LPC1316FHN33,551 - Cortex-M3 72MHz MCU 48KB Flash | NXP
MPN： LPC1316FHN33,551 ✓ 啟用中LPC1316FHN33,551 概覽
An entry-level 32-bit MCU is an integrated circuit that combines a processor core, program flash, SRAM, and mixed-signal peripherals on a single die, sitting in the product hierarchy between 8-bit MCUs and high-performance Cortex-M4/M7 devices. The LPC1316 belongs to the NXP LPC1300 family, which targets embedded applications requiring a high level of integration and low power consumption.
Key features include the Arm Cortex-M3 core with a 3-stage pipeline and Harvard architecture with separate instruction and data buses, CPU speeds up to 72 MHz, 48 KB flash, a USB 2.0 full-speed device controller, USART serial interfaces, and an internal prefetch unit supporting speculative branching for improved execution efficiency.
Technically, the Cortex-M3 core integrates an NVIC interrupt controller, SysTick timer, and enhanced debug features, while the LPC1300 peripheral set adds fast GPIO, 10-bit ADC, and serial connectivity on a single 3.3 V supply rail (2.5 V to 3.3 V operating range per distributor data).
Typical applications include USB-connected embedded devices, industrial control nodes, consumer appliances, and battery-powered instrumentation where 8-bit MCUs lack headroom but full Cortex-M4 performance is unnecessary.
Design consideration: the 32-HVQFN exposed pad must be soldered to a ground plane for both thermal dissipation and signal integrity; verify the 2.5 V to 3.3 V supply window before reusing a 5 V-tolerant design.
This page synthesizes verified distributor pricing, pin-compatible LPC13xx family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
直接替換替代品，適用於 LPC1316FHN33,551 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： LPC1316FHN33,551 （相同外形與佔位） — 差異在於 Flash Memory, Supply Voltage Range.
LPC1317FHN33,551
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LPC1315FHN33,551
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LPC1343FHN33,551
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LPC1342FHN33,551
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LPC1313FHN33,551
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LPC1316FHN33,551 最大額定值與電氣特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Max CPU Frequency | 72 MHz |
| Flash Memory | 48 KB (48K x 8) |
| Supply Voltage Range | 2.5 V to 3.3 V |
| 封裝 | 32-HVQFN (7x7 mm) Exposed Pad |
| 安裝類型 | Surface Mount |
| Series | LPC13xx (LPC1316) |
| USB Controller | USB device |
| Serial Interfaces | USART |
| Pipeline | 3-stage |
| Architecture | Harvard, with separate instruction and data buses |
| EEPROM Emulation | Yes (per LPC1316 family datasheet) |
| Packaging | Tray |
LPC1316FHN33,551 32-hvqfn (7x7 mm) exposed pad 腳位配置指南
LPC1316FHN33,551（32-hvqfn (7x7 mm) exposed pad 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： LPC1316FHN33,551.
請參閱 資料表 以查看完整腳位配置。
典型應用
LPC1316FHN33,551 適用於 6 應用s: USB Embedded Devices, Industrial Control Nodes, Battery-Powered Instrumentation, Consumer Appliance Control, Sensor Hubs and IoT Edge Nodes, Test and Measurement Accessories.
USB Embedded Devices
The LPC1316FHN33,551 fits USB-connected peripherals because it integrates a USB 2.0 full-speed device controller alongside the 72 MHz Cortex-M3 core, enabling HID, CDC, and vendor-class enumeration without an external PHY. Typical roles include USB sensors, dongles, and configuration interfaces where the 48 KB flash accommodates USB stack plus application firmware. The 3-stage pipeline and Harvard bus architecture sustain the throughput needed for bulk transfers, while the 32-HVQFN (7x7) exposed-pad package keeps the BOM and board area compact for handheld form factors.
推薦
Industrial Control Nodes
In factory automation nodes, the LPC1316FHN33,551 provides deterministic Cortex-M3 execution at 72 MHz with USART links to PLC peripherals and sensor buses. The 48 KB flash holds protocol handlers such as Modbus RTU with margin for OTA feature updates, and the entry-level peripheral integration reduces external component count on dense I/O boards. Operating from a 2.5 V to 3.3 V rail, it pairs cleanly with 3.3 V industrial logic; the exposed-pad HVQFN improves thermal margin inside sealed control cabinets where passive cooling only is available.
推薦
Battery-Powered Instrumentation
Portable instruments benefit from the LPC1300 family's low power consumption and high integration: one chip supplies the 72 MHz processing core, flash, SRAM, ADC, and serial interfaces, minimizing quiescent overhead versus multi-chip solutions. The 48 KB flash supports data-logging tables and calibration constants in firmware, while the Cortex-M3 sleep modes permit long battery life in handheld meters and environmental loggers. Designers should budget current for the USB block when enabled and leverage clock-gating of unused peripherals to reach the lowest standby figures cited in the NXP datasheet.
推薦
Consumer Appliance Control
White-goods and small-appliance controllers use the LPC1316FHN33,551 as a cost-effective 32-bit upgrade path from 8-bit MCUs: the 72 MHz Cortex-M3 core runs PID motor-control loops with headroom, and the on-chip USART communicates with display and touch-front-end boards. The 32-HVQFN (7x7) surface-mount package supports automated assembly and compact main-board layouts. The 48 KB flash accommodates multiple operating modes and localization variants, and NXP's long-lifecycle industrial MCUs simplify repeated production builds over multi-year appliance programs.
推薦
Sensor Hubs and IoT Edge Nodes
As a sensor aggregation node, the LPC1316FHN33,551 collects I2C/SPI sensor streams through its GPIO and USART peripherals while executing local filtering on the 72 MHz core, reducing upstream data volume. The 48 KB flash holds protocol stacks and buffering routines, and the 2.5 V to 3.3 V supply range matches common Li-ion-regulated rails. Although it lacks on-chip radio, pairing it with a BLE or sub-GHz module yields a low-cost edge node; the HVQFN exposed pad supports dense multi-chip layouts typical of module-style IoT boards.
推薦
Test and Measurement Accessories
USB bench accessories such as data-acquisition dongles and programmer pods map well to the LPC1316FHN33,551: the full-speed USB device controller streams samples to host software, the 72 MHz Cortex-M3 handles packetization and timing, and 48 KB flash stores calibration and firmware-update bootloaders. The 32-HVQFN (7x7) package suits compact probe-body enclosures, and the exposed pad simplifies grounding to the analog front end. The 3-stage pipeline delivers consistent latency for trigger and timestamp functions required in measurement firmware.
推薦
推薦產品摘要
工程參考資料，適用於 LPC1316FHN33,551 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | LPC1317FHN33,551 | LPC1315FHN33,551 | LPC1343FHN33,551 |
|---|---|---|---|---|
| Package | 32-HVQFN (7x7) | 32-HVQFN (7x7) - same | 32-HVQFN (7x7) - same | 32-HVQFN (7x7) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
| Max CPU Frequency | 72 MHz | 72 MHz | 72 MHz | 72 MHz |
| Flash | 48 KB | 64 KB | 32 KB | 64 KB |
| USB | USB device | USB device | USB device | USB device |
| Pin Compatibility | Reference | Pin-to-pin | Pin-to-pin | Pin-to-pin |
主要差異化特點
- Balanced 48 KB flash capacity (對比LPC1315FHN33,551)
- Lower cost than 64 KB siblings (對比LPC1343FHN33,551)
- Footprint upgrade path (對比LPC1317FHN33,551)
設計說明
Solder the HVQFN exposed pad to a PCB ground pad with a 3x3 (or larger) via array to the internal ground plane. The exposed pad is the primary ground return for the die; an unsoldered or cold-soldered pad commonly causes erratic USB operation and elevated ground bounce even though the peripheral ring pins appear properly connected. Follow NXP's HVQFN application soldering guidance for stencil aperture design.
Decouple every VDD pin with a 100 nF ceramic capacitor placed within 3 mm of the pin, plus one bulk 4.7 uF to 10 uF capacitor near the supply entry. The LPC1300 operates from 2.5 V to 3.3 V, so verify that upstream regulator accuracy plus IR drop keeps the rail inside this window under peak USB-transmit load. Do not power the part from a 5 V rail without level shifting and a 3.3 V LDO.
Pin-compatible LPC13xx family swaps (LPC1315/1316/1317/1343) still require firmware updates: change the device header in your build, review the linker script for differing flash/SRAM sizes, and re-check the flash configuration word. Assuming a binary compiled for the LPC1316 runs unchanged on a larger-flash sibling is a common source of boot failures on first power-up after a BOM substitution.
合規資訊
RoHS/lead-free per NXP standard product flow for the ,551 ordering code; formal REACH and conflict-minerals declarations should be obtained from NXP's compliance portal.
