NT5CC256M16CN-FLNA - 4Gb DDR3L SDRAM 256Mx16 | Nanya
MPN: NT5CC256M16CN-FLNA ✓ 啟用中NT5CC256M16CN-FLNA 概覽
DDR3L (Low Voltage DDR3) is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining similar performance. It is part of the DDR3 SDRAM family, which uses double data rate architecture to transfer data on both edges of the clock, and is widely used in computing, networking, and embedded systems.
Key features include a 16n prefetch architecture, on-die termination (ODT), programmable CAS latency, and burst lengths of 8 and 4. The device supports auto-refresh and self-refresh modes, with a temperature-compensated self-refresh (TCSR) for industrial temperature ranges. It also features a programmable output driver impedance and a DLL for precise timing.
Technically, the NT5CC256M16CN-FLNA uses a 30nm-class process technology, achieving high density with low power. The memory array is organized into 8 banks, each with 32K rows, providing efficient row activation and precharge. The device includes a mode register set (MRS) for configuration, and supports write leveling and read leveling for improved signal integrity in high-speed systems.
Typical applications include DDR3L memory modules for laptops, servers, and industrial PCs, as well as embedded systems such as network routers, set-top boxes, and automotive infotainment. Its low voltage and wide temperature range make it suitable for battery-powered and harsh environments.
When designing with this device, ensure proper decoupling capacitors near the VDD and VDDQ pins, and follow the PCB layout guidelines for DDR3L to maintain signal integrity. The device requires a stable 1.35V supply and a reference voltage (VREF) for the address and control signals.
直接替換替代品,適用於 NT5CC256M16CN-FLNA — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號: NT5CC256M16CN-FLNA (相同外形與佔位) — 差異在於 Package, CAS Latency, Data Rate, Burst Length, Operating Temperature Range.
NT5CC256M16DN-FLNA
✅ 直接替換聯絡詢價
查看資料表 →NT5CC256M16ER-FLNA
✅ 直接替換聯絡詢價
查看資料表 →MT41K256M16HA-125
✅ 直接替換 ⚠️ 規格未經驗證✗ 缺貨
$6.3636 / 單位
查看資料表 →IS43TR16512B-125K
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品(不在目錄中)
K4B4G1646E-BYMA
✅ 直接替換 ⚠️ 規格未經驗證✗ 缺貨
$14.3182 / 單位
查看資料表 →NT5CC256M16CN-FLNA 最大額定值與電氣特性
| 記憶體類型 | DDR3L SDRAM |
| Density | 4 Gb |
| 組織 | 256M x 16 |
| Supply Voltage (VDD) | 1.35 V (1.283 V to 1.45 V) |
| Supply Voltage (VDDQ) | 1.35 V (1.283 V to 1.45 V) |
| 資料速率 | 1866 Mbps (max) |
| CAS 延遲 | 13 (at 1866 Mbps) |
| Burst Length | 8, 4 |
| Number of Banks | 8 |
| 封裝 | 96-ball FBGA |
| 工作溫度範圍 | 0C to +95C (TC) commercial, -40C to +95C industrial, -40C to +105C automotive |
| Storage Temperature | -55C to +100C |
| Refresh | Auto-refresh, self-refresh, TCSR |
| RoHS | Compliant |
| Lead-Free | Yes |
NT5CC256M16CN-FLNA 腳位配置
| 腳位 A1 | VDD — Power supply |
| 腳位 A2 | DQ0 — Data input/output 0 |
| 腳位 A3 | DQ1 — Data input/output 1 |
| 腳位 A4 | VSS — Ground |
| 腳位 A5 | DQ2 — Data input/output 2 |
| 腳位 A6 | DQ3 — Data input/output 3 |
| 腳位 A7 | VDDQ — I/O power supply |
| 腳位 A8 | DQ4 — Data input/output 4 |
| 腳位 A9 | DQ5 — Data input/output 5 |
| 腳位 A10 | VSS — Ground |
| 腳位 A11 | DQ6 — Data input/output 6 |
| 腳位 A12 | DQ7 — Data input/output 7 |
典型應用
NT5CC256M16CN-FLNA 適用於 6 應用s: Laptop Memory Modules, Networking Equipment, Automotive Infotainment, Industrial PCs, Set-Top Boxes, Embedded Systems.
Laptop Memory Modules
The NT5CC256M16CN-FLNA is ideal for DDR3L SO-DIMM modules used in laptops and ultrabooks. Its low 1.35V operation reduces power consumption, extending battery life. With a 4Gb density and 1866 Mbps data rate, it provides high performance for multitasking and multimedia applications. The 96-ball FBGA package enables compact module designs, and the industrial temperature range supports ruggedized laptops.
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Networking Equipment
In routers, switches, and network appliances, the NT5CC256M16CN-FLNA provides high-bandwidth memory for packet buffering and routing tables. Its 1866 Mbps data rate ensures low latency, while the 1.35V supply reduces heat generation in dense networking hardware. The automotive temperature grade (-40C to +105C) is suitable for outdoor and industrial networking equipment. The 96-ball FBGA package allows high-density memory arrays on compact PCBs.
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Automotive Infotainment
The NT5CC256M16CN-FLNA is designed for automotive infotainment systems, supporting navigation, audio, and video playback. Its wide temperature range (-40C to +105C) ensures reliable operation in extreme conditions. The low 1.35V supply reduces power consumption, critical for automotive battery management. With 4Gb density, it can store large maps and media data. The 96-ball FBGA package is AEC-Q100 qualified for automotive use.
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Industrial PCs
Industrial PCs require robust memory for 24/7 operation in harsh environments. The NT5CC256M16CN-FLNA offers an industrial temperature range (-40C to +95C) and high reliability. Its 4Gb density supports demanding applications like machine vision and process control. The 1.35V supply reduces heat dissipation, improving system longevity. The 96-ball FBGA package is ideal for compact industrial motherboards.
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Set-Top Boxes
Set-top boxes use DDR3L memory for video decoding and streaming. The NT5CC256M16CN-FLNA provides 4Gb capacity and 1866 Mbps bandwidth, enabling smooth 4K video playback. Its low power consumption is ideal for always-on devices. The commercial temperature range (0C to +95C) is sufficient for consumer electronics. The 96-ball FBGA package allows compact designs for slim set-top boxes.
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Embedded Systems
The NT5CC256M16CN-FLNA is suitable for various embedded systems, including medical devices, test equipment, and IoT gateways. Its low voltage and wide temperature range make it versatile. The 4Gb density provides ample memory for complex applications. The 96-ball FBGA package is easy to integrate into custom PCBs. The device supports self-refresh and TCSR for power saving in battery-powered systems.
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推薦產品摘要
工程參考資料,適用於 NT5CC256M16CN-FLNA — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | NT5CC256M16DN-FLNA | NT5CC256M16ER-FLNA | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Nanya Technology | Nanya Technology | Nanya Technology | Micron Technology |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps |
| Operating Temperature | 0C to +95C (commercial) | 0C to +95C (commercial) | 0C to +95C (commercial) | 0C to +95C (commercial) |
| Automotive Grade | Yes (up to +105C) | Yes (up to +105C) | Yes (up to +105C) | Yes (up to +105C) |
主要差異化特點
- Automotive temperature grade available (對比MT41K256M16HA-125)
- Low voltage operation (對比IS43TR16512B-125K)
- High data rate (對比K4B4G1646E-BYMA)
設計說明
Ensure stable 1.35V supply with low ripple. Use 0.1uF decoupling capacitors near each VDD and VDDQ pin, and a 10uF bulk capacitor per power plane. The VREF should be bypassed with a 0.1uF capacitor to ground.
Follow DDR3L layout guidelines: match trace lengths for DQ, DQS, and address/control signals to within 0.5mm. Maintain 50-ohm impedance for single-ended signals and 100-ohm differential for DQS. Keep VREF traces isolated from switching signals.
The device can dissipate up to 1.5W during operation. Ensure adequate airflow or a thermal pad to the PCB. The 96-ball FBGA package has a theta_JA of approximately 35C/W, so keep ambient temperature within the specified range.
合規資訊
RoHS compliant per Nanya datasheet. AEC-Q100 qualified for automotive grade.