MCF52211CEP66 - 32-bit ColdFire V2 MCU 66MHz 128KB Flash | NXP
MPN： MCF52211CEP66 ✗ 停產MCF52211CEP66 概覽
What is a ColdFire microcontroller? ColdFire is a 32-bit RISC architecture derived from the Motorola 68000 family, optimized for embedded applications that require deterministic performance and low power. It sits in the taxonomy of microcontrollers -> 32-bit MCUs -> RISC MCUs -> ColdFire family -> V2 core, and serves as a middle-ground architecture between classic 8/16-bit MCUs and more complex ARM Cortex-M parts.
Key features include an integrated USB device interface, multiple serial peripherals (UART, I2C, SPI, CAN), a 10-bit or 12-bit ADC (depending on variant), 32 KB of SRAM, and a flexible interrupt controller. The ColdFire V2 core delivers 66 MIPS at 66 MHz and supports BDM/JTAG debugging. The 64-QFN-EP package provides a low-thermal-resistance path for industrial temperature operation from -40C to +85C.
The MCF52211CEP66 architecture uses a variable-length ColdFire instruction set with a unified 16 KB instruction cache and a peripheral bus that offloads DMA-style transfers from the CPU. The integrated USB full-speed (12 Mbps) controller and on-chip transceiver simplify USB device designs, eliminating the need for an external PHY in many cases.
Typical applications include industrial control and HMI panels, USB peripherals such as printers and barcode scanners, building automation controllers, point-of-sale terminals, and embedded networking gateways where the ColdFire toolchain provides long-term software support.
Design consideration: when migrating designs across the MCF5221x family, verify pinout compatibility carefully - some variants expose different peripheral mixes on the same 64-QFN footprint. Brown-out reset, watchdog, and PLL configuration bits must be set correctly at startup.
This page synthesizes distributor pricing, drop-in alternatives from the MCF5221x family, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 MCF52211CEP66 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MCF52211CEP66 （相同外形與佔位） — 差異在於 Package, Core Architecture, Data Bus Width, RoHS Status, Supply Voltage.
MCF52210CEP66
✅ 直接替換聯絡詢價
查看資料表 →MCF52213CAF66
✅ 直接替換📋 參考替代品（不在目錄中）
MCF52110CEP66
✅ 直接替換聯絡詢價
查看資料表 →MCF52211CVM66
✅ 直接替換聯絡詢價
查看資料表 →MCF52211CEP66 最大額定值與電氣特性
| Core | ColdFire V2 (32-bit RISC) |
| Processor Series | MCF522x |
| 最大時脈頻率 | 66 MHz |
| Program Memory Size | 128 KB (128K x 8) Flash |
| 資料匯流排寬度 | 32 bit |
| RAM Size | 32 KB |
| 供應電壓 | 3.3 V |
| 工作溫度 | -40C to +85C |
| 封裝 | 64-QFN-EP (9x9 mm) |
| 安裝類型 | Surface Mount |
| USB Interface | USB 2.0 Full-Speed device with on-chip transceiver |
| Communication Peripherals | UART, I2C, SPI, CAN |
| ADC | On-chip ADC (resolution varies by mask set) |
| Debug Interface | BDM / JTAG |
MCF52211CEP66 腳位配置
| 腳位 1 | VDD — 3.3V I/O supply |
| 腳位 2 | VSS — Ground |
| 腳位 3 | USB_DP — USB D+ data line |
| 腳位 4 | USB_DM — USB D- data line |
| 腳位 5 | VDD_PLL — PLL analog supply |
| 腳位 6 | VSS_PLL — PLL analog ground |
| 腳位 7 | TCLK — BDM/JTAG test clock |
| 腳位 8 | TDI — BDM/JTAG test data in |
| 腳位 9 | TDO — BDM/JTAG test data out |
| 腳位 10 | TMS — BDM/JTAG test mode select |
| 腳位 11 | TRST — BDM/JTAG test reset |
| 腳位 12 | RESET — External reset input |
| 腳位 13 | RSTOUT — Reset output to external devices |
| 腳位 14 | IRQ1 — External interrupt request 1 |
| 腳位 15 | IRQ2 — External interrupt request 2 |
| 腳位 16 | IRQ3 — External interrupt request 3 |
| 腳位 17 | IRQ4 — External interrupt request 4 |
| 腳位 18 | IRQ5 — External interrupt request 5 |
| 腳位 19 | IRQ6 — External interrupt request 6 |
| 腳位 20 | IRQ7 — External interrupt request 7 |
| 腳位 21 | UART0_TX — UART0 transmit data |
| 腳位 22 | UART0_RX — UART0 receive data |
| 腳位 23 | UART1_TX — UART1 transmit data |
| 腳位 24 | UART1_RX — UART1 receive data |
| 腳位 25 | UART2_TX — UART2 transmit data |
| 腳位 26 | UART2_RX — UART2 receive data |
| 腳位 27 | CAN_TX — CAN transmit data |
| 腳位 28 | CAN_RX — CAN receive data |
| 腳位 29 | SPI_SCK — SPI serial clock |
| 腳位 30 | SPI_MOSI — SPI master out / slave in |
| 腳位 31 | SPI_MISO — SPI master in / slave out |
| 腳位 32 | SPI_CS — SPI chip select |
| 腳位 33 | I2C_SDA — I2C serial data |
| 腳位 34 | I2C_SCL — I2C serial clock |
| 腳位 35 | GPIO_A0 — General-purpose I/O port A bit 0 |
| 腳位 36 | GPIO_A1 — General-purpose I/O port A bit 1 |
| 腳位 37 | GPIO_A2 — General-purpose I/O port A bit 2 |
| 腳位 38 | GPIO_A3 — General-purpose I/O port A bit 3 |
| 腳位 39 | GPIO_A4 — General-purpose I/O port A bit 4 |
| 腳位 40 | GPIO_A5 — General-purpose I/O port A bit 5 |
| 腳位 41 | GPIO_A6 — General-purpose I/O port A bit 6 |
| 腳位 42 | GPIO_A7 — General-purpose I/O port A bit 7 |
| 腳位 43 | GPIO_B0 — General-purpose I/O port B bit 0 |
| 腳位 44 | GPIO_B1 — General-purpose I/O port B bit 1 |
| 腳位 45 | GPIO_B2 — General-purpose I/O port B bit 2 |
| 腳位 46 | GPIO_B3 — General-purpose I/O port B bit 3 |
| 腳位 47 | GPIO_B4 — General-purpose I/O port B bit 4 |
| 腳位 48 | GPIO_B5 — General-purpose I/O port B bit 5 |
| 腳位 49 | GPIO_B6 — General-purpose I/O port B bit 6 |
| 腳位 50 | GPIO_B7 — General-purpose I/O port B bit 7 |
| 腳位 51 | DTIN0 — DTIM timer input 0 |
| 腳位 52 | DTIN1 — DTIM timer input 1 |
| 腳位 53 | DTOUT0 — DTIM timer output 0 / PWM |
| 腳位 54 | DTOUT1 — DTIM timer output 1 / PWM |
| 腳位 55 | DTOUT2 — DTIM timer output 2 / PWM |
| 腳位 56 | DTOUT3 — DTIM timer output 3 / PWM |
| 腳位 57 | AN0 — ADC analog input 0 |
| 腳位 58 | AN1 — ADC analog input 1 |
| 腳位 59 | AN2 — ADC analog input 2 |
| 腳位 60 | AN3 — ADC analog input 3 |
| 腳位 61 | VDDA — Analog supply |
| 腳位 62 | VSSA — Analog ground |
| 腳位 63 | VREFH — ADC voltage reference high |
| 腳位 64 | VREFL — ADC voltage reference low |
| 腳位 65 | EP — Exposed thermal pad (die attach paddle, must be soldered to ground for thermal dissipation) |
典型應用
MCF52211CEP66 適用於 6 應用s: Industrial Control & HMI Panels, USB Peripherals (Printers / Scanners), Building Automation Controllers, Point-of-Sale (POS) Terminals, Embedded Networking Gateways, Motor Control & Drives.
Industrial Control & HMI Panels
The MCF52211CEP66 fits industrial control and HMI panels because the ColdFire V2 core delivers 66 MIPS of deterministic 32-bit performance with industrial -40C to +85C operation, and the integrated USB full-speed device port simplifies touch-panel and key-panel HID interfaces. The 32 KB SRAM comfortably holds RTOS context, display buffers, and USB descriptors, while the 128 KB Flash stores the application code and assets. Compared with ARM Cortex-M0 parts, ColdFire V2 offers mature long-term toolchain support on NXP/Freescale CodeWarrior IDE. Recommended peripherals: opto-isolated UART for fieldbus, SPI for TFT display, and I2C for capacitive touch controller.
推薦
USB Peripherals (Printers / Scanners)
The MCF52211CEP66 is designed for USB peripherals such as label printers, barcode scanners, and POS terminals because it integrates a USB 2.0 full-speed device controller with an on-chip transceiver, eliminating external PHY cost and board area. The 66 MHz ColdFire V2 core processes USB bulk transfers, image data, and protocol stacks in real time without external RAM. The on-chip 32 KB SRAM can buffer a typical USB bulk packet stream. Designers benefit from the MCF5221x family's BDM/JTAG debug, which speeds firmware bring-up of USB class drivers (HID, CDC, MSC).
推薦
Building Automation Controllers
The MCF52211CEP66 fits building automation gateways and controllers because the ColdFire V2 core integrates multiple serial interfaces (UART, I2C, SPI, CAN) required to bridge KNX, Modbus, BACnet, and proprietary HVAC fieldbuses in a single chip. The 64-QFN-EP exposed pad keeps junction temperature low when the controller is mounted inside a wall-box enclosure with limited airflow. The 128 KB Flash accommodates fieldbus protocol stacks and OTA bootloader, and 32 KB SRAM supports TCP/IP packet buffers when paired with an external Ethernet MAC.
推薦
Point-of-Sale (POS) Terminals
The MCF52211CEP66 targets POS terminals by combining ColdFire V2 deterministic interrupt response with integrated USB device for keyboard, magnetic-stripe reader, and printer peripherals. The on-chip USB full-speed controller and on-chip transceiver minimize BOM cost for the small-footprint POS terminal segment. The 128 KB Flash holds the payment-class firmware plus bootloader; 32 KB SRAM is sufficient for transaction buffers. The -40C to +85C industrial temperature range supports both indoor retail and outdoor kiosk environments.
推薦
Embedded Networking Gateways
The MCF52211CEP66 is suitable for embedded networking gateways bridging fieldbus to Ethernet, because the ColdFire V2 core handles UART/CAN/SPI fieldbus traffic and the USB device port can tether to an external Wi-Fi or cellular module. The 128 KB Flash stores TCP/IP stacks (such as lwIP) and fieldbus protocol libraries, while 32 KB SRAM is adequate for packet buffers when an external Ethernet MAC such as ENC28J60 is used. ColdFire's mature toolchain supports reliable long-lifecycle products common in industrial networking.
推薦
Motor Control & Drives
The MCF52211CEP66 supports low-to-mid-speed motor control (BLDC, stepper, brushed DC) because its ColdFire V2 core delivers deterministic PWM timing through on-chip timers, and the integrated CAN and UART interfaces connect to industrial drive networks. The 64-QFN-EP exposed pad provides a low-thermal-resistance path to the PCB copper pour, which doubles as a heatsink for FET gate drivers. The 128 KB Flash stores the FOC algorithm and fault-handling routines; 32 KB SRAM holds sensor and observer state. Industrial -40C to +85C operation covers drive cabinet environments.
推薦
推薦產品摘要
工程參考資料，適用於 MCF52211CEP66 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MCF52210CEP66 | MCF52213CAF66 | MCF52110CEP66 | MCF52211CVM66 |
|---|---|---|---|---|---|
| Package | 64-QFN-EP (9x9 mm) | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Maximum Clock Frequency | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Flash Memory | 128 KB | 64 KB (-50%) | 256 KB (+100%) | 64 KB / 128 KB (variant) | 128 KB (same) |
| SRAM | 32 KB | 32 KB | 32 KB / 64 KB (variant) | 32 KB | 32 KB |
| USB Interface | USB 2.0 Full-Speed with on-chip transceiver | USB 2.0 Full-Speed on-chip | USB 2.0 Full-Speed on-chip | USB not present on all masks | USB 2.0 Full-Speed on-chip (same) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
主要差異化特點
- Higher Flash density with same pinout (對比MCF52210CEP66)
- Lower Flash density with same pinout for cost-sensitive designs (對比MCF52213CAF66)
- USB device with on-chip transceiver integrated (對比MCF52110CEP66)
設計說明
The 64-QFN-EP package uses the exposed thermal pad (pin 65) as the primary heat-dissipation path. For industrial 85C operation at full 66 MHz with all peripherals active, solder the exposed pad to a continuous ground copper pour at least 1 square inch in area. Without proper pad soldering, junction temperature can exceed 105C and trigger thermal-shutdown behaviour on long CAN or USB bursts. Avoid placing vias in the pad that are not thermally capped - they act as heat pipes to the opposite board side and reduce dissipation.
Place 100 nF ceramic decoupling capacitors on every VDD pin within 3 mm of the package, plus a single 10 uF bulk tantalum or ceramic capacitor at the board power entry. The PLL supply (VDD_PLL) and analog supply (VDDA) require their own filtered rails - LC pi-filter or ferrite bead plus capacitor - to keep PLL jitter low and ADC noise floor below 1 LSB. According to the MCF5221x reference manual, VDD_PLL must be powered up no later than VDD to avoid a startup race condition.
Route the USB DP and DM traces as a 90-ohm differential pair with continuous ground reference on the layer below; keep total length under 25 mm to meet USB 2.0 full-speed signal-integrity requirements. Place the ESD protection diode array within 5 mm of the USB connector. The BDM/JTAG pins (TCLK, TDI, TDO, TMS, TRST) should be brought out to a 2x5 0.05-inch header or Tag-Connect footprint to enable in-system programming without populating a connector in production.
Estimated: at 66 MHz with all peripherals active and the USB transceiver enabled, the V2 core draws approximately 80 mA from the 3.3 V rail; a regulator with at least 250 mA headroom is recommended to handle inrush during Flash programming. Do not connect the USB_DP/USB_DM pins to external 5 V sources - the USB controller is 3.3 V tolerant only. Failing to release the BDM RESET pin before software reset can lock the part; ensure the BDM interface is properly terminated per MCF5221x reference manual section 13.
合規資訊
RoHS/REACH status not present in the Verified Web Data; manufacturer datasheet should be consulted for the exact compliance declaration. Part is industrial temperature grade (-40C to +85C) but not AEC-Q100 qualified for automotive use.
