MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023
MPN： MPC8572VTAVNE ✓ 啟用中MPC8572VTAVNE 概覽
A communications SoC (System-on-Chip) of this class integrates one or more general-purpose CPU cores, a high-throughput memory subsystem, and a flexible I/O fabric on a single die. Within the broader taxonomy, the MPC8572VTAVNE is a member of the microprocessor family (MPU), a subclass of integrated circuits, and is specifically targeted at data-plane and control-plane workloads where a single chip must terminate multiple high-speed serial links. The PowerQUICC III lineage from NXP is the third generation of the PowerQUICC architecture, designed for symmetric and asymmetric multi-core systems in networking infrastructure.
Key differentiating features include dual e500 cores with separate L1 caches, hardware table lookup and pattern-matching accelerators used for packet classification, support for DDR2 and DDR3 memory controllers with ECC, three PCI Express interfaces, dual Gigabit Ethernet MACs, Serial RapidIO (SRIO), and an integrated security engine. The 1023-ball FCBGA package exposes the full set of high-speed serial links and parallel memory buses needed for backplane routing, while a dedicated local bus controller can interface to legacy Flash and peripherals.
Architecturally, the MPC8572VTAVNE relies on the Power Architecture Book E instruction set, augmented by the Signal Processing Engine (SPE) for SIMD-style DSP operations, and a coherent CoreNet platform fabric that ties the cores, L2, and I/O together with hardware snoop and coherency. Compared with general-purpose CPUs, this design is optimized for predictable interrupt latency, DMA-driven packet movement, and tight integration with networking peripherals - which is why it has historically been preferred for line-card SoCs in switches and routers.
Typical applications include enterprise switching and routing line cards, LTE and WiMAX base-station baseband processing, industrial control and factory automation controllers, military and aerospace ruggedized networking, and storage-area network (SAN) controllers. The wide I/O mix also makes it a frequent choice for medical imaging and high-end embedded instrumentation.
When designing with this part, ensure the PCB has a sufficient copper pour and via hole stitching beneath the FCBGA land pattern to meet the 1023-ball thermal dissipation requirement; the 1.1 V core rail demands a low-noise multi-phase regulator. Avoid signal routing under the package and place the DDR2/DDR3 memory as close as possible to the controller pins to maintain timing margins.
This page synthesizes distributor stock levels, official NXP documentation, and a same-package cross-reference list that is not aggregated anywhere else, providing engineers a one-stop view for MPC8572VTAVNE selection, sourcing, and lifecycle planning.
直接替換替代品，適用於 MPC8572VTAVNE — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8572VTAVNE （相同外形與佔位） — 差異在於 Core Architecture, Memory Controller, Package, Ethernet, Operating Temperature.
MPC8572EVTAVNE
✅ 直接替換聯絡詢價
查看資料表 →MPC8572ELVTAVND
✅ 直接替換聯絡詢價
查看資料表 →MPC8572VTAVND
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8572EVTATLD
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8572ECVTAVNE
✅ 直接替換聯絡詢價
查看資料表 →MPC8572VTAVNE 最大額定值與電氣特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Core Architecture | PowerPC e500 (Book E, with SPE/APU) |
| Number of Cores | 2 |
| Core Clock Frequency (max) | 1.5 GHz |
| 工作溫度範圍 | 0 C to +105 C |
| Core Voltage | 1.1 V |
| L2 Cache | 1 MB (shared) |
| Memory Controller | DDR2 / DDR3 with ECC |
| PCI Express | 3 x PCIe interfaces |
| Ethernet MAC | 2 x 10/100/1000 Mbps (Triple Speed) |
| Serial RapidIO | Yes |
| Security Engine | Integrated |
| 封裝 | 1023-ball FCBGA, 33 mm x 33 mm |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | compliant |
| Product Family | PowerQUICC III (MPC85xx) |
MPC8572VTAVNE 1023-ball fcbga, 33 mm x 33 mm 腳位配置指南
MPC8572VTAVNE（1023-ball fcbga, 33 mm x 33 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC8572VTAVNE.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8572VTAVNE 適用於 6 應用s: Enterprise Switching and Routing Line Cards, LTE and WiMAX Base Station Baseband, Industrial Control and Factory Automation, Storage Area Network (SAN) and RAID Controllers, Military and Aerospace Ruggedized Networking, Medical Imaging and High-End Embedded Instrumentation.
Enterprise Switching and Routing Line Cards
The MPC8572VTAVNE's dual 1.5 GHz PowerPC e500 cores and three PCI Express interfaces make it ideal for line cards in enterprise switches and routers. The cores run forwarding tables, ACLs, and routing protocols, while the integrated Triple-Speed Gigabit Ethernet MACs terminate multiple copper or SGMII uplinks without an external PHY controller. Hardware pattern-matching engines accelerate IPsec and packet classification at line rate, while the 1023-ball FCBGA exposes full 64-bit DDR2/DDR3 with ECC for routing-table memory. Compared with a discrete CPU-plus-NPU design, this SoC reduces BOM, PCB area, and certification cost for a multi-gigabit line card.
推薦
LTE and WiMAX Base Station Baseband
Wireless base-station baseband processing demands deterministic packet throughput, hardware-accelerated encryption, and high-bandwidth memory. The MPC8572VTAVNE delivers all three: dual e500 cores run Layer 2/3 stack and MAC scheduling, the Signal Processing Engine (SPE) accelerates FFT and turbo-decoding primitives, and the integrated security engine terminates IPsec traffic to the core network. The 1 MB shared L2 cache and 64-bit DDR2/DDR3 controller with ECC handle the high packet-rate bursts typical of LTE PHY layer queues. Serial RapidIO connects cleanly to DSP clusters or RF front-end cards without an external bridge.
推薦
Industrial Control and Factory Automation
Factory automation controllers require deterministic real-time response, deterministic Ethernet, and a robust operating temperature range. The MPC8572VTAVNE's two e500 cores can be partitioned between a real-time control loop (VxWorks or QNX) and an HMI or scripting engine, sharing memory through the coherent CoreNet fabric. Dual Gigabit Ethernet MACs support deterministic protocols such as EtherCAT, Profinet, or TSN bridges via external PHYs. The 0 to +105 C extended commercial temperature rating, plus ECC-protected memory, supports long-life factory-floor installations where downtime is costly.
推薦
Storage Area Network (SAN) and RAID Controllers
External RAID controllers and SAN fabric switches need high-throughput DMA, ECC-protected memory, and multiple high-speed serial links. The MPC8572VTAVNE's three PCI Express interfaces map directly to a SAS/SATA HBA, an FC HBA, and an external management link, while the Serial RapidIO port provides an alternative fabric for tightly-coupled storage clustering. ECC on the DDR2/DDR3 controller protects against silent bit errors that would otherwise corrupt large-capacity storage arrays. The dual e500 cores run a real-time I/O scheduler and management UI simultaneously.
推薦
Military and Aerospace Ruggedized Networking
Defense and aerospace networking systems need long lifecycle, extended temperature operation, and high-bandwidth deterministic processing. The MPC8572VTAVNE is qualified for 0 to +105 C operation, with the MPC8572ELVTAVND variant pushing this to -40 to +105 C for harsher platforms. The FCBGA package is compatible with PCB staking and underfill processes used for vibration resistance. Its hardware encryption accelerators offload AES, DES, and SHA workloads from the cores, freeing CPU cycles for protocol processing and situational-awareness tasks on tactical networks.
推薦
Medical Imaging and High-End Embedded Instrumentation
Ultrasound and CT imaging systems need high-throughput data acquisition, real-time DSP, and reliable data links to a host PC. The MPC8572VTAVNE combines dual 1.5 GHz e500 cores with the Signal Processing Engine, allowing beamforming and reconstruction algorithms to be partitioned efficiently across cores. The three PCI Express interfaces connect to FPGAs or analog front-end digitizers, and the dual Gigabit Ethernet MACs stream processed images to the host at line rate. ECC memory protects diagnostic integrity, while the FCBGA package simplifies thermal management in compact enclosures.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8572VTAVNE — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8572EVTAVNE | MPC8572ELVTAVND | MPC8572VTAVND | MPC8572ECVTAVNE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Core Architecture | PowerPC e500 dual-core | PowerPC e500 dual-core (same) | PowerPC e500 dual-core (same) | PowerPC e500 dual-core (same) | PowerPC e500 dual-core (same) |
| Core Clock Frequency (max) | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| L2 Cache | 1 MB (shared) | 1 MB (shared) | 1 MB (shared) | 1 MB (shared) | 1 MB (shared) |
| Security Engine | Integrated SEC 3.x | Enhanced SEC 4.x (improved) | Enhanced SEC 4.x (improved) | Integrated SEC 3.x (same) | Encryption-disabled 'C' variant |
| Operating Temperature | 0 C to +105 C | 0 C to +105 C | -40 C to +105 C (industrial) | 0 C to +105 C | 0 C to +105 C |
| PCI Express Interfaces | 3 | 3 | 3 | 3 | 3 |
| DDR Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
主要差異化特點
- Enhanced security engine in the E variant (對比MPC8572EVTAVNE)
- Industrial temperature grade with ECC in the ELVTAVND variant (對比MPC8572ELVTAVND)
- Encryption-disabled 'C' revision variant for export-controlled designs (對比MPC8572ECVTAVNE)
設計說明
Estimated: the 1023-ball FCBGA at 33 x 33 mm has a typical theta_JA in the 8-12 C/W range when mounted on a 4-layer JEDEC test PCB. At full dual-core 1.5 GHz operation the part dissipates approximately 12-15 W; ensure at least 1 oz copper planes plus thermal vias under the die, and consider a small heatsink or forced airflow for fanless enclosures. Junction temperature must stay below 105 C to match the operating spec.
Use a 0.4 mm ball-pitch escape pattern with 0.4 mm laser-drilled microvias in a sequential lamination stack-up. The FCBGA land pads must be NSMD (Non-Solder Mask Defined) per JEDEC recommendations for fine-pitch BGA to reduce pad cracking. Match the DDR2/DDR3 trace lengths to within 50 mils and place the memory chips within 50 mm of the SoC for clean signal integrity.
The 1.1 V core rail should be supplied by a multi-phase buck regulator with at least 20 A peak capability. Use 22 uF X5R ceramic bulk plus 470 uF polymer bulk decoupling at the FCBGA. The DDR termination rail (VTT) needs to track VDDQ within +/-50 mV; a dedicated VTT LDO is recommended. Decouple every supply pin with a 100 nF X7R cap as close to the ball as layout allows.
Do not route high-speed SERDES (PCIe, SRIO, SGMII) signals under the FCBGA or across reference plane splits - this destroys signal integrity and causes link training failures. Always boot from a NAND Flash or NOR Flash image verified on the actual board rev; the MPC8572VTAVNE does not have internal ROM, so an invalid boot image causes silent no-boot. Confirm the board's RCW (Reset Configuration Word) matches your boot source selection.
Place the 125 MHz system reference clock oscillator within 5 cm of the MPC8572VTAVNE clock inputs, guarded by a continuous GND plane and routed length-matched to other clocks. Use 4-mil 50-ohm controlled-impedance traces for PCIe and SGMII SERDES, with ground stitching vias every 200 mils. Match intra-pair skew to within 5 mils and inter-pair skew to within 20 mils for proper eye margins.
合規資訊
RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified - this part is intended for networking and industrial applications, not automotive. Halogen-free status was not confirmed in the Verified Web Data and is listed as unknown.
