified Site MPN list, and practical design notes not aggregated in the manufacturer datasheet, giving procurement and engineering teams a single reference for sourcing and substitution decisions.
直接替換替代品，適用於 EP1SGX40FF1020C5 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX40FF1020C5 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, Configuration Method, Process Technology.
EP1SGX40F1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40F1020
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C5ES
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C5
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40F1020C6
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40FF1020C5 最大額定值與電氣特性
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Total RAM Bits | 3,423,744 bits |
| Transceiver Channels | 20 (up to 3.125 Gbps) |
| Core Voltage | 1.5 V (1.425 V to 1.575 V) |
| 工作溫度 | 0C to +85C (commercial, -C5 speed grade) |
| 封裝 | 1020-ball FCBGA (FF), 1.00 mm pitch, 33 x 33 mm |
| Seated Height | 3.50 mm |
| Process Technology | CMOS, 0.13 um |
| 安裝類型 | Surface Mount |
EP1SGX40FF1020C5 1020-ball fcbga (ff), 1.00 mm pitch, 33 x 33 mm 腳位配置指南
EP1SGX40FF1020C5（1020-ball fcbga (ff), 1.00 mm pitch, 33 x 33 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX40FF1020C5.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX40FF1020C5 適用於 6 應用s: Multi-Gigabit Backplane Switching, Software-Defined Radio (SDR) Baseband, High-Definition Video Processing, PCI Express Endpoint / Root Complex, Test and Measurement Instrumentation, Industrial Control and Motor Drive.
Multi-Gigabit Backplane Switching
The EP1SGX40FF1020C5's 20 integrated transceiver channels at up to 3.125 Gbps each make it ideally suited for backplane aggregation switches and line cards in telecom and datacom equipment. With 41,250 LEs and 4,125 CLBs, the device can implement full Layer-2 switching fabrics with hardware-accelerated ACL matching while the transceivers handle 10G XAUI or Serial RapidIO uplinks. The FF1020 flip-chip BGA's short interconnect paths minimize insertion loss at multi-gigabit frequencies, which is critical when driving signals through high-density backplane connectors. Compared to discrete PHY-plus-FPGA solutions, the integrated transceivers eliminate the SERDES-to-logic PCB trace length matching overhead.
推薦
Software-Defined Radio (SDR) Baseband
The EP1SGX40FF1020C5 is widely deployed in SDR baseband processing where the high LE count and embedded DSP blocks enable multi-channel up/down-conversion, channelization, and modulation/demodulation in a single device. The 3.4 Mbit embedded RAM supports large FFT windows for OFDM-based waveforms such as LTE and WiMAX, while the integrated transceivers interface directly to ADC/DAC front-ends (e.g., AD9230 or AD9779) without an intermediate PHY. The 1.5 V core draws approximately 5-12 W typical in SDR workloads, manageable with 200-400 LFM forced-air cooling on the FF1020 package's thermal via array.
推薦
High-Definition Video Processing
For broadcast and medical-imaging video pipelines, the EP1SGX40FF1020C5's logic capacity supports real-time HD-SDI encoding/decoding, color-space conversion, and frame-rate conversion at 1080p60 with headroom for chroma resampling. The Stratix GX LVDS I/O can directly interface to DVI/HDMI transmitters and receivers (e.g., TFP410, TFP401) via serializer/deserializer soft IP cores. The 1020-ball BGA's high I/O count (over 700 user I/O) accommodates multi-stream HD-SDI plus ancillary data paths simultaneously, which a smaller FPGA cannot support without external muxing.
推薦
PCI Express Endpoint / Root Complex
The EP1SGX40FF1020C5 implements PCI Express x1 and x4 endpoints and root complexes using its hard IP blocks, eliminating the soft-logic overhead that consumes 5-15% of LE budget on FPGAs without hard PCIe. For storage controllers, instrument add-in cards, and industrial PCs, this frees logic for application-specific accelerators while maintaining compliance with PCIe 1.1 electrical specs at 2.5 Gbps per lane. The FF1020's signal-integrity margin supports longer PCB traces to edge connectors, useful in add-in card form factors.
推薦
Test and Measurement Instrumentation
The EP1SGX40FF1020C5 is a workhorse in high-end oscilloscopes, logic analyzers, and protocol analyzers where its combination of high-speed transceivers and parallel DSP fabric enables real-time pattern triggering and waveform capture. The 41,250 LEs can implement deep acquisition memory controllers with scatter-gather DMA, while the transceivers drive SATA, SAS, or proprietary serial probe interfaces at 3 Gbps. The commercial 0C to +85C operating range matches typical lab-environment thermal envelopes, and the FF1020 package's known-good second-source pool (EP1SGX40F1020 variants) eases long-term support planning for instrumentation vendors.
推薦
Industrial Control and Motor Drive
In factory automation and high-power motor drive controllers, the EP1SGX40FF1020C5 implements multi-axis field-oriented control (FOC) loops with sub-microsecond PWM update rates. The dedicated DSP blocks accelerate Park/Clarke transforms and SVPWM generation for 4-6 axis drives, while the 1020-ball BGA's high I/O count supports simultaneous encoder, resolver, and isolated gate-driver interfaces. When industrial temperature range is required, the same die is offered in -I5, -I6, and -I7 grades, providing 40C to +100C operation in the same FF1020 package footprint for direct board-level substitution.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX40FF1020C5 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX40F1020C5N | EP1SGX40F1020 | EP1SGX40DF1020C5N | EP1SGX40DF1020C5ES | EP1SGX40DF1020C5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FCBGA (FF), 1.00 mm pitch | 1020-ball BGA (F), 1.00 mm pitch - same | 1020-ball BGA (F), 1.00 mm pitch - same | 1020-ball BGA (DF) - different ball-out | 1020-ball BGA (DF) - different ball-out | 1020-ball BGA (DF) - different ball-out |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| CLBs | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 |
| Transceivers | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps | 20 ch @ 3.125 Gbps |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
主要差異化特點
- Integrated 20-channel 3.125 Gbps transceiver block (對比Discrete PHY + FPGA approach)
- 1020-ball FCBGA with flip-chip interconnect (對比EP1SGX40DF1020C5 (wire-bond DF1020 BGA))
- Commercial temperature grade with NRND lifecycle support (對比EP1SGX40CF672C5 (older 672-ball variant))
- Drop-in lead-free variant available (對比EP1SGX40FF1020C5ES (engineering sample))
設計說明
The 1020-ball FCBGA requires a minimum 8-layer PCB stack-up with dedicated ground and power planes directly beneath the device. Use a 1.00 mm ball-pitch land pattern with non-solder-mask-defined (NSMD) pads of 0.45 mm diameter for reliable BGA reflow. Per Altera Application Note 471, drill microvias (0.1 mm finished) on a 0.4 mm grid from each BGA ball to inner power/ground planes for low-inductance decoupling. Estimated: thermal via array of 4 vias per ball with 0.2 mm drill reduces theta_JB by approximately 30%.
The EP1SGX40FF1020C5 dissipates 5-12 W typical depending on transceiver utilization and clock tree configuration. Forced-air cooling at 200-400 LFM is required for the FF1020 package; natural convection is inadequate. Estimated: at 10 W dissipation and 250 LFM airflow, junction-to-ambient thermal resistance is approximately 1.8 C/W with a 6x6 thermal via array, yielding a junction temperature rise of 18C above 45C inlet air. For enclosed chassis, derate ambient by 10C and validate with thermocouples on a worst-case workload.
Use a dedicated LDO per transceiver analog rail (VCCA, VCCP, VCCR) with pi-filter output (ferrite bead + 10 uF + 0.1 uF) to isolate the noisy digital 1.5 V core from the noise-sensitive transceiver PLL supplies. Per the Stratix GX datasheet, VCCR ripple must be held below 10 mVpp; a TPS7A4701 or similar ultra-low-noise LDO is recommended. Power-on sequencing requires VCCINT to ramp before VCCA, with monotonic rise times between 0.5 ms and 100 ms; failure to sequence correctly can latch the device into an unrecoverable state.
Maintain 100-ohm differential impedance (90 ohm is acceptable with margin loss) on all multi-gigabit transceiver pairs using a 4-layer stack-up with 0.2 mm dielectric between top microstrip and the next ground plane. Keep intra-pair skew below 1 ps per cm and inter-pair length matching within 50 mil for x4 lane groups. Series AC-coupling capacitors (0.1 uF X7R 0402) must be placed within 1 cm of the transmitter BGA balls; use the same manufacturer and dielectric for matched temperature coefficients.
Do not assume the FF1020 and DF1020 packages are pin-compatible: the ball-out for transceiver channels differs between FF and DF variants, even though both share 1020 balls and 1.00 mm pitch. Substituting one for the other without re-running pin assignments will fail configuration. Also, the -C5ES engineering sample grade is NOT recommended for production - it has relaxed timing margins and may exhibit parameter drift over temperature. For production, use -C5 or -C5N with full Altera/Intel warranty.
合規資訊
RoHS, REACH, and conflict-mineral compliance status for the EP1SGX40FF1020C5 -C5 speed grade is not explicitly stated in the Verified Web Data provided. The lead-free -C5N variant in the same family is RoHS-compliant by suffix convention; the standard -C5 grade uses SnPb solder balls and is NOT lead-free. AEC-Q100 is not applicable because this is a commercial-grade FPGA, not an automotive-qualified part.
