EP20K400FI672-2 - 400K Gates APEX-20K FPGA, 502 I/O, 672-FBGA | Altera
MPN： EP20K400FI672-2 ✗ 停產EP20K400FI672-2 概覽
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines the high-density gate-array architecture with user-defined interconnect and logic, allowing designers to implement complex digital systems, glue logic, datapath functions, and even embedded processors on a single silicon die. APEX-20K belongs to the hierarchical class of programmable logic devices (PLDs), above CPLDs, and represents the first PLD family to integrate a true system-on-a-programmable-chip (SOPC) capability via its MultiCore architecture combining look-up tables (LUTs), product-term logic, and embedded memory.
Key features of the EP20K400FI672-2 include the APEX-20K MultiCore architecture integrating LUT-based logic, embedded system blocks (ESBs) for memory and product-term logic, 4 dedicated Phase-Locked Loops (PLLs) for clock management, multi-voltage I/O support including 1.8V, 2.5V, and 3.3V interfaces, and a dedicated configuration interface supporting JTAG, Passive Serial, and Passive Parallel modes. The 502 user I/Os in a 672-pin FCBGA provide ample connectivity for memory buses, processor interfaces, and high-speed parallel datapaths.
The architecture combines Look-Up Table (LUT) logic, Product-Term logic, and Embedded System Block (ESB) memory blocks on a single fabric. The 0.22 µm CMOS process and 2.5V core supply represent late-1990s high-density FPGA technology. With 200 MHz maximum internal frequency and 212,992 bits of embedded memory, the device supports high-throughput designs in communications, video processing, and protocol bridging applications.
Typical applications include telecommunications infrastructure, high-speed data acquisition, custom DSP pipelines, image and video processing engines, and embedded control systems. The high I/O count makes it suitable for memory-intensive designs and multi-bus bridging.
When designing with this FPGA, ensure proper decoupling on each power rail, follow Altera's power sequencing guidelines, and use the Quartus II design suite (with legacy support) for place-and-route. The 672-FBGA package requires careful PCB layout for thermal management and signal integrity.
This page synthesizes distributor pricing, drop-in APEX-20K family alternatives, and practical design notes not found in the legacy datasheet, helping sourcing engineers and embedded designers evaluate the EP20K400FI672-2 in legacy and maintenance applications.
直接替換替代品，適用於 EP20K400FI672-2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K400FI672-2 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, Family, Process Technology.
EP20K400FC672-2
✅ 直接替換聯絡詢價
查看資料表 →EP20K400EFC672-2
✅ 直接替換聯絡詢價
查看資料表 →EP20K400FC672-1XGZ
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP20K400FC672-3
✅ 直接替換聯絡詢價
查看資料表 →EP20K400EFC672-3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP20K400EFC672-1
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP20K400FI672-2 最大額定值與電氣特性
| Family | APEX-20K |
| Logic Elements | 16640 |
| Maximum Gates | 400,000 gates |
| User I/Os | 502 |
| Embedded Memory Bits | 212992 |
| Number of Macros | 1664 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Maximum Internal Frequency | 200 MHz |
| Propagation Delay | 2.5 ns |
| 工作溫度 | 0 °C to +85 °C (Commercial) |
| Package Type | 672-pin Fine-pitch Ball Grid Array (FBGA/FCBGA) |
| PLLs (Phase-Locked Loops) | 4 |
| Configuration Modes | JTAG, Passive Serial, Passive Parallel |
| RoHS 狀態 | Lead-free / RoHS Compliant |
| 安裝類型 | Surface Mount (BGA) |
EP20K400FI672-2 672-pin fine-pitch ball grid array (fbga/fcbga) 腳位配置指南
EP20K400FI672-2（672-pin fine-pitch ball grid array (fbga/fcbga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K400FI672-2.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K400FI672-2 適用於 6 應用s: Telecommunications Infrastructure, High-Speed Data Acquisition Systems, Image and Video Processing Pipelines, Embedded Control and Industrial Automation, Custom DSP Pipeline Acceleration, Legacy Avionics and Defense Systems.
Telecommunications Infrastructure
The EP20K400FI672-2 fits telecommunications infrastructure designs through its 400,000-gate density and 502 user I/Os, which provide ample logic capacity for ATM switch fabrics, SONET/SDH framer implementations, and protocol bridge interfaces. Its 4 on-chip PLLs enable clock-domain multiplexing across multiple telecom line cards operating at 19.44 MHz, 77.76 MHz, and 155.52 MHz. The 212,992 bits of embedded memory buffer packet headers and routing tables, reducing external SRAM. Designers leverage the APEX-20K MultiCore architecture to mix LUT logic and product-term glue logic on one fabric, simplifying legacy telecom PCB revisions while keeping Quartus II toolchain compatibility for in-field reprogramming.
推薦
High-Speed Data Acquisition Systems
For high-speed data acquisition systems, the EP20K400FI672-2's 200 MHz maximum internal frequency and 502 user I/Os support parallel ADC interfaces up to 16 bits wide at full sampling rate. The 16,640 logic elements allow designers to implement FIR filters, FFT pipelines, and multi-channel decimation stages directly on the FPGA fabric. The 212,992 bits of embedded memory serve as fast buffer storage between ADC data streams and downstream DSP processors, reducing DMA latency. The 672-FBGA package provides sufficient I/O density for multi-board DAQ systems with 32+ analog input channels and clock distribution networks.
推薦
Image and Video Processing Pipelines
The EP20K400FI672-2 fits image and video processing pipelines through its 400K-gate capacity and 212,992 bits of embedded memory, which can buffer multiple raster scanlines for real-time scaling and color-space conversion. Its 4 PLLs derive pixel clocks from incoming video streams at 27 MHz (SDTV), 74.25 MHz (HDTV), and 148.5 MHz (FHD) without external clock generators. The 502 user I/Os support 24-bit digital video interfaces plus ITU-R BT.656/BT.1120 inputs. Designers implement 2D convolution, gamma correction, and chroma keying on the LUT fabric while using ESB memory as line buffers.
推薦
Embedded Control and Industrial Automation
In embedded control and industrial automation, the EP20K400FI672-2 serves as a programmable logic controller implementing custom fieldbus protocols (Profibus, DeviceNet, CAN) on a single chip. Its 502 I/Os interface with sensor arrays, motor encoder lines, and isolated digital I/O modules. The 4 PLLs synchronize stepper and servo motor control loops at 50 kHz to 200 kHz without external timing chips. With 16,640 logic elements, the device handles safety interlocks, PWM generation, and HMI display refresh simultaneously. Industrial users appreciate the APEX-20K family for its longevity in PLC designs and stable long-term availability through industrial distributors.
推薦
Custom DSP Pipeline Acceleration
For custom DSP pipeline acceleration, the EP20K400FI672-2's LUT-based fabric implements high-speed multiply-accumulate (MAC) units and parallel filter banks at the 200 MHz internal frequency. Its 212,992 bits of embedded memory act as coefficient ROM and intermediate result storage, avoiding costly external SRAM cycles. Designers implement pipelined FFT, Viterbi decoders, and Reed-Solomon codecs in dedicated DSP datapaths. The 502 user I/Os interface with parallel DSP processors (TI TMS320 series, Analog Devices SHARC) to offload compute-intensive kernels. This makes the EP20K400FI672-2 a flexible co-processor for legacy signal-processing systems.
推薦
Legacy Avionics and Defense Systems
The EP20K400FI672-2 is widely used in legacy avionics and defense systems where long-term field reliability and design stability are paramount. Its APEX-20K MultiCore architecture integrates LUT logic and product-term logic on one die, enabling mixed designs that previously required separate CPLD and FPGA chips. The 502 user I/Os interface with MIL-STD-1553 databuses, ARINC 429 channels, and discrete avionics signals. The 4 PLLs derive precision clocks for radar timing and navigation receivers. Although the family is mature, defense integrators continue to specify it for in-service platforms where the cost and risk of redesign outweigh the benefits of migration.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K400FI672-2 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K400FC672-2 | EP20K400EFC672-2 | EP20K400FC672-3 | EP20K400EFC672-1 | EP20K400FC672-1X |
|---|---|---|---|---|---|---|
| Package | 672-FBGA (Fine-pitch BGA) | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Family / Logic Elements | APEX-20K / 16640 LEs | APEX-20K / 16640 LEs | APEX-20K / 16640 LEs | APEX-20K / 16640 LEs | APEX-20K / 16640 LEs | APEX-20K / 16640 LEs |
| Speed Grade | -2 | -2 | -2 | -3 (faster) | -1 (slower) | -1 (slower) |
| Temperature Grade | Commercial (0 °C to +85 °C) | Commercial | Industrial (-40 °C to +100 °C) | Commercial | Industrial (-40 °C to +100 °C) | Commercial |
| User I/Os | 502 | 502 | 502 | 502 | 502 | 502 |
| Embedded Memory Bits | 212992 | 212992 | 212992 | 212992 | 212992 | 212992 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
主要差異化特點
- Industrial temperature grade available within same footprint (對比EP20K400FC672-2)
- Drop-in alternative on same die family (對比EP20K400BC652-1N)
- Multi-voltage I/O support (對比EP20K400CF672I7)
設計說明
Estimated: The 672-ball FCBGA package dissipates 1.5-3 W under typical 200 MHz internal operation with 60-70% logic utilization. Without forced airflow, the package thermal resistance theta_JA of approximately 12-15 °C/W will yield a 25-45 °C junction temperature rise above ambient. Designers should attach a heatsink or specify 200 LFM airflow in industrial applications where ambient reaches +70 °C. Place thermal vias in the PCB land pattern to conduct heat into inner copper planes.
The 672-ball FBGA uses 0.8 mm ball pitch, requiring 4 mil traces between balls and laser-drilled micro-vias on the BGA fanout layer. Use a minimum 6-layer PCB stack-up with dedicated ground and power planes adjacent to the BGA. Maintain 50 Ω single-ended controlled impedance on high-speed I/O such as clock inputs and external memory buses. Place at least 8 decoupling capacitors (0.1 µF X7R) within 5 mm of the VCCINT and VCCIO balls, distributed across all four quadrants.
Estimated: Common pitfalls include: (1) Mixing VCCIO standards on the same bank, which violates Altera's bank-based I/O rules - all I/O in a bank must share the same VCCIO reference; (2) Forgetting MSEL pin configuration, causing the FPGA to default to JTAG mode and fail standalone configuration; (3) Driving global clock inputs with non-LVDS sources - the PLL inputs require clean references below 312.5 MHz with jitter under 100 ps; (4) Using the legacy Quartus II 9.1 instead of an older 7.x version when targeting APEX-20K, as newer releases drop APEX support.
合規資訊
RoHS compliant per DigiKey listing for the -2V variant. Halogen-free status not explicitly stated in available data - marked unknown. Not AEC-Q100 qualified - choose industrial-grade variants for automotive applications. APEX-20K family declared obsolete per Altera/Intel product lifecycle database.
