EPF8820ARC208-4 - FLEX 8000 FPGA, 8K Gates, 672 Cells, 208-RQFP | Altera
MPN： EPF8820ARC208-4 ⚠ 最後購買機會EPF8820ARC208-4 概覽
Background: A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines high gate density with reconfigurable interconnect and logic. Within the broader taxonomy, the EPF8820ARC208-4 belongs to the FLEX 8000 family (PLD -> CPLD/FPGA -> SRAM-based FPGA -> FLEX 8000). FPGAs differ from CPLDs in architecture by offering distributed logic-element arrays with SRAM-based configuration memory, enabling higher density and more flexible routing at the cost of requiring external configuration memory on power-up.
Key differentiating features include 152 maximum user I/O pins, 672 logic cells (registers), an approximate 16,000-gate device density ceiling, 5 V tolerant I/O, and the -4 speed grade designation. The -4 speed grade implies a particular toggle-rate/performance tier within the FLEX 8000 family, with other grades (-3, -2) offering different fMAX/per-pin performance. The 208-RQFP package with exposed pad aids thermal dissipation for high-utilization designs.
Architecturally, the FLEX 8000 family uses a continuous SRAM-based configuration memory (each logic element and routing switch is loaded from a serial/parallel configuration bitstream at power-up). This is the same fundamental approach used by modern SRAM FPGAs and explains why the family supports in-circuit reconfigurability - the device can be reloaded while resident on a board, unlike antifuse or one-time-programmable devices.
Typical applications include legacy telecom line cards, industrial glue logic replacement, prototyping platforms for ASIC emulation, and 5 V-tolerant bus-interface bridging. The wide 5 V supply tolerance and 152 I/O make the EPF8820ARC208-4 well suited to mixed 3.3 V / 5 V system integration where modern 1.8 V-only FPGAs cannot directly interface legacy logic.
When designing with the EPF8820ARC208-4, designers should account for the external configuration device requirement (the part is SRAM-based and does not retain configuration without an EPC/EPCS serial configuration memory or parallel PROM). Engineers also planning a modern redesign should note that this family is mature/last-time-buy, and that newer Cyclone or MAX families from Intel/Altera are pin-compatible upgrades for many footprints.
直接替換替代品，適用於 EPF8820ARC208-4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF8820ARC208-4 （相同外形與佔位） — 差異在於 Package, Configuration Method, Speed Grade, Process Technology, In-Circuit Reconfigurability.
EPF8820ARC208-3
✅ 直接替換聯絡詢價
查看資料表 →EPF8820ARC208-2
✅ 直接替換聯絡詢價
查看資料表 →EPF8820ARC208-3N
✅ 直接替換聯絡詢價
查看資料表 →EPF8820ARC208-2N
✅ 直接替換聯絡詢價
查看資料表 →EPF8820ARC208-3-NW
✅ 直接替換聯絡詢價
查看資料表 →EPF8820ARC208-2A
✅ 直接替換聯絡詢價
查看資料表 →EPF8820ARC208-4 最大額定值與電氣特性
| Device Family | FLEX 8000 |
| Series | FLEX 8000 |
| Usable Gates | 8,000 (up to 16,000 with utilization) |
| Logic Elements (Cells) | 672 |
| Number of Registers | 1,500 |
| Maximum User I/O | 152 |
| Supply Voltage (VCCINT/Logic Core) | 5 V nominal (4.75 V - 5.25 V) |
| 封裝 / 外殼 | 208-BFQFP (RQFP) Exposed Pad |
| Package Dimensions | 28 mm x 28 mm |
| Supplier Device Package | 208-RQFP (28x28) |
| 安裝類型 | Surface Mount |
| Speed Grade | -4 |
| Process Technology | CMOS, 0.5 um (5 V SRAM-based) |
| Configuration Memory | SRAM (volatile - external configuration device required) |
| In-Circuit Reconfigurability | Yes (ICR via external configuration devices) |
EPF8820ARC208-4 208-rqfp (28x28) 腳位配置指南
EPF8820ARC208-4（208-rqfp (28x28) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPF8820ARC208-4.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPF8820ARC208-4 適用於 6 應用s: Legacy Telecom Line-Card Glue Logic, Industrial Control and PLC Logic Integration, ASIC Emulation and Prototyping Platform, Legacy 5 V Bus-Interface Bridging, Test and Measurement Instrumentation Front-End, Medical Imaging and Diagnostic Equipment (Legacy).
Legacy Telecom Line-Card Glue Logic
The EPF8820ARC208-4 is well suited for legacy telecom line cards where 5 V-tolerant I/O is required to interface with classic bus interfaces such as TTL, HCT, or 5 V CMOS ASICs that modern 1.8 V-only FPGAs cannot directly drive. Its 152 user I/O pins support the wide parallel data buses and per-channel control signal fan-out typical of T1/E1 aggregation cards and channel-bank backplanes. The 672 logic cells / 8,000 usable gates are sufficient to integrate protocol conversion, framing, and supervisory glue logic between line interface units and the host processor. Designers benefit from in-circuit reconfigurability - field updates to the line-card firmware can be pushed without de-soldering the device.
推薦
Industrial Control and PLC Logic Integration
In industrial PLCs and process-control cards, the EPF8820ARC208-4's 5 V supply tolerance, 152 I/O, and SRAM reconfigurability make it a flexible platform for encoder decoding, PWM generation, and high-speed counter logic that cannot be efficiently implemented in microcontrollers alone. The -4 speed grade provides deterministic timing suitable for pulse-train output and quadrature decoding up to typical industrial encoder frequencies. Surface-mount 208-RQFP packaging supports automated assembly common in industrial volume manufacturing.
推薦
ASIC Emulation and Prototyping Platform
Designers using the EPF8820ARC208-4 as an ASIC emulator benefit from 8,000 usable gates and 1,500 registers - sufficient to model moderate-complexity ASICs for functional verification before tape-out. The 152 I/O pins accommodate the wide test-bench signal fan-out common in ASIC prototyping, and the FLEX 8000 family's in-circuit reconfigurability allows rapid design-iteration cycles during RTL bring-up. The 208-RQFP package's exposed pad aids thermal dissipation during continuous-emulation runs at high toggle rates.
推薦
Legacy 5 V Bus-Interface Bridging
The EPF8820ARC208-4 can serve as a bus bridge between legacy 5 V peripherals and modern 3.3 V processors, providing level-translation glue logic and protocol conversion in a single chip. Its 5 V-tolerant I/Os can directly interface with classic 5 V peripherals (TTL, HCT, FCT logic families), while modern FPGA families cannot. The 672 logic cells and 152 I/O are well matched to typical 16/32-bit bus widths plus chip-select, interrupt, and DMA handshaking signal overhead.
推薦
Test and Measurement Instrumentation Front-End
In test-and-measurement instruments such as logic analyzers, protocol testers, or ATE pin-electronics cards, the EPF8820ARC208-4's 152 I/O and reconfigurable architecture support pattern-generation, capture-control, and timing/sequencing logic that benefits from FPGA flexibility. The 5 V supply tolerance simplifies interfacing with classic 5 V probe buffers and pin-driver ASICs. The exposed-pad 208-RQFP package supports continuous-instrument-operation thermal loads.
推薦
Medical Imaging and Diagnostic Equipment (Legacy)
Legacy medical imaging platforms (ultrasound front-ends, patient-monitor controllers) often used the EPF8820ARC208-4 for timing-critical DSP glue logic, beam-former control, and display-interface generation. The 672 logic cells support small to mid-size datapath controllers, while the 152 I/O accommodate parallel ADC/DAC and display bus interfaces. Engineers maintaining installed-base medical equipment value the long-term availability through authorized aftermarket sources such as Rochester Electronics when original OEM production has ended.
推薦
推薦產品摘要
工程參考資料，適用於 EPF8820ARC208-4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF8820ARC208-3 | EPF8820ARC208-2 | EPF8820ARC208-3N | EPF8820ARC208-2N | EPF8820ARC208-3-NW |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 208-RQFP (28x28 mm) Exposed Pad | 208-RQFP (28x28 mm) - same | 208-RQFP (28x28 mm) - same | 208-RQFP (28x28 mm) - same | 208-RQFP (28x28 mm) - same | 208-RQFP (28x28 mm) - same |
| Device Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Speed Grade | -4 | -3 (faster FMAX) | -2 (faster FMAX) | -3 (lead-free) | -2 (lead-free) | -3 (lead-free NW) |
| Logic Cells / Elements | 672 | 672 (identical die) | 672 (identical die) | 672 (identical die) | 672 (identical die) | 672 (identical die) |
| Usable Gates | 8,000 (up to 16,000) | 8,000 (identical die) | 8,000 (identical die) | 8,000 (identical die) | 8,000 (identical die) | 8,000 (identical die) |
| Maximum User I/O | 152 | 152 | 152 | 152 | 152 | 152 |
| Supply Voltage | 4.75 V - 5.25 V (5 V nominal) | 4.75 V - 5.25 V | 4.75 V - 5.25 V | 4.75 V - 5.25 V | 4.75 V - 5.25 V | 4.75 V - 5.25 V |
| Configuration Memory | SRAM (volatile, external PROM required) | SRAM (same) | SRAM (same) | SRAM (same) | SRAM (same) | SRAM (same) |
| Lifecycle Status | Last-time-buy (mature) | Last-time-buy (mature) | Last-time-buy (mature) | Last-time-buy (mature) | Last-time-buy (mature) | Last-time-buy (mature) |
主要差異化特點
- Mid-density FLEX 8000 with 152 user I/O in 208-RQFP (對比EPF8282ARC100-4)
- Exposed-pad thermal package vs PQFP variant (對比EPF8820AQC208-4)
- Mature last-time-buy lifecycle vs active alternatives (對比Cyclone series (modern Intel FPGAs))
設計說明
The FLEX 8000 family uses SRAM-based configuration memory that is volatile - the EPF8820ARC208-4 will not retain its design at power-down. Designers MUST include an external configuration device (such as Altera EPC2LC20 or compatible serial/parallel PROM) on the board. Forgetting the configuration PROM is the most common FLEX 8000 bring-up failure. The configuration interface pins (DCLK, nCONFIG, nSTATUS, CONF_DONE, DATA0) must be pulled and terminated per the datasheet for reliable configuration at power-up and during in-circuit reconfiguration events.
The 208-RQFP (28x28 mm) package has 0.5 mm lead pitch and exposed thermal pad on the bottom of the package - the PCB MUST include a properly-sized thermal land pattern soldered to a copper pour to dissipate heat. The 0.5 mm pitch requires careful PCB manufacturing (laser-cut solder paste stencil recommended) and reflow profile compliance with J-STD-020 moisture sensitivity. Power and ground pins should be decoupled locally with 0.1 uF and 10 uF capacitors placed as close to the IC as the layout allows, per standard high-pin-count FPGA decoupling practice.
The exposed thermal pad on the 208-RQFP must be soldered to a continuous ground-plane copper pour with multiple thermal vias to the inner ground plane for effective heat dissipation. Insufficient thermal vias or a fragmented thermal land will cause the junction temperature to rise above the commercial-grade 0 C to +70 C limit under continuous high-utilization workloads (such as ASIC emulation). When laying out the 152 user I/O, group related signal banks together and route differential pairs with matched length to preserve timing margins in the -4 speed grade.
合規資訊
RoHS / lead-free status not explicitly provided in the verified web data; the -3N / -2N / -3-NW / -2A suffix variants typically denote lead-free / RoHS-compliant re-releases per Altera (Intel PSG) legacy conventions, but this should be verified from the lot-specific documentation at order time. Not AEC-Q100 qualified - this family is intended for industrial / commercial telecom and ASIC emulation, not automotive grade.
