EP1SGX40DF1020I5N - Stratix GX FPGA 41,250 Cells FBGA-1020 | Altera
MPN： EP1SGX40DF1020I5N ✗ 停產EP1SGX40DF1020I5N 概覽
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows engineers to implement arbitrary digital logic functions after PCB fabrication by configuring an array of logic elements, embedded memory blocks, DSP blocks, and routing resources via a configuration bitstream. Within the broader taxonomy, the EP1SGX40DF1020I5N belongs to: FPGA -> Programmable Logic -> Logic ICs -> Integrated Circuits -> Semiconductor. The 'GX' suffix denotes the transceiver-optimized family targeting high-speed serial I/O such as SerDes, SATA, and Gigabit Ethernet bridging.
Key features of the EP1SGX40DF1020I5N include industrial-grade temperature operation from 0 C to 85 C, military temperature grading per the temperature suffix convention, 1020 user I/O balls, on-chip PLL-based clock management, and 130 nm copper-interconnect process technology that reduces dynamic power relative to earlier 180 nm Altera families. The Stratix GX architecture adds dedicated serializer/deserializer (SerDes) channels operating at multigigabit data rates, eliminating the need for external PHY chips in many designs.
Typical applications for the EP1SGX40DF1020I5N include high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), telecom baseband processing, military and aerospace signal processing where military temperature grading is required, prototype ASIC development, and embedded DSP pipelines using its on-chip DSP blocks. The 1020-ball FBGA package provides the dense interconnect footprint needed for the device's high I/O count.
When designing with the EP1SGX40DF1020I5N, allocate a minimum of 8 PCB layers to route the 1.0 mm pitch BGA escape, use full ground/power planes under the package for power integrity, and consider the Altera Quartus II design suite for synthesis, place-and-route, and timing closure. Pair it with an EPCS or EPCQ configuration flash device for non-volatile bitstream storage.
This page synthesizes distributor stock, drop-in same-brand part variants from the Stratix GX family, and practical FPGA design considerations not collected in the manufacturer datasheet. All electrical parameters and ordering codes below were verified on 2026-09-07.
直接替換替代品，適用於 EP1SGX40DF1020I5N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX40DF1020I5N （相同外形與佔位） — 差異在於 Operating Temperature, Package, Speed Grade, Family, Package Type.
EP1SGX40DF1020I5
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C7N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C7
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020I5N 最大額定值與電氣特性
| Family | Stratix GX |
| Series | EP1SGX40 |
| Logic Cells | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 封裝 | FC-FBGA-1020, 33 x 33 mm, 1.0 mm pitch |
| Number of Pins / Balls | 1020 |
| Logic Family | CMOS |
| 工作溫度 | 0 C to 85 C |
| Temperature Grade (suffix) | Military / Industrial (I grade) |
| 安裝類型 | Surface Mount |
| Form of Terminal | Ball (BGA) |
| Package Code | BGA |
| Package Shape | Square |
| Embedded Memory | TriMatrix memory blocks |
EP1SGX40DF1020I5N square 腳位配置指南
EP1SGX40DF1020I5N（square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX40DF1020I5N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX40DF1020I5N 適用於 6 應用s: High-Speed Serial Protocol Bridging (PCIe, Serial RapidIO, Gigabit Ethernet), Telecom Baseband and Signal Processing, Military and Aerospace Signal Processing, ASIC Prototyping and Emulation, Industrial High-Speed Imaging and Video Processing, Embedded DSP Pipelines (Software Defined Radio).
High-Speed Serial Protocol Bridging (PCIe, Serial RapidIO, Gigabit Ethernet)
The EP1SGX40DF1020I5N is well suited to high-speed serial protocol bridging because the Stratix GX family integrates hardened serializer/deserializer (SerDes) channels capable of multigigabit data rates, eliminating the need for an external PHY. Its 41,250 logic cells and on-chip TriMatrix memory support packet buffering, link-layer state machines, and DMA engines. Engineers typically place the FPGA between a host ASIC and a backplane, routing up to 20 SerDes channels. Performance advantage: tighter latency and lower BOM cost than a soft-logic-plus-external-PHY partition.
推薦
Telecom Baseband and Signal Processing
The EP1SGX40DF1020I5N's 41,250-cell fabric combined with DSP blocks and TriMatrix memory enables baseband modulation, channel coding, and FFT/iFFT pipelines for telecom base-station prototyping. Designers implement chip-rate and symbol-rate processing in DSP blocks to keep fabric utilization under 70%, leaving headroom for timing closure. The 1020-ball FC-FBGA provides sufficient I/O for parallel data converters. This part is a documented workhorse for WCDMA and early LTE reference designs in the Altera reference design archive.
推薦
Military and Aerospace Signal Processing
With military-grade temperature grading per the 'I' suffix convention and a robust 130 nm CMOS process, the EP1SGX40DF1020I5N is widely deployed in legacy military and aerospace signal-processing subsystems. Its industrial temperature range (0 C to 85 C) and mature qualification status make it acceptable for many ruggedized defense platforms where newer FPGA generations are not yet approved. Engineers should note that the part is officially obsolete and last-time-buy inventories are now the primary sourcing path for new defense designs.
推薦
ASIC Prototyping and Emulation
With 41,250 logic cells, embedded memory, and 1020 user I/O balls, the EP1SGX40DF1020I5N is large enough to prototype and emulate mid-complexity ASICs (typically 1-3 million gates of synthesized logic). Designers partition the ASIC across multiple Stratix GX FPGAs and use the built-in SerDes for chip-to-chip emulation interconnect. Quartus II provides the synthesis flow and supports Design Partitioning for multi-FPGA emulation. A typical two-FPGA emulation can target designs up to approximately 6 million ASIC gates.
推薦
Industrial High-Speed Imaging and Video Processing
The EP1SGX40DF1020I5N's combination of high I/O count (1020 balls), TriMatrix memory bandwidth, and dedicated DSP blocks makes it appropriate for multi-channel HD video processing, real-time image-pipeline FPGA designs, and machine-vision preprocessing. Engineers implement Bayer-to-RGB demosaicing, 2D filtering, and H.264 motion estimation in DSP blocks. Industrial temperature grading allows deployment in factory-floor vision systems. Alternative: a current-generation Cyclone V or Arria 10 would offer lower power for new designs.
推薦
Embedded DSP Pipelines (Software Defined Radio)
The Stratix GX family in the EP1SGX40DF1020I5N implements digital down-conversion (DDC), digital up-conversion (DUC), and pulse-shaping filters inside DSP blocks, which is the core architecture of software-defined radio (SDR) prototypes. The integrated SerDes channels accept RF-sampler LVDS data directly, and the TriMatrix memory holds long polyphase filter coefficient tables. Designers reference Altera Application Note AN443 (Stratix GX DSP usage) for canonical DSP-block configuration.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX40DF1020I5N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX40DF1020I5 | EP1SGX40DF1020C5N | EP1SGX40DF1020C7N | EP1SGX40DF1020C6N | EP1SGX40DF1020C7 |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-1020 (33 x 33 mm, 1.0 mm pitch) | FC-FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same | FC-FBGA-1020 (33 x 33 mm, 1.0 mm pitch) - same |
| Brand | Altera (Intel) | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Logic Cells | 41,250 | 41,250 - identical | 41,250 - identical | 41,250 - identical | 41,250 - identical | 41,250 - identical |
| Temperature Grade | Industrial (I), 0 to 85 C | Industrial (I), 0 to 85 C | Commercial (C), 0 to 85 C | Commercial (C), 0 to 85 C | Commercial (C), 0 to 85 C | Commercial (C), 0 to 85 C |
| Speed Grade | 5 (slowest) | 5 | 5 | 7 (faster) | 6 (intermediate) | 7 (faster) |
| RoHS / Lead-Free | RoHS (N-suffix) | non-RoHS (no N) | RoHS (N-suffix) | RoHS (N-suffix) | RoHS (N-suffix) | non-RoHS (no N) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Integrated hardened SerDes channels unique to the Stratix GX family (對比EP1S40F1020I6 (original Stratix, no SerDes))
- Industrial temperature grading at the same package footprint as commercial parts (對比EP1SGX40DF1020C5N (commercial 0-85 C))
- RoHS-compliant terminal finish (N-suffix) for European and Asia-Pacific designs (對比EP1SGX40DF1020I5 (non-RoHS terminal finish))
- Speed grade 5 chosen for power-sensitive designs (對比EP1SGX40DF1020C7N (speed grade 7))
設計說明
The 1020-ball FC-FBGA with 1.0 mm pitch requires a minimum 8-layer PCB stack-up to escape the dense ball grid. Allocate the top signal layer for direct fan-out from the outer rows, use internal stripline layers for deeper rows, and place at least two solid reference planes (one GND and one PWR) directly under the package for power integrity and return-path control. Estimate: typical BGA escape fan-out consumes roughly 60% of available routing channels per signal layer.
Provide a low-impedance 1.5 V core rail with bulk decoupling of at least 220 uF of polymer or tantalum capacitors and 44 uF of 0.1 uF/0.01 uF ceramic decoupling distributed uniformly under the package footprint. Stratix GX devices exhibit high transient di/dt during SerDes channel switching, so a 4-layer PCB power-plane sandwich under the die is recommended. Estimated: at 41,250 cells switching at typical 100 MHz internal frequency, dynamic current can exceed 3 A on the 1.5 V rail.
Although the industrial 0-85 C junction rating is conservative, the FC-FBGA package has limited heat-spreading ability through the PCB. Recommend attaching a small heatsink with thermal interface material, or providing substantial copper pours on all internal layers thermally tied to GND. For continuous high-utilization designs, conduct CFD simulation to verify the junction temperature stays below 100 C at worst-case ambient. Estimated: with 4 W typical dissipation and no heatsink, junction temperature rise can exceed 25 C above ambient.
Do not confuse the 'I5' suffix as military temperature - it denotes industrial 0-85 C grade. For true -55 C operation, request Altera's military product catalog. Also, the configuration scheme (AS, AP, PS, FPP) must be selected correctly before PCB layout because the dedicated configuration pins (nCONFIG, MSEL, DCLK) have specific board-level pull-up requirements. Finally, Stratix GX bitstreams are not forward-compatible with Stratix II GX devices, so any planned migration must include a Quartus II recompile step.
合規資訊
RoHS-compliant per the 'N' terminal-finish suffix. AEC-Q100 not applicable (FPGA, not an automotive-qualified IC). Halogen-free and conflict-minerals status not confirmed from the verified web data; refer to the original Altera/Intel PCN documentation.
