PIC24FJ1024GB610-I/BG - 16-bit 1MB Flash USB MCU | Microchip
MPN： PIC24FJ1024GB610-I/BG ✓ 啟用中PIC24FJ1024GB610-I/BG 概覽
A 16-bit microcontroller (MCU) is a programmable processor that uses 16-bit-wide data paths, registers, and instructions, occupying the middle tier of the MCU hierarchy: microcontroller -> 16-bit MCU -> 32-bit MCU -> microprocessor. PIC24F parts extend Microchip's legacy 8-bit PIC architecture into the 16-bit domain with enhanced DSP instructions, hardware multipliers, and richer analog peripherals, while retaining the same MPLAB X toolchain and PICkit programmer compatibility for migration paths from smaller PIC families.
Key features include dual-bank Flash with ECC for safety-critical firmware, hardware USB 2.0 full-speed OTG, up to 32 KB RAM, configurable peripheral pin select (PPS) for flexible signal routing, a 16-channel 12-bit ADC, multiple UART/SPI/I2C interfaces, and Microchip's proprietary eXtreme Low-Power technology that achieves sub-1 microamp sleep currents suitable for battery-powered applications. The Live Update dual-partition scheme enables in-field firmware upgrades without halting operation.
The PIC24FJ1024GB610 family is built on a modified Harvard architecture with a 24-bit instruction word and 16-bit data path, providing deterministic interrupt response and supporting C-compiled code via the MPLAB XC16 toolchain. The 121-pin TFBGA package exposes the full peripheral set including up to 85 I/O pins, parallel master port (PMP), and graphics-friendly LCD controller signals, making it suitable for human-machine interface designs.
Typical applications include industrial control panels with TFT displays, USB peripherals and dongles, portable medical monitoring devices, low-power IoT sensor hubs, battery-powered data loggers, and consumer audio products with USB audio streaming. The combination of large Flash and Live Update also suits automotive aftermarket infotainment modules requiring in-field firmware updates.
When designing with this part, allocate careful attention to the dual-Flash partition scheme during firmware architecture decisions, ensure the TFBGA land pattern complies with 0.8 mm pitch BGA assembly guidelines, and leverage the Peripheral Pin Select feature to route digital peripherals to any available I/O pin for simplified PCB layout. This page synthesizes distributor stock, real-time pricing, drop-in same-package alternatives, and design notes not consolidated in the manufacturer datasheet.
直接替換替代品，適用於 PIC24FJ1024GB610-I/BG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC24FJ1024GB610-I/BG （相同外形與佔位） — 差異在於 Package, ADC, Core Architecture, Timers, Program Memory (Flash).
PIC24FJ1024GA610-I/BG
✅ 直接替換聯絡詢價
查看資料表 →PIC24FJ1024GB610T-I/BG
✅ 直接替換聯絡詢價
查看資料表 →PIC24FJ1024GB610-I/PT
✅ 直接替換聯絡詢價
查看資料表 →PIC24FJ1024GB606-I/MR
✅ 直接替換📋 參考替代品（不在目錄中）
PIC24FJ1024GA610-E/PT
✅ 直接替換聯絡詢價
查看資料表 →PIC24FJ1024GA606-I/MR
✅ 直接替換聯絡詢價
查看資料表 →PIC24FJ1024GB610-I/BG 最大額定值與電氣特性
| Core Architecture | PIC24F (16-bit modified Harvard) |
| Maximum CPU Frequency | 32 MHz (16 MIPS) |
| Program Flash Memory | 1 MB (1024 KB) with ECC |
| RAM | 32 KB |
| Live Update Dual Partition | Yes (dual-bank Flash for firmware swap) |
| USB Interface | USB 2.0 Full-Speed OTG |
| ADC | 12-bit, up to 16 channels |
| I/O Pins (max) | 85 |
| Operating Voltage Range | 2.0 V to 3.6 V |
| 工作溫度範圍 | -40C to +85C (Industrial, /I grade) |
| 封裝 | 121-TFBGA, 10x10 mm, 0.8 mm pitch |
| 安裝類型 | Surface Mount |
| Peripheral Pin Select (PPS) | Yes |
| eXtreme Low-Power (XLP) | Yes (sub-uA sleep modes) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
PIC24FJ1024GB610-I/BG 121-tfbga, 10x10 mm, 0.8 mm pitch 腳位配置指南
PIC24FJ1024GB610-I/BG（121-tfbga, 10x10 mm, 0.8 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC24FJ1024GB610-I/BG.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC24FJ1024GB610-I/BG 適用於 7 應用s: Industrial Control Panels with TFT LCD, USB Peripherals and Dongles, Portable Medical Monitoring Devices, Low-Power IoT Sensor Hubs, Battery-Powered Data Loggers, Consumer Audio with USB Streaming, Automotive Aftermarket Infotainment.
Industrial Control Panels with TFT LCD
The PIC24FJ1024GB610-I/BG fits industrial HMI panels because its 1 MB Flash stores full graphical UI assets and fonts, while the parallel master port (PMP) drives TFT displays directly without an external graphics controller. Peripheral Pin Select (PPS) routes up to 85 I/O pins for keypad scanning, LEDs, and external sensors. The 16-bit PIC24F core at 16 MIPS renders 2D widgets fast enough for 30 fps refresh on QVGA displays. XLP sleep modes drop quiescent current below 1 microamp during display idle, extending product battery life. Designers use the Live Update dual-partition feature for field firmware upgrades without halting production line operation.
推薦
USB Peripherals and Dongles
The PIC24FJ1024GB610-I/BG is purpose-built for USB peripherals with its integrated USB 2.0 Full-Speed OTG controller, supporting device, host, and On-The-Go roles. The 1 MB Flash accommodates USB class drivers, HID descriptors, and application firmware simultaneously without external memory. 32 KB RAM handles USB endpoint buffers and protocol stacks. The MCU's 12 MIPS instruction throughput is sufficient for full-speed (12 Mbps) data streaming and HID polling. Engineers can implement USB headsets, barcode scanners, custom HID devices, and CDC serial dongles using Microchip's free USB stack and MPLAB X IDE.
推薦
Portable Medical Monitoring Devices
The PIC24FJ1024GB610-I/BG suits portable medical devices requiring long battery life, reliable data storage, and USB connectivity for data transfer to PCs. Its eXtreme Low-Power technology achieves sub-microamp sleep currents critical for wearable pulse oximeters and glucose meters, while the 16-channel 12-bit ADC samples multiple biosensors. The 1 MB Flash stores weeks of measurement logs without external EEPROM, and ECC ensures data integrity for compliance with IEC 62304 documentation requirements. Live Update dual-partition firmware supports field upgrades for algorithm improvements without service interruptions.
推薦
Low-Power IoT Sensor Hubs
Battery-powered IoT sensor hubs benefit from the PIC24FJ1024GB610-I/BG's eXtreme Low-Power technology, which provides sleep currents below 1 microamp and fast wake-up times under 5 microseconds. The 1 MB Flash stores multiple wireless protocol stacks (LoRaWAN, BLE bridges via UART, Zigbee) along with application logic. PPS allows flexible assignment of SPI/I2C/UART to any I/O for connecting radios and sensors. The USB OTG enables local diagnostics or charging. Industrial temperature range ensures operation in outdoor enclosures. Live Update dual-partition enables OTA-style firmware swap via wired interface.
推薦
Battery-Powered Data Loggers
The PIC24FJ1024GB610-I/BG is well-suited for multi-channel data loggers measuring temperature, voltage, or process signals over weeks on battery power. Its 16-channel 12-bit ADC captures sensor data while eXtreme Low-Power modes keep quiescent draw minimal between samples. The 1 MB Flash with ECC stores 100,000+ log entries with error protection, replacing external EEPROM. Peripheral Pin Select routes SPI/I2C sensor interfaces, UART for GPS or cellular modules, and SD card interfaces via PMP. USB allows quick data download to PCs without removing storage media.
推薦
Consumer Audio with USB Streaming
USB audio dongles and consumer headsets leverage the PIC24FJ1024GB610-I/BG's USB Full-Speed OTG, supporting USB Audio Class 1.0 at 24-bit/48 kHz. The 16 MIPS PIC24F core runs DSP routines for equalization and noise reduction alongside USB streaming. 32 KB RAM buffers audio packets. The 12-bit ADC supports microphone capture. Designers can implement headphone amplifiers, USB speakers, and gaming headsets using Microchip's USB audio framework. Low sleep current preserves battery life during Bluetooth standby when used with companion radios.
推薦
Automotive Aftermarket Infotainment
The PIC24FJ1024GB610-I/BG is a strong fit for aftermarket automotive infotainment modules requiring firmware updates and USB media playback. Its USB OTG reads USB sticks and smartphones for music playback, while the 1 MB Flash stores audio codecs (MP3, AAC) and UI logic. The Live Update dual-partition scheme is critical for in-field firmware upgrades without bricking devices in customer vehicles. Industrial temperature grade handles cabin conditions. For AEC-Q100 automotive qualification, design engineers should select the -E/PT grade variant or the dedicated automotive PIC24FJ family.
推薦
推薦產品摘要
工程參考資料，適用於 PIC24FJ1024GB610-I/BG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC24FJ1024GA610-I/BG | PIC24FJ1024GB610T-I/BG | PIC24FJ1024GB610-I/PT | PIC24FJ1024GB606-I/MR | PIC24FJ1024GA610-E/PT | PIC24FJ1024GA606-I/MR |
|---|---|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10) | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 100-TQFP (12x12) | 64-QFN (9x9) | 100-TQFP (12x12) | 64-QFN (9x9) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | PIC24F 16-bit, 32 MHz | PIC24F 16-bit, 32 MHz | PIC24F 16-bit, 32 MHz | PIC24F 16-bit, 32 MHz | PIC24F 16-bit, 32 MHz | PIC24F 16-bit, 32 MHz | PIC24F 16-bit, 32 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| RAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB | USB 2.0 FS OTG | No USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | No USB | No USB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (Extended) | -40C to +85C |
| Live Update Dual Partition | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
主要差異化特點
- Only same-family variant with USB 2.0 FS OTG (對比PIC24FJ1024GA610-I/BG)
- Live Update dual-partition Flash for in-field firmware upgrade (對比PIC24FJ256GB106-I/PT)
- 121-TFBGA exposes full peripheral set including parallel master port (對比PIC24FJ1024GB610-I/PT)
設計說明
The 121-TFBGA package has 0.8 mm ball pitch on a 10x10 mm substrate. Design PCB land patterns per IPC-7351 with non-solder mask defined (NSMD) pads for best BGA reliability. Use microvia-in-pad stackup if the board is less than 1.6 mm thick, or standard through-hole vias with adequate teardrops. Plan for X-ray inspection during assembly because BGA joints cannot be visually inspected. Include at least 4 thermal vias under the center balls to dissipate the ~300 mW typical operating power.
The PIC24FJ1024GB610 operates from 2.0 V to 3.6 V with separate analog and digital supply pins (AVDD/AVSS and VDDCORE). Place 10 uF + 0.1 uF ceramic decoupling close to each AVDD pin and 1 uF + 0.1 uF near each VDDCORE pin. Use a ferrite bead or pi-filter between VDD and VDDCORE if noise-sensitive analog measurements (12-bit ADC) coexist with switching digital loads. Enable the on-chip voltage regulator with the standard 1 uF + 470 pF cap network shown in the datasheet DS30010074F typical application circuit.
When using the Live Update dual-partition feature, ensure linker scripts reserve the alternate partition's vector table and reserved regions per the MPLAB XC16 examples. Forgetting to mark both partitions as active can cause the bootloader to appear successful while the new firmware never executes after reset. Also note that Peripheral Pin Select (PPS) lock bits must be configured AFTER assigning all required peripheral mappings - locked mappings cannot be reconfigured until the next POR.
USB Full-Speed signal integrity requires a 90-ohm differential impedance on the D+/D- pair routed as matched-length traces with no splits. Place the USB connector within 25 mm of the MCU pins to minimize stubs. Add 15 kV ESD protection diodes on D+/D-/VUSB lines if the design exposes the USB port to user touch. Tie the VBUS pin to the cable VBUS through a divider or comparator per the USB OTG specification, and include 10 uF bulk capacitance on the VBUS pin for device/host role switching.
合規資訊
RoHS compliant per Microchip product page. Industrial temperature grade (-40C to +85C). Not AEC-Q100 qualified - select automotive-grade variants (with -E suffix or check PIC24FJ automotive family) for vehicle applications.
