PIC32MM0016GPL036-E/M2 - 16KB Flash 32-bit MCU | Microchip
MPN： PIC32MM0016GPL036-E/M2 ✓ 啟用中PIC32MM0016GPL036-E/M2 概覽
A PIC microcontroller is a programmable embedded controller based on the Harvard-architecture MIPS32 microAptiv core. Within the broader taxonomy, PIC32MM belongs to the 32-bit MCU family -> microcontroller -> embedded processor -> semiconductor IC. PIC32MM GPL variants specifically target eXtreme Low Power (XLP) applications, offering sleep currents down to 500 nA and small 4x4 mm packages, making them well-suited to space-constrained and battery-powered designs.
Key features include 16 KB Flash program memory, 4 KB SRAM, microMIPS instruction support for code density, multiple low-power sleep modes, a peripheral set that typically includes 12-bit ADC, comparators, timers, and configurable logic cells. The 36-pin SQFN (6x6 mm) package with an exposed thermal pad supports compact PCB layouts while providing a low-thermal-resistance path to the board copper for thermal dissipation during full 25 MHz operation.
The microAptiv core implements both MIPS32 and microMIPS instruction sets, achieving high code density without sacrificing throughput. Integrated peripherals include USB, I2C, SPI, UART, and motor-control PWMs depending on the device sub-series. The 12-bit 1.1 Msps ADC with up to 13 channels supports mixed-signal front-ends for sensor conditioning, while configurable logic cells allow glue-logic integration that previously required a CPLD.
Typical applications include low-power IoT sensor nodes, wearable fitness bands, battery-powered remote controls, motor-control BLDC drivers, and small home appliances. The 16 KB Flash / 4 KB RAM envelope fits compact state machines and simple communication stacks (BLE, LoRa, sub-GHz proprietary).
When designing with this device, ensure the exposed pad is soldered to a sufficiently large copper pour (at least 25 mm²) to meet datasheet thermal resistance specifications and to carry the device's ground return. Configure unused pins as digital outputs low to minimize sleep-mode current leakage per Microchip's XLP design guidelines.
This page synthesizes distributor pricing, pin-compatible Microchip alternatives, and practical low-power design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 PIC32MM0016GPL036-E/M2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC32MM0016GPL036-E/M2 （相同外形與佔位） — 差異在於 Package, ADC, Operating Temperature, Core Architecture, MSL Level.
PIC32MM0016GPL036-I/M2
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC32MM0016GPL036-I/M2
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC32MM0016GPL036-E/M2 最大額定值與電氣特性
| Core Architecture | MIPS32 microAptiv |
| Core Series | PIC32MM GPL |
| Maximum CPU Frequency | 25 MHz |
| CoreMark Score | 79 |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data Memory (SRAM) | 4 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| Supply Voltage Typ. | 3.3 V |
| 工作溫度 | -40°C to +125°C (Extended, -E suffix) |
| 封裝 | 36-pin SQFN (6x6 mm) with Exposed Pad |
| 安裝類型 | Surface Mount |
| Instruction Set | MIPS32 / microMIPS |
| Sleep Current (XLP) | 500 nA typical |
| MSL 等級 | MSL1 (per JEDEC J-STD-020) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
PIC32MM0016GPL036-E/M2 腳位配置
| 腳位 1 | RPB0/AN0/C1IND — GPIO/PMA/AN0 |
| 腳位 2 | RPB1/AN1/C1INC — GPIO/PMA/AN1 |
| 腳位 3 | RPB2/AN2/C2IND — GPIO/AN2 |
| 腳位 4 | RPB3/AN3/C2INC — GPIO/AN3 |
| 腳位 5 | VDD — Positive supply voltage (2.0-3.6V) |
| 腳位 6 | VSS — Ground reference |
| 腳位 7 | RPB4/AN4 — GPIO/AN4 |
| 腳位 8 | RPB5/AN5 — GPIO/AN5 |
| 腳位 9 | RPB6/AN6 — GPIO/AN6 |
| 腳位 10 | RPB7/AN7 — GPIO/AN7 |
| 腳位 11 | RPC0 — GPIO |
| 腳位 12 | RPC1 — GPIO |
| 腳位 13 | RPC2 — GPIO |
| 腳位 14 | RPC3 — GPIO |
| 腳位 15 | RPC4 — GPIO |
| 腳位 16 | RPC5 — GPIO |
| 腳位 17 | RPC6 — GPIO |
| 腳位 18 | RPC7 — GPIO |
| 腳位 19 | RPC8 — GPIO |
| 腳位 20 | RPC9 — GPIO |
| 腳位 21 | VSS — Ground reference |
| 腳位 22 | VDD — Positive supply voltage (2.0-3.6V) |
| 腳位 23 | MCLR — Master Clear reset input (active low) |
| 腳位 24 | PGED1 — Programming/debug data line |
| 腳位 25 | PGEC1 — Programming/debug clock line |
| 腳位 26 | OSC1/CLKI — Crystal oscillator input or external clock |
| 腳位 27 | OSC2/CLKO — Crystal oscillator output or clock output |
| 腳位 28 | RPD0 — GPIO |
| 腳位 29 | RPD1 — GPIO |
| 腳位 30 | RPD2 — GPIO |
| 腳位 31 | RPD3 — GPIO |
| 腳位 32 | RPD4 — GPIO |
| 腳位 33 | RPD5 — GPIO |
| 腳位 34 | RPD6 — GPIO |
| 腳位 35 | RPD7 — GPIO |
| 腳位 36 | RPD8 — GPIO |
典型應用
PIC32MM0016GPL036-E/M2 適用於 6 應用s: Battery-Powered IoT Sensor Node, Wearable Fitness Band, Remote Control (IR/RF), Small Home Appliance (BLDC Motor Control), Industrial Sensor Transmitter, Smart LED Lighting Controller.
Battery-Powered IoT Sensor Node
The PIC32MM0016GPL036-E/M2 fits battery-powered IoT sensor nodes because its XLP sleep currents down to 500 nA enable multi-year coin-cell operation, while the 25 MHz microAptiv core wakes quickly to process sensor samples. The 16 KB Flash accommodates small BLE or LoRaWAN protocol stacks with microMIPS compression, and 4 KB SRAM is sufficient for buffering sensor payloads before transmission. Typical deployment achieves 5+ year battery life with 1% duty cycle.
推薦
Wearable Fitness Band
For wearable fitness bands, the PIC32MM0016GPL036-E/M2's 6x6 mm SQFN package fits space-constrained PCB layouts while delivering 32-bit performance for step counting and heart-rate processing algorithms. The microAptiv core executes motion-processing firmware at 25 MHz with low active power, and 16 KB Flash holds compact pedometer and HRM algorithms. Sleep modes below 1 uA extend battery life between charges, critical for 24/7 wear scenarios.
推薦
Remote Control (IR/RF)
Remote controls benefit from the PIC32MM0016GPL036-E/M2's deep-sleep current of 500 nA, allowing alkaline batteries to last the entire shelf-life plus years of standby. The 25 MHz core handles IR protocol encoding or RF sub-GHz packet generation, and 16 KB Flash supports multiple protocol variants (NEC, RC5, proprietary). The 36-pin SQFN exposes ample GPIO for key matrix scanning and LED indicators without external glue logic.
推薦
Small Home Appliance (BLDC Motor Control)
The PIC32MM0016GPL036-E/M2 drives small BLDC motors in appliances like desk fans, personal blenders, or pump controllers. The 25 MHz core runs sensorless BEMF detection algorithms, while the on-chip PWM and 12-bit ADC generate motor drive waveforms with closed-loop control. 16 KB Flash fits standard state-machine control code, and the extended -40 to +125C temperature grade tolerates appliance thermal environments.
推薦
Industrial Sensor Transmitter
For industrial 4-20 mA loop-powered transmitters, the PIC32MM0016GPL036-E/M2's extended -40 to +125C temperature grade and 16 KB Flash accommodate linearization, HART or IO-Link protocol stacks, and self-calibration routines. The microAptiv core handles floating-point math via software libraries, while XLP sleep modes reduce loop current draw below 3.5 mA. The 12-bit ADC integrates 13 channels for multi-sensor measurement and diagnostics.
推薦
Smart LED Lighting Controller
The PIC32MM0016GPL036-E/M2 controls smart LED fixtures by generating PWM dimming signals and running communication protocols like ZigBee, BLE, or DMX. Its 25 MHz core processes dimming curves and color-mixing math in real time, while 4 KB SRAM buffers frame data. Low sleep currents enable standby power below 0.5 W to meet energy-saving regulations like Energy Star, and 16 KB Flash holds complete lighting firmware.
推薦
推薦產品摘要
工程參考資料，適用於 PIC32MM0016GPL036-E/M2 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC32MM0016GPL036-I/M2 | PIC32MM0032GPL028-I/M6 |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 36-pin SQFN (6x6) | 36-pin SQFN (6x6) | 28-pin UQFN |
| Flash Memory | 16 KB | 16 KB | 32 KB |
| SRAM | 4 KB | 4 KB | 4 KB |
| Maximum Clock | 25 MHz | 25 MHz | 25 MHz |
| CoreMark Score | 79 | 79 | 79 |
| Operating Voltage | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V |
| Temperature Grade | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
主要差異化特點
- Extended -40C to +125C industrial temperature range (對比PIC32MM0016GPL036-I/M2)
- 36-pin count for maximum GPIO peripheral access (對比PIC32MM0032GPL028-I/M6)
設計說明
The 36-pin SQFN package has an exposed thermal pad that must be soldered to a ground-pour copper area of at least 25 mm² on the PCB. At 25 MHz active operation the device dissipates approximately 20-30 mW depending on peripheral activity. Without proper thermal pad soldering, junction temperature can rise above datasheet limits during sustained full-load operation, especially at +125C ambient.
For lowest sleep current (down to 500 nA per Microchip XLP datasheet figures), disable all unused peripherals via PMD registers before entering sleep, and configure all unused GPIO as digital outputs driven low. Use the on-chip LDO regulator mode (rather than external) when possible, and ensure the VDDCORE pin has a 10 uF ceramic decoupling capacitor placed within 5 mm of the pin.
Place a 0.1 uF ceramic decoupling capacitor as close as possible to each VDD/VSS pair (typically one per supply pin pair). Add a bulk 4.7-10 uF tantalum or ceramic capacitor at the regulator output. Keep the crystal traces (OSC1/OSC2) short and symmetric, surrounded by a ground guard ring to minimize EMI susceptibility. Route the PGED/PGEC traces symmetrically and keep them away from switching signals.
合規資訊
RoHS and REACH compliant per Microchip product documentation. -E suffix denotes extended temperature grade, not AEC-Q100 automotive qualification.
