MCIMX507CVM1B - i.MX50 ARM Cortex-A8 800MHz MPU | NXP
MPN： MCIMX507CVM1B ⚠ 最後購買機會MCIMX507CVM1B 概覽
An applications processor (AP) is a system-on-chip (SoC) optimized to run an operating system (typically Linux, Android, or a real-time OS) and to host user-facing applications, as distinct from microcontrollers (MCUs) that typically run bare-metal or RTOS code without a rich OS. Within the broader taxonomy, the i.MX50 family sits under ARM Cortex-A application processors > applications MPU > integrated circuits > semiconductors. The Cortex-A8 core implements the ARMv7-A architecture with NEON SIMD media extensions and a VFPv3 floating-point unit.
Key differentiating features include 800 MHz Cortex-A8 core, integrated hardware EPD controller (key for e-paper display pipelines), 32-bit data path, and the 400-ball MAPBGA package supporting high-bandwidth memory and display interfaces. The device is positioned by NXP as the follow-on to the market-leading i.MX508 eReader processor.
Architecturally, the SoC integrates the Cortex-A8 core with on-chip L1/L2 cache, an LCD/EPD controller, image-processing peripherals, and a multi-standard memory interface. Power-management is handled by an integrated power-management unit enabling the deep low-power states required for eReader battery-life targets.
Typical applications include consumer eReaders, electronic shelf labels, outdoor digital signage, industrial kiosks, and other low-power display products. Per NXP product documentation, the MCIMX507CVM1B has entered the NXP End-of-Life process, so design teams targeting long-life programs should evaluate the recommended NXP replacement.
Designers should plan for a multi-layer PCB (typically 6+ layers) for the high-speed memory bus and route impedance-controlled display traces to the BGA escape region. Thermal management at 800 MHz is generally passive on a properly designed 4-layer board, but enclosure thermal analysis is recommended for sealed outdoor products.
This page synthesizes NXP product-page status, distributor pricing, drop-in package alternatives, and practical design notes not aggregated on the manufacturer product page.
直接替換替代品，適用於 MCIMX507CVM1B — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MCIMX507CVM1B （相同外形與佔位） — 差異在於 Mounting Type, Package.
MCIMX508CVM1B
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MCIMX507CZK1B
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MCIMX508CZK1B
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MCIMX507CVM1B 最大額定值與電氣特性
| Family | i.MX50 |
| Core Architecture | ARM Cortex-A8 (ARMv7-A) |
| Core Count | 1 |
| Data Width | 32-bit |
| Maximum CPU Clock | 800 MHz |
| Integrated Display Controller | Hardware Electronic Paper Display (EPD) controller |
| 封裝 | 400-MAPBGA (17x17 mm) |
| 安裝類型 | Surface Mount (BGA) |
| Temperature Grade | Commercial |
| Terminal Form | Ball |
| Number of Terminals | 400 |
| Package Code | LFBGA / MAPBGA |
| Package Shape | Square |
| RoHS 狀態 | Compliant |
MCIMX507CVM1B square 腳位配置指南
MCIMX507CVM1B（square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MCIMX507CVM1B.
請參閱 資料表 以查看完整腳位配置。
典型應用
MCIMX507CVM1B 適用於 6 應用s: Consumer eReader Devices, Electronic Shelf Labels (ESL), Outdoor Digital Signage, Industrial Kiosks and Information Displays, Smart Home Control Panels, Industrial HMI with E-Paper.
Consumer eReader Devices
The MCIMX507CVM1B's integrated hardware EPD controller makes it a drop-in solution for eReader mainboards. The 800 MHz Cortex-A8 core runs the eReader UI and PDF engine while the EPD block handles waveform sequencing, partial refresh, and dithering. Compared to using a generic MPU plus a discrete EPD timing FPGA, the i.MX507 reduces BOM cost and PCB area. The 400-MAPBGA exposes parallel display buses for direct e-paper panel connection, simplifying the display interface. Software reuse from the i.MX508 shortens development. Battery-life targets are met by the i.MX50 power-management unit's deep-sleep states.
推薦
Electronic Shelf Labels (ESL)
Retail electronic shelf labels leverage the i.MX507's hardware EPD controller for ultra-low-power bistable display updates over wireless links. The Cortex-A8 handles the ESL gateway stack and price-update logic; the EPD block drives the segmented e-paper panel without CPU intervention during refresh. The commercial temperature grade covers indoor retail environments. Because ESL deployments span thousands of units per store, the i.MX50's mature Linux BSP and NXP longevity commitment (prior to EOL) made it attractive. Power budgeting is dominated by wireless TX events, not MPU active current.
推薦
Outdoor Digital Signage
Outdoor e-paper signage benefits from the i.MX507's combination of Cortex-A8 throughput for content rendering and hardware EPD acceleration for sunlight-readable bistable displays. The 800 MHz clock renders signage graphics efficiently while the EPD block manages partial updates without flicker. The commercial temperature range suits sheltered outdoor enclosures. Designers pair the i.MX507 with a low-power Wi-Fi or cellular module for remote content updates. The 400-MAPBGA supports the high-bandwidth memory bus needed for large signage bitmaps.
推薦
Industrial Kiosks and Information Displays
Self-service kiosks and information displays use the MCIMX507CVM1B when a low-power e-paper UI is preferred over backlit LCD. The Cortex-A8 runs kiosk application logic and the EPD block updates the user interface without backlight power. The commercial-grade temperature window covers indoor retail and transit environments. Linux BSP maturity and the i.MX50 peripheral mix (I2C, SPI, UART, USB) ease integration with payment terminals, barcode scanners, and NFC modules. Compared to LCD-based kiosks, e-paper variants cut standby power dramatically.
推薦
Smart Home Control Panels
Battery-powered smart-home control panels with e-paper touch UI leverage the i.MX507's hardware EPD controller for always-on, low-power status displays. The Cortex-A8 handles wireless stack (Zigbee, Thread, or Matter-bridge) and user-input processing. Deep-sleep power states allow multi-month battery life between charges. The 400-MAPBGA exposes GPIO and PWM channels sufficient for haptic feedback and LED indicators. Compared to TFT-LCD panels, e-paper variants eliminate the dominant backlight power drain.
推薦
Industrial HMI with E-Paper
Industrial HMI panels requiring sunlight-readable, low-power displays pair the MCIMX507CVM1B with e-paper modules for factory-floor status displays. The Cortex-A8 handles Modbus/Profibus gateway logic while the EPD block updates operator status screens without flicker. The commercial temperature range suits climate-controlled cabinets. The 400-MAPBGA supports the high-speed memory bus needed for large status bitmaps. Compared to character-LCD HMIs, e-paper variants improve readability in high-glare environments and reduce cabinet thermal load.
推薦
推薦產品摘要
工程參考資料，適用於 MCIMX507CVM1B — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MCIMX508CVM1B | MCIMX507CZK1B | MCIMX508CZK1B |
|---|---|---|---|---|
| Package | 400-MAPBGA (17x17 mm) | 400-MAPBGA (17x17 mm) - same | 400-MAPBGA (17x17 mm) - same | 400-MAPBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Family | i.MX50 | i.MX50 | i.MX50 | i.MX50 |
| Core | ARM Cortex-A8 | ARM Cortex-A8 | ARM Cortex-A8 | ARM Cortex-A8 |
| CPU Clock | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Hardware EPD Controller | Integrated | Integrated | Integrated | Integrated |
| Temperature Grade | Commercial | Commercial | Extended (per ZK suffix) | Extended (per ZK suffix) |
| Lifecycle Status | Last Time Buy | Discontinued/EOL (i.MX508) | Last Time Buy | Discontinued/EOL |
主要差異化特點
- Integrated hardware EPD controller versus discrete FPGA solutions (對比Generic Cortex-A8 MPU without integrated EPD controller)
- Proven i.MX50 software ecosystem versus newer i.MX6/i.MX7 (對比i.MX6ULL / i.MX7D)
- Pin-compatible with i.MX508 predecessor for layout reuse (對比MCIMX508CVM1B)
設計說明
The 400-MAPBGA 17x17 mm package requires a 6+ layer PCB stack-up with impedance-controlled traces for the DDR memory bus. Use the i.MX50 Hardware Development Guide reference footprint and route all DDR signals on inner planes to minimize via stubs. Place decoupling capacitors on the BGA-side solder side directly below their respective power balls, using micro-via connections to inner power planes.
Estimated: At 800 MHz full CPU load on a properly designed 4-layer PCB with adequate copper pour, junction temperature rise above ambient is typically under 25C. The 400-MAPBGA exposes a thermal pad region - stitch the inner ground plane to maximize heat spreading. For sealed outdoor enclosures with limited convection, perform a thermal simulation at the highest expected ambient (typically +70C commercial grade).
The MCIMX507CVM1B has been flagged Last Time Buy by NXP - do not start new high-volume designs on this part without an NXP-confirmed second source or replacement. Verify boot-mode strap pin pull resistors against the i.MX50 reference manual, since incorrect boot configuration is the most common bring-up failure. Always use NXP-provided BSP and u-boot for production images to avoid uninitialized peripheral state.
合規資訊
RoHS and lead-free per NXP product page. Halogen-free status not explicitly stated in verified data. AEC-Q100 not applicable - this is a commercial-grade consumer MPU.
