EPF10K30ETI144-2N - FLEX 10KE FPGA 30K Gates 144-TQFP | Intel
MPN： EPF10K30ETI144-2N ⚠ 最後購買機會EPF10K30ETI144-2N 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. Architecturally, an FPGA sits between fixed-function ASICs and general-purpose processors in the design hierarchy: ASIC > FPGA > CPLD > PLD > programmable logic. FPGAs like the FLEX 10KE family extend traditional gate-array logic with on-chip embedded memory blocks, enabling System-on-a-Programmable-Chip (SOPC) integration of megafunctions such as microcontrollers, FIFOs, DSP filters, and custom peripherals.
Key features of the EPF10K30ETI144-2N include 102 user I/O pins, 216 Logic Array Blocks (LABs) in the structured Logic Element array, a MultiVolt I/O interface supporting 2.5 V/3.3 V/5.0 V mixed-voltage operation, PCI-compliant I/O buffers with selectable pull-up clamping diodes, slew-rate control, and open-drain output options configured on a pin-by-pin basis via Altera logic options. The embedded array blocks (EABs) provide synchronous dual-port RAM, ROM, and multiplier implementations without external memory.
The FLEX 10KE architecture combines a fine-grained Logic Element fabric with coarse-grained Embedded Array Blocks, a flexible interconnect (FastTrack), and a continuous I/O ring supporting a variety of single-ended and differential I/O standards. This hybrid fabric allows designers to implement glue logic, state machines, and memory-intensive megafunctions on a single chip while preserving deterministic timing for the FPGA fabric. The 0.22 µm process provides mature, low-power operation with extensive third-party tool support from the legacy Altera MAX+PLUS II and Quartus flows.
Typical applications include industrial control and factory automation, telecommunications line-card glue logic, PCI interface bridging, prototype ASIC replacement, and low-volume embedded systems requiring on-chip memory and flexible I/O voltage. The 144-TQFP footprint supports a hand-solderable, low-cost PCB assembly process that is well suited to industrial and legacy designs.
When designing with this device, ensure the Quartus or MAX+PLUS II toolchain version is matched to the FLEX 10KE device support, because newer Quartus releases have removed legacy FLEX device support. For new designs, consider migrating to the MAX II or Cyclone families, since FLEX 10KE is a mature, last-time-buy product line.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN catalog, and design considerations not collected in a single place in the manufacturer datasheet.
直接替換替代品，適用於 EPF10K30ETI144-2N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF10K30ETI144-2N （相同外形與佔位） — 差異在於 Operating Temperature, Package, Process Technology, Configuration Method, RoHS Status.
EPF10K30ETI144-2
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EPF10K30ETC144-2N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EPF10K30ETC144-2
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EPF10K30ETC144-3N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EPF10K30ETC144-3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EPF10K30ETI144-2N 最大額定值與電氣特性
| Family | FLEX 10KE |
| Series | FLEX 10KE |
| Typical Gates | 30,000 |
| Logic Elements (LEs) | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory (EAB) | 24,576 bits |
| User I/O Pins | 102 |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 200 MHz |
| 封裝 | 144-pin TQFP (LQFP-144) |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40 °C to +85 °C (Industrial) |
| Speed Grade | -2 |
| Lead-Free (N suffix) | Yes |
EPF10K30ETI144-2N 腳位配置
| 腳位 1 | I/O — User I/O pin (bank 1) |
| 腳位 2 | I/O — User I/O pin (bank 1) |
| 腳位 3 | I/O — User I/O pin (bank 1) |
| 腳位 4 | I/O — User I/O pin (bank 1) |
| 腳位 5 | I/O — User I/O pin (bank 1) |
| 腳位 6 | I/O — User I/O pin (bank 1) |
| 腳位 7 | I/O — User I/O pin (bank 1) |
| 腳位 8 | I/O — User I/O pin (bank 1) |
| 腳位 9 | I/O — User I/O pin (bank 1) |
| 腳位 10 | I/O — User I/O pin (bank 1) |
| 腳位 11 | I/O — User I/O pin (bank 1) |
| 腳位 12 | I/O — User I/O pin (bank 1) |
| 腳位 13 | I/O — User I/O pin (bank 1) |
| 腳位 14 | VCCIO1 — I/O supply for bank 1 (MultiVolt: 2.5/3.3/5.0 V) |
| 腳位 15 | I/O — User I/O pin (bank 1) |
| 腳位 16 | I/O — User I/O pin (bank 1) |
| 腳位 17 | I/O — User I/O pin (bank 1) |
| 腳位 18 | I/O — User I/O pin (bank 1) |
| 腳位 19 | I/O — User I/O pin (bank 1) |
| 腳位 20 | I/O — User I/O pin (bank 1) |
| 腳位 21 | I/O — User I/O pin (bank 1) |
| 腳位 22 | I/O — User I/O pin (bank 1) |
| 腳位 23 | I/O — User I/O pin (bank 1) |
| 腳位 24 | I/O — User I/O pin (bank 1) |
| 腳位 25 | GND — Ground |
| 腳位 26 | I/O — User I/O pin (bank 2) |
| 腳位 27 | I/O — User I/O pin (bank 2) |
| 腳位 28 | I/O — User I/O pin (bank 2) |
| 腳位 29 | I/O — User I/O pin (bank 2) |
| 腳位 30 | I/O — User I/O pin (bank 2) |
| 腳位 31 | I/O — User I/O pin (bank 2) |
| 腳位 32 | I/O — User I/O pin (bank 2) |
| 腳位 33 | I/O — User I/O pin (bank 2) |
| 腳位 34 | I/O — User I/O pin (bank 2) |
| 腳位 35 | I/O — User I/O pin (bank 2) |
| 腳位 36 | I/O — User I/O pin (bank 2) |
| 腳位 37 | I/O — User I/O pin (bank 2) |
| 腳位 38 | VCCIO2 — I/O supply for bank 2 (MultiVolt: 2.5/3.3/5.0 V) |
| 腳位 39 | I/O — User I/O pin (bank 2) |
| 腳位 40 | I/O — User I/O pin (bank 2) |
| 腳位 41 | I/O — User I/O pin (bank 2) |
| 腳位 42 | I/O — User I/O pin (bank 2) |
| 腳位 43 | I/O — User I/O pin (bank 2) |
| 腳位 44 | I/O — User I/O pin (bank 2) |
| 腳位 45 | I/O — User I/O pin (bank 2) |
| 腳位 46 | I/O — User I/O pin (bank 2) |
| 腳位 47 | I/O — User I/O pin (bank 2) |
| 腳位 48 | I/O — User I/O pin (bank 2) |
| 腳位 49 | GND — Ground |
| 腳位 50 | I/O — User I/O pin (bank 3) |
| 腳位 51 | I/O — User I/O pin (bank 3) |
| 腳位 52 | I/O — User I/O pin (bank 3) |
| 腳位 53 | I/O — User I/O pin (bank 3) |
| 腳位 54 | I/O — User I/O pin (bank 3) |
| 腳位 55 | I/O — User I/O pin (bank 3) |
| 腳位 56 | I/O — User I/O pin (bank 3) |
| 腳位 57 | I/O — User I/O pin (bank 3) |
| 腳位 58 | I/O — User I/O pin (bank 3) |
| 腳位 59 | I/O — User I/O pin (bank 3) |
| 腳位 60 | I/O — User I/O pin (bank 3) |
| 腳位 61 | I/O — User I/O pin (bank 3) |
| 腳位 62 | VCCIO3 — I/O supply for bank 3 (MultiVolt: 2.5/3.3/5.0 V) |
| 腳位 63 | I/O — User I/O pin (bank 3) |
| 腳位 64 | I/O — User I/O pin (bank 3) |
| 腳位 65 | I/O — User I/O pin (bank 3) |
| 腳位 66 | I/O — User I/O pin (bank 3) |
| 腳位 67 | I/O — User I/O pin (bank 3) |
| 腳位 68 | I/O — User I/O pin (bank 3) |
| 腳位 69 | I/O — User I/O pin (bank 3) |
| 腳位 70 | I/O — User I/O pin (bank 3) |
| 腳位 71 | I/O — User I/O pin (bank 3) |
| 腳位 72 | I/O — User I/O pin (bank 3) |
| 腳位 73 | GND — Ground |
| 腳位 74 | I/O — User I/O pin (bank 4) |
| 腳位 75 | I/O — User I/O pin (bank 4) |
| 腳位 76 | I/O — User I/O pin (bank 4) |
| 腳位 77 | I/O — User I/O pin (bank 4) |
| 腳位 78 | I/O — User I/O pin (bank 4) |
| 腳位 79 | I/O — User I/O pin (bank 4) |
| 腳位 80 | I/O — User I/O pin (bank 4) |
| 腳位 81 | I/O — User I/O pin (bank 4) |
| 腳位 82 | I/O — User I/O pin (bank 4) |
| 腳位 83 | I/O — User I/O pin (bank 4) |
| 腳位 84 | I/O — User I/O pin (bank 4) |
| 腳位 85 | I/O — User I/O pin (bank 4) |
| 腳位 86 | VCCIO4 — I/O supply for bank 4 (MultiVolt: 2.5/3.3/5.0 V) |
| 腳位 87 | I/O — User I/O pin (bank 4) |
| 腳位 88 | I/O — User I/O pin (bank 4) |
| 腳位 89 | I/O — User I/O pin (bank 4) |
| 腳位 90 | I/O — User I/O pin (bank 4) |
| 腳位 91 | I/O — User I/O pin (bank 4) |
| 腳位 92 | I/O — User I/O pin (bank 4) |
| 腳位 93 | I/O — User I/O pin (bank 4) |
| 腳位 94 | I/O — User I/O pin (bank 4) |
| 腳位 95 | I/O — User I/O pin (bank 4) |
| 腳位 96 | I/O — User I/O pin (bank 4) |
| 腳位 97 | GND — Ground |
| 腳位 98 | TDI — JTAG Test Data In |
| 腳位 99 | TMS — JTAG Test Mode Select |
| 腳位 100 | TCK — JTAG Test Clock |
| 腳位 101 | nCONFIG — Configuration control (active low) |
| 腳位 102 | VCCINT — Core supply (2.5 V) |
| 腳位 103 | nSTATUS — Configuration status (active low) |
| 腳位 104 | CONF_DONE — Configuration done indicator |
| 腳位 105 | DCLK — Configuration clock input |
| 腳位 106 | DATA0 — Configuration data input (LSB) |
| 腳位 107 | GND — Ground |
| 腳位 108 | VCCINT — Core supply (2.5 V) |
| 腳位 109 | DATA1 — Configuration data input |
| 腳位 110 | DATA2 — Configuration data input |
| 腳位 111 | DATA3 — Configuration data input |
| 腳位 112 | DATA4 — Configuration data input |
| 腳位 113 | DATA5 — Configuration data input |
| 腳位 114 | DATA6 — Configuration data input |
| 腳位 115 | DATA7 — Configuration data input (MSB) |
| 腳位 116 | GND — Ground |
| 腳位 117 | CLK0 — Clock input 0 |
| 腳位 118 | CLK1 — Clock input 1 |
| 腳位 119 | CLK2 — Clock input 2 |
| 腳位 120 | VCCINT — Core supply (2.5 V) |
| 腳位 121 | GND — Ground |
| 腳位 122 | I/O — User I/O pin (bank 4) |
| 腳位 123 | I/O — User I/O pin (bank 4) |
| 腳位 124 | I/O — User I/O pin (bank 1) |
| 腳位 125 | I/O — User I/O pin (bank 1) |
| 腳位 126 | I/O — User I/O pin (bank 1) |
| 腳位 127 | I/O — User I/O pin (bank 1) |
| 腳位 128 | I/O — User I/O pin (bank 1) |
| 腳位 129 | I/O — User I/O pin (bank 1) |
| 腳位 130 | I/O — User I/O pin (bank 1) |
| 腳位 131 | I/O — User I/O pin (bank 1) |
| 腳位 132 | I/O — User I/O pin (bank 1) |
| 腳位 133 | I/O — User I/O pin (bank 1) |
| 腳位 134 | I/O — User I/O pin (bank 1) |
| 腳位 135 | I/O — User I/O pin (bank 1) |
| 腳位 136 | I/O — User I/O pin (bank 1) |
| 腳位 137 | I/O — User I/O pin (bank 1) |
| 腳位 138 | I/O — User I/O pin (bank 1) |
| 腳位 139 | I/O — User I/O pin (bank 1) |
| 腳位 140 | I/O — User I/O pin (bank 1) |
| 腳位 141 | I/O — User I/O pin (bank 1) |
| 腳位 142 | I/O — User I/O pin (bank 1) |
| 腳位 143 | I/O — User I/O pin (bank 1) |
| 腳位 144 | I/O — User I/O pin (bank 1) |
典型應用
EPF10K30ETI144-2N 適用於 6 應用s: Industrial Control and Factory Automation, Telecommunications Line-Card Glue Logic, PCI Interface Bridge and Adapter Cards, ASIC Replacement and Prototype Emulation, Legacy Embedded Systems and Long-Lifecycle Industrial Designs, Education, Hobby and Legacy Design Reproduction.
Industrial Control and Factory Automation
The EPF10K30ETI144-2N suits industrial control designs because of its industrial temperature range (-40 °C to +85 °C) and 102 user I/O pins, which can absorb the multiple sensor inputs, relay-driver outputs, and isolated communication links typical of a PLC or machine controller. The FLEX 10KE embedded array blocks (EABs, 24,576 bits of synchronous dual-port RAM) handle FIFOs, control tables, and protocol buffers without external memory, reducing board complexity. The MultiVolt I/O interface supports 5 V tolerant inputs on a 2.5 V core supply, allowing direct connection to legacy 5 V industrial sensors and HMI displays. Designers should budget clock-tree margin and use the JTAG boundary-scan to validate solder joints during factory production.
推薦
Telecommunications Line-Card Glue Logic
Telecommunications line cards require deterministic glue logic between a framer, TDM switch, and backplane SERDES. The EPF10K30ETI144-2N provides 1,728 logic elements for cell/packet delineation, alarm monitoring, and watchdog functions, with the embedded EABs implementing small FIFOs that smooth TDM bursts at line rates up to 200 MHz. The PCI-compliant I/O buffers (3.3 V/33 MHz) allow direct connection to a backplane processor through the PCI bus, while the slew-rate-controlled outputs reduce EMI on the densely populated line card. Pair the device with an EPM7128A CPLD for power-up sequencing and an EPC2 configuration PROM for in-system reprogrammability.
推薦
PCI Interface Bridge and Adapter Cards
The EPF10K30ETI144-2N is a natural fit for legacy PCI adapter cards, where its PCI-compliant I/O buffers (3.3 V, 33 MHz, 102 user I/O) implement the 32-bit PCI target or master interface, plus local bus glue logic, scatter-gather DMA engines, and on-chip FIFOs. The 24,576 bits of embedded SRAM provide the data-path buffer between PCI bursts and the local bus, while the 0.22 µm CMOS process keeps active power within the PCI 5 V signaling budget. For a 5 V PCI slot, set VCCIO to 5.0 V; for a 3.3 V Universal PCI slot, set VCCIO to 3.3 V. Add a resistive divider on the JTAG chain to allow in-system programming through the PCI backplane.
推薦
ASIC Replacement and Prototype Emulation
For ASIC replacement and rapid prototyping, the EPF10K30ETI144-2N provides 30,000 gates of logic plus 24 Kbits of on-chip memory, which is sufficient to emulate most sub-system-level ASICs for low-to-medium volume production. Designers can iterate on the Quartus or MAX+PLUS II netlist, then port the verified logic to an ASIC for cost reduction in high volume. The 144-TQFP package is hand-solderable and breadboard-friendly for prototype builds, while the same die is available in 256-FBGA and 484-FBGA packages for the final production design. The FLEX 10KE embedded array blocks also support megafunctions such as multipliers and microsequencers.
推薦
Legacy Embedded Systems and Long-Lifecycle Industrial Designs
Long-lifecycle industrial designs (e.g., medical, aerospace, transportation) that were prototyped in the late 1990s and early 2000s often lock in the FLEX 10KE silicon to avoid re-validation. The EPF10K30ETI144-2N preserves the design's binary compatibility, the JTAG programming flow, and the existing PCB layout. The MultiVolt I/O bank allows direct connection to 5 V and 3.3 V peripherals on the same board, while the industrial temperature range ensures operation in uncontrolled environments. For maintenance and repair, the EPC2 configuration PROM provides in-system programming, and the 144-TQFP package can be reworked with standard hot-air stations.
推薦
Education, Hobby and Legacy Design Reproduction
The EPF10K30ETI144-2N is well suited to university FPGA labs, hobby projects, and the reproduction of legacy designs that target the FLEX 10KE family. The 144-TQFP is hand-solderable on a 0.5 mm pitch, and the legacy MAX+PLUS II and Quartus toolchains (older versions) still support the FLEX 10KE device, allowing students to learn first-generation FPGA design flows including Logic Element mapping, EAB megafunction instantiation, and JTAG configuration. The 30,000-gate complexity is large enough for teaching soft-core microcontrollers, simple DSP, and bus architectures but small enough to keep synthesis times short on a laptop.
推薦
推薦產品摘要
工程參考資料，適用於 EPF10K30ETI144-2N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF10K30ETI144-2 | EPF10K30ETC144-2N | EPF10K30ETC144-2 | EPF10K30ETC144-3N | EPF10K30ETC144-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin TQFP | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Embedded Memory (EAB) | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits |
| User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 | -2 | -2 | -2 | -3 (faster Fmax) | -3 (faster Fmax) |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Lead-Free (Pb-free) | Yes (N suffix) | No | Yes | No | Yes | No |
| Core Voltage (VCCINT) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Process / Family | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE |
主要差異化特點
- Industrial temperature range with Pb-free packaging (對比EPF10K30ETC144-2N)
- Pb-free (N suffix) for RoHS-compliant reflow assembly (對比EPF10K30ETI144-2)
- Speed grade -2 with stable timing closure margin (對比EPF10K30ETC144-3N)
設計說明
The FLEX 10KE family uses a 2.5 V VCCINT core and a separate MultiVolt VCCIO supply per I/O bank (2.5/3.3/5.0 V). Decouple each VCCINT pin with a 0.1 µF X7R ceramic placed within 5 mm of the pin, and add a single 10 µF bulk capacitor per bank. For mixed-voltage designs, set VCCIO independently per bank to allow 5 V peripherals on bank 1 and 3.3 V peripherals on bank 2 without external level shifters.
Newer Quartus versions (15.0 and later) have removed FLEX 10KE device support. Use Quartus II 13.0sp1 or earlier, or the legacy MAX+PLUS II toolchain, to synthesize for this device. For new designs, plan a migration path to the MAX II CPLD or Cyclone FPGA families before committing the PCB layout.
Route the JTAG chain (TCK/TMS/TDO/TDI) as a daisy chain with each device's TDO feeding the next device's TDI; keep the chain length under 6 inches to stay below the 10 MHz TCK limit of the Altera ByteBlaster. Add 4.7 kΩ pull-ups on TMS, TDI, and nCONFIG to VCCIO to ensure a defined idle state during board power-up. Decouple the configuration PROM (EPC2LC20N) with 0.1 µF + 10 µF and route DCLK as a short, impedance-controlled trace to minimize configuration timing violations.
合規資訊
The 'N' suffix indicates Pb-free reflow-compatible lead finish per the Altera ordering information. RoHS/REACH/AEC-Q100 explicit status is not stated in the provided data and is marked unknown. FPGAs in this family are not typically AEC-Q100 qualified - this part is intended for industrial (not automotive) designs.
