RTAX4000SL-CQ352E - 4M-Gate Rad-Tolerant FPGA, 352-CQFP | Microchip
MPN： RTAX4000SL-CQ352E ✓ 啟用中RTAX4000SL-CQ352E 概覽
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the radiation environment of space, including proton and heavy-ion bombardment encountered in low-Earth orbit and deep-space missions. Within the programmable logic hierarchy, the RTAX4000SL sits at the top tier of the RTAX-S/SL family (semiconductor -> programmable logic device -> FPGA -> radiation-tolerant FPGA), one step above the mid-density RTAX2000S/SL and sharing its architecture with the commercial Axcelerator family from which it was derived.
Key features include densities of up to four million system gates, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and dedicated carry logic for arithmetic datapaths. The anti-fuse-based fabric is live-at-power-up, eliminating the need for external configuration flash and reducing boot-time risk in orbit. The ceramic CQFP package provides the hermeticity required for space qualification flows.
Architecturally, the RTAX4000SL derives from the commercial Axcelerator family, so designers can prototype using low-cost, reprogrammable equivalents and then migrate the EDIF netlist and pinout to the radiation-tolerant device using Microchip's documented prototyping methodology and footprint-compatible adaptor boards.
Typical applications include satellite payload processing, spacecraft bus controllers, telemetry and command interfaces, and radiation-exposed instrumentation where single-chip, low-power, live-at-power-up operation is mandatory.
A critical design consideration is the use of Triple-Module Redundancy (TMR) in the RTL for flip-flops sensitive to single-event upsets, since anti-fuse FPGAs tolerate configuration upsets well but user flip-flops still require mitigation.
This page synthesizes distributor data, drop-in alternative analysis, and practical space-design notes not found in the manufacturer datasheet, with pricing and stock signals refreshed as of 2026-09-01.
直接替換替代品，適用於 RTAX4000SL-CQ352E — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： RTAX4000SL-CQ352E （相同外形與佔位） — 差異在於 Package, Family, Radiation Tolerance, Logic Cells, Configuration.
RTAX4000SL-1CQ352E
✅ 直接替換聯絡詢價
查看資料表 →RTAX4000SL-CQ352B
✅ 直接替換聯絡詢價
查看資料表 →RTAX4000SL-1CQ352PROTO
✅ 直接替換📋 參考替代品（不在目錄中）
5962-0822405VXC
✅ 直接替換📋 參考替代品（不在目錄中）
RTAX4000SL-CQ352M
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
RTAX4000SL-CQ352E 最大額定值與電氣特性
| Family | RTAX-SL (RTAX-S/SL and RTAX-DSP) |
| Equivalent System Gates | 4,000,000 |
| Logic Cells / Cells | 40,320 |
| Total Logic Modules | 60,480 |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| 封裝 | 352-terminal CQFP (ceramic quad flat pack) |
| Terminal Pitch | 0.500 mm |
| Radiation Tolerance | Radiation-tolerant (space-flight grade) |
| Configuration | Anti-fuse, live at power-up, single-chip |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Arithmetic Support | Dedicated carry logic |
| 工作溫度 | -55C to +125C |
| 安裝類型 | Surface Mount |
| Typical Applications | Space-flight systems, satellites |
RTAX4000SL-CQ352E 352-terminal cqfp (ceramic quad flat pack) 腳位配置指南
RTAX4000SL-CQ352E（352-terminal cqfp (ceramic quad flat pack) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： RTAX4000SL-CQ352E.
請參閱 資料表 以查看完整腳位配置。
典型應用
RTAX4000SL-CQ352E 適用於 6 應用s: Satellite Payload Processing, Spacecraft Bus Control, Telemetry and Command Interfaces, Radiation-Exposed Instrumentation, On-Board Data Handling and Storage Control, Space-Grade Prototyping and Verification.
Satellite Payload Processing
The RTAX4000SL-CQ352E fits satellite payload processing because its 4 million system gates and 40,320 logic cells absorb image preprocessing, compression engines, and protocol offload in a single anti-fuse device that is live at power-up - critical when a payload must respond the instant orbit power is applied. The embedded SRAM blocks with built-in FIFO control buffer high-rate sensor streams without external memory, and dedicated carry logic accelerates arithmetic datapaths. At a 1.5V core on 0.15 um CMOS, dynamic power stays within typical small-satellite power budgets. Unlike SRAM FPGAs, the anti-fuse configuration carries no configuration-upset risk in orbit, so SEU mitigation concentrates on user flip-flops via TMR.
推薦
Spacecraft Bus Control
For spacecraft bus controllers - handling telemetry, telecommand, and mode management - the RTAX4000SL-CQ352E offers single-chip integration without external configuration devices, reducing board area and failure modes. The segmentable clock structure lets one FPGA serve independent bus clock domains safely, and chip-wide highway routing eases timing closure for cross-domain control logic. Its -55C to +125C operating range covers eclipse-driven thermal swings, and the hermetic 352-pin CQFP supports the assembly processes used in high-reliability spacecraft electronics. Designers typically implement CCSDS or custom TM/TC framing directly in the fabric, using the 1.5V core to minimize standby power during safe mode.
推薦
Telemetry and Command Interfaces
Telemetry and telecommand interfaces benefit from the RTAX4000SL-CQ352E's anti-fuse live-at-power-up behavior: the interface is functional before any processor boots, enabling independent health monitoring and emergency command paths. The 40,320-cell capacity accommodates multiple redundant UART/MIL-STD-1553/SpaceWire-style front ends plus framing, CRC, and FIFO buffering in embedded SRAM. Carry-logic chains speed up CRC and checksum computation at low clock rates, cutting power. Because the configuration fabric is immune to configuration upsets, a watchdog-free command path can be trusted for mission-critical safing functions; only register-level TMR is required for long-mission SEU rates.
推薦
Radiation-Exposed Instrumentation
Scientific instruments on interplanetary probes and Earth-observation satellites face total ionizing dose and single-event effects that commercial FPGAs cannot survive. The RTAX4000SL-CQ352E, as a radiation-tolerant RTAX-SL device, provides 4M gates of design capacity with a configuration fabric immune to upsets, allowing instrument sequencing, ADC control, and on-board data reduction in one device. Its -55C to +125C range handles instrument thermal environments, and the 1.5V core limits self-heating in vacuum where only conduction cooling exists. The 352-terminal CQFP hermetic package is compatible with the staking and bonding practices used in high-reliability instrument assemblies.
推薦
On-Board Data Handling and Storage Control
Mass-memory units and solid-state recorders use the RTAX4000SL-CQ352E to manage flash arrays, error correction, and downlink formatting. The embedded SRAM with built-in FIFO control provides ping-pong buffering between acquisition and telemetry channels, while the 40,320 logic cells host BCH or Reed-Solomon style EDAC pipelines using dedicated carry logic. Segmentable clocks let acquisition, EDAC, and downlink domains run at independent frequencies for power optimization. Since the anti-fuse configuration is fixed, boot-time is zero - the memory controller is protecting stored data from the first millisecond after power application, which protects data integrity through brown-out and reset events in orbit.
推薦
Space-Grade Prototyping and Verification
Microchip's documented methodology pairs the RTAX4000SL-CQ352E flight device with low-cost prototyping paths: the RTAX4000SL-1CQ352PROTO offers the same functional characteristics in a non-hermetic package, and commercial Axcelerator devices run the design on a footprint-compatible adaptor board using an EDIF netlist and pinout converter (application note AC170). This workflow lets teams verify RTL, timing, and board-level bring-up before committing scarce flight units, then migrate unchanged to the CQ352E. Budgeting prototype hardware early avoids schedule risk, because flight-unit RTAX devices carry long lead times when distribution stock is exhausted.
推薦
推薦產品摘要
工程參考資料，適用於 RTAX4000SL-CQ352E — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | RTAX4000SL-1CQ352E | RTAX4000SL-CQ352B | RTAX4000SL-1CQ352PROTO | 5962-0822405VXC |
|---|---|---|---|---|---|
| Package | 352-pin CQFP | 352-pin CQFP - same | 352-pin CQFP - same | 352-pin CQFP (non-hermetic PROTO) | 352-pin CQFP - same |
| Brand | Actel / Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 |
| Logic Cells | 40,320 | 40,320 | 40,320 | 40,320 | 40,320 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Hermeticity / Intended Use | Hermetic ceramic, flight | Hermetic ceramic, flight | Hermetic ceramic, flight | Non-hermetic, prototyping only | Hermetic ceramic, SMD-screened flight |
| Configuration Technology | Anti-fuse, live at power-up | Anti-fuse, live at power-up | Anti-fuse, live at power-up | Anti-fuse, live at power-up | Anti-fuse, live at power-up |
主要差異化特點
- Standard speed grade at lower cost (對比RTAX4000SL-1CQ352E)
- Flight-hermetic package versus prototype (對比RTAX4000SL-1CQ352PROTO)
- Commercial ordering path versus SMD screening (對比5962-0822405VXC)
設計說明
The 352-pin CQFP with 0.500 mm pitch and large body requires careful simultaneous-switching-noise management: distribute VSSI/VDDI return pins across the ring and keep high-fanout clocks on the segmentable clock resources rather than general routing. Series-terminate outputs driving backplane or harness lines - the ceramic package's lead inductance is higher than a BGA, so edge rates on fast speed grades (-1) can ring on longer traces. Microchip's RTAX-S/SL datasheet high-speed I/O section gives per-bank drive strengths; derate for vacuum operation where no convection assists trace heating.
Do not plan an RTL migration from commercial Axcelerator prototypes without following Microchip application note AC170: the supported path uses a footprint-compatible adaptor board plus an EDIF netlist and pinout converter, not a direct bitstream transfer. Also remember that anti-fuse devices are one-time programmable - a design change after programming means a new flight unit, so freeze RTL and complete TMR verification (flip-flop triple modular redundancy for SEU mitigation) before submitting devices for programming. Ordering PROTO devices (e.g., RTAX4000SL-1CQ352PROTO) for bring-up avoids burning flight hardware.
Estimated: power budgeting for the RTAX4000SL must combine 1.5V core dynamic power with I/O bank currents; use Microchip's SmartPower tool with your placed netlist rather than rule-of-thumb numbers, since a 4M-gate design can span a wide power range depending on clock activity. At a 1.5V core, every 100 mA of core current is only 150 mW, but I/O banks at 2.5V/3.3V often dominate. In vacuum, all heat leaves by conduction only - verify the CQFP-to-chassis thermal path (wedge-lock or thermal pad) before finalizing the power budget.
合規資訊
Space-flight hermetic ceramic CQFP packaging; qualification is per space/military flows rather than AEC-Q100. RoHS/REACH status not stated in provided data - hermetic ceramic packages with alloy-42 or similar leads may carry exemptions; confirm with Microchip.
