MPC8379VRAGD - 400MHz PowerQUICC II Pro MPU | NXP | 689-BGA
MPN： MPC8379VRAGD ✗ 停產MPC8379VRAGD 概覽
A PowerPC microprocessor is a reduced-instruction-set computing (RISC) processor originally designed by the AIM alliance (Apple, IBM, Motorola) and now maintained by NXP for embedded applications. PowerQUICC II Pro extends the original PowerQUICC architecture with integrated peripherals for communications processing, encryption acceleration, and DDR memory control. Within the hierarchy, a microprocessor belongs to the broader category of processors, alongside microcontrollers (MCU), DSPs, and application processors. The MPC83xx series specifically targets SOHO routers, industrial control, and networked storage.
Key features of the MPC8379VRAGD include a 400 MHz e300c4s core, single-core 32-bit operation, integrated DDR memory controller, dual 10/100/1000 Ethernet MACs, USB 2.0, PCI Express, and security acceleration engines on the E-variant (absent on the standard MPC8379VRAGD). The IC operates from a 1 V core supply voltage and integrates common networking peripherals, reducing external component count in router, gateway, and NAS designs.
The architecture pairs the e300c4s execution core with a QUICC Engine communications processor module for offloading packet processing, enabling line-rate throughput without burdening the host CPU. This heterogeneous dual-engine design is the hallmark of the PowerQUICC II Pro family and is often selected where deterministic networking performance is required alongside general-purpose Linux or VxWorks application hosting.
Typical applications for MPC8379VRAGD include small-office/home-office (SOHO) routers, networked attached storage (NAS) controllers, industrial gateways, protocol converters, and embedded Linux appliances. The wide peripheral integration also makes it a candidate for printer controllers and point-of-sale terminals requiring both networking and general-purpose compute.
When designing with this device, ensure the PCB layout follows the TEPBGA II 31 x 31 mm land pattern with matched-impedance routing for DDR memory and Ethernet signals. Power sequencing of the 1 V core and 3.3 V I/O rails must follow the order specified in the manufacturer datasheet to avoid latch-up during power-up.
This page consolidates distributor pricing, drop-in alternative BGA parts, and practical design considerations not found in a single datasheet, giving engineers an actionable comparison reference for MPC8300-series microprocessors.
直接替換替代品，適用於 MPC8379VRAGD — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8379VRAGD （相同外形與佔位） — 差異在於 Core Architecture, RoHS Status, Security Engine.
MPC8379EVRAGD
✅ 直接替換聯絡詢價
查看資料表 →MPC8379CVRAGD
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MPC8378VRAGD
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8377VRAGD
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MPC8360EVRAGD
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8379VRAGD 最大額定值與電氣特性
| Processor Type | MPC83xx PowerQUICC II Pro 32-Bit |
| Core Architecture | PowerPC e300c4s |
| Number of Cores | 1 |
| 資料匯流排寬度 | 32-bit |
| 最大時脈頻率 | 400 MHz |
| Core Supply Voltage | 1 V |
| 封裝 / 外殼 | 689-BBGA Exposed Pad (TEPBGA II 31x31) |
| 安裝類型 | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| RoHS 狀態 | RoHS Compliant |
| Integrated Peripherals | DDR memory controller, dual GbE MACs, USB 2.0, PCIe |
| Security Engine | Not present (no-PB / non-E variant) |
| Family | MPC8300 / MPC8379 series |
| Encryption Variant | MPC8379VRAGD (no encryption accelerator) |
MPC8379VRAGD 689-bbga exposed pad (tepbga ii 31x31) 腳位配置指南
MPC8379VRAGD（689-bbga exposed pad (tepbga ii 31x31) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC8379VRAGD.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8379VRAGD 適用於 6 應用s: SOHO Router and Small-Business Gateway, Network-Attached Storage (NAS) Controller, Industrial Protocol Gateway, Embedded Linux Appliance, Printer and MFP Controller, Point-of-Sale (POS) Terminal.
SOHO Router and Small-Business Gateway
The MPC8379VRAGD fits SOHO router designs because its 400 MHz e300c4s core delivers enough compute for routing, NAT, and firewall workloads while the integrated dual Gigabit Ethernet MACs handle WAN-LAN bridging without external PHY bridge chips. The QUICC Engine offloads packet classification from the host CPU, sustaining line-rate throughput on GbE interfaces. Compared with a discrete MPU plus GbE switch solution, the MPC8379VRAGD's integrated peripherals reduce BOM count and PCB area, while its 689-TEPBGA II package preserves thermal headroom in fanless router enclosures. Power consumption at full CPU utilization is governed by the 1 V core rail and scales with traffic load.
推薦
Network-Attached Storage (NAS) Controller
In NAS controllers for small-business and home-server products, the MPC8379VRAGD runs the storage management stack (SMB/NFS/iSCSI) on its 400 MHz e300c4s core while the integrated SATA and GbE interfaces attach directly to disk drives and the network. The DDR memory controller supports the large working sets required by caching and RAID metadata operations. Compared with a general-purpose ARM Cortex-A MPU, the MPC8379VRAGD's deterministic QUICC Engine packet handling delivers predictable I/O latency for file-serving workloads. Its 689-TEPBGA II package requires careful PCB thermal design when fully loaded with multiple SATA drives.
推薦
Industrial Protocol Gateway
The MPC8379VRAGD is well-suited for industrial gateways translating Modbus, PROFINET, EtherNet/IP, or serial protocols between field devices and Ethernet backbones. Its 32-bit PowerPC e300c4s core at 400 MHz runs real-time operating systems (RTOS) or embedded Linux to host protocol stacks, while the integrated Ethernet and serial peripherals eliminate external bridge ICs. Industrial-grade parts can operate across extended temperature ranges per the manufacturer datasheet. The 689-TEPBGA II footprint with exposed pad enables reliable thermal performance in sealed industrial enclosures, providing years of maintenance-free operation.
推薦
Embedded Linux Appliance
The MPC8379VRAGD hosts embedded Linux distributions targeting industrial appliances such as building automation controllers, security panels, or remote sensor aggregation hubs. Its 400 MHz e300c4s core provides the headroom required for full Linux kernel, file system, and networking stack while the integrated DDR controller supports the larger memory footprint typical of Linux deployments. The 689-TEPBGA II package is footprint-compatible across the MPC8300 family, simplifying board variants for different feature mixes. Boot is typically from NOR flash or SPI with main image on NAND or eMMC behind a local bus.
推薦
Printer and MFP Controller
Multi-function printer (MFP) controllers rely on the MPC8379VRAGD's combination of processing throughput and peripheral integration to drive the print engine, scan subsystem, and network interfaces simultaneously. The e300c4s core at 400 MHz handles job queuing, image rendering, and PCL/PostScript interpreters, while the integrated Ethernet and USB peripherals provide the connectivity users expect from networked office equipment. Compared with discrete processor-plus-controller chip designs, the integrated architecture lowers BOM cost and simplifies EMC compliance by reducing high-speed signal traces. Thermal design must account for the 689-TEPBGA II package.
推薦
Point-of-Sale (POS) Terminal
POS terminals benefit from the MPC8379VRAGD's deterministic real-time performance and rich peripheral set, which together manage barcode scanners, receipt printers, payment terminals, and Ethernet back-office connectivity. The 400 MHz PowerPC core runs the terminal application stack and encryption routines for payment data, while DDR memory and integrated GbE MACs sustain fast transaction throughput. The 689-TEPBGA II footprint provides a stable mechanical platform for the ruggedized chassis typical of retail POS hardware. Operating temperature and reliability targets align with industrial-grade MPU variants of this family.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8379VRAGD — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8379EVRAGD | MPC8378VRAGD | MPC8377VRAGD | MPC8360EVRAGD |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same |
| Core Architecture | PowerPC e300c4s | PowerPC e300c4s | PowerPC e300c4s | PowerPC e300c4s | PowerPC e300c3 |
| Maximum Clock Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | up to 667 MHz |
| Encryption Engine | Not present (no-PB variant) | Present (E variant) | Not present | Not present | Present (E variant) |
| DDR Memory Controller | DDR2 | DDR2 | DDR2 | DDR2 | DDR1 |
| Core Voltage | 1 V | 1 V | 1 V | 1 V | 1 V |
| Pin Compatibility | Reference | Drop-in | Drop-in | Drop-in | Drop-in (same footprint) |
主要差異化特點
- Lower-cost no-PB variant for designs without encryption offload (對比MPC8379EVRAGD)
- Newer DDR2 controller vs older family members (對比MPC8360EVRAGD)
- Single 1 V core rail simplifies PMIC design (對比MPC8379CVRAGD)
設計說明
The 689-TEPBGA II (31x31 mm) package requires careful PCB thermal management because the die is large and the package exposes its pad through the bottom for heat dissipation. Estimated: at 1 GHz-equivalent worst-case CPU utilization on the 1 V core, expect 4-6 W dissipation that must be conducted through the BGA ground/power plane stack-up. Use a 4-layer board with at least two solid internal ground planes stitching under the part, and follow the manufacturer thermal via array pattern under the exposed pad. Verify junction temperature against the system thermal budget with the manufacturer theta_JA value.
Route matched-impedance differential pairs (Ethernet, PCIe) per the manufacturer IBIS models and reference design. Estimated: a 100-ohm differential impedance with 5 mil trace on a 4-layer stack-up typically requires a 6-8 mil dielectric to the nearest reference plane. The DDR2 memory controller needs tight length matching across the address/command and clock groups; consult the manufacturer DDR2 design guide for tJITTER and skew budgets.
Do not power the 1 V core rail before the 3.3 V I/O rail, otherwise the I/O buffers may be back-driven through the ESD structures and latch-up can occur. Decoupling must include high-frequency ceramic (0.1 uF X7R) on every power pin plus bulk polymer or ceramic capacitors near the BGA edges. Verify boot mode configuration pins are pulled to the correct logic levels before the POR signal is released, or the part may fail to start. Estimated: a 10 ms reset-to-clock delay is typical before boot ROM sampling takes effect.
合規資訊
RoHS and lead-free status confirmed per DigiKey product listing. Halogen-free status not stated in available data. Not AEC-Q100 qualified - this is a commercial/industrial MPU. Reach compliance inferred from NXP general policy.
