XC6SLX9-L1FT256I - Spartan-6 LX FPGA, 186 I/O | Xilinx
MPN: XC6SLX9-L1FT256I ✓ 啟用中XC6SLX9-L1FT256I 概覽
A field-programmable gate array is a programmable digital semiconductor whose logic and interconnect resources are configured after manufacture. The Spartan-6 LX family belongs to the broader FPGA hierarchy, where FPGAs sit between fixed-function logic ICs and larger programmable systems. This device therefore combines the flexibility of software-programmable logic with the parallel processing performance and deterministic I/O behavior required by embedded control systems.
The XC6SLX9-L1FT256I provides 9,152 logic cells, 186 user I/O, and 589,824 equivalent logic gates. Its -1L speed and temperature designations distinguish it from faster Spartan-6 grades and commercial-temperature variants. The 256-ball package supports dense board-level integration without relying on a leaded package. Because FPGA utilization depends on the implemented architecture, timing closure, pin constraints, and I/O standards, not only the nominal cell count, designers should evaluate each design against its actual resource map.
Spartan-6 devices use configurable logic blocks connected by programmable routing and include dedicated resources for memories, multipliers, clock management, and signal processing. This architecture allows parallel datapaths to execute multiple operations per clock cycle and makes the device suitable for deterministic control and high-throughput digital signal processing. The supplied verified data confirms the device family and resources but does not provide detailed block-RAM, DSP-slice, PLL, or maximum I/O-frequency figures for this exact ordering code.
Typical uses include industrial control, embedded instrumentation, communications gateways, data acquisition, digital signal processing, and general-purpose programmable logic. The 186 available user I/O allow external memory, sensors, converters, transceivers, and status or control signals to be integrated close to the FPGA fabric. The compact 256-ball package is especially useful when board area is constrained but a large pin count is required.
Designers should preserve the package-specific pinout and power architecture, assign pins through the supported Xilinx toolchain, and validate all I/O standards against the device constraints. They should also confirm timing, supply requirements, temperature limits, and tool support for the production design before committing the obsolete-capable package to a new platform.
This page combines verified distributor data, same-family drop-in alternatives, application guidance, and practical migration considerations. It highlights where engineers can preserve an existing PCB and where speed-grade, temperature, resource, or toolchain differences still require qualification.
直接替換替代品,適用於 XC6SLX9-L1FT256I — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號: XC6SLX9-L1FT256I (相同外形與佔位) — 差異在於 Speed Grade, Operating Temperature, Package, Logic Cells, Process Technology.
XC6SLX9-2FT256I
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX9-2FTG256I
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX9-L1FTG256I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品(不在目錄中)
XC6SLX9-1FT256I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品(不在目錄中)
XC6SLX9-3FT256I
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →XC6SLX9-L1FT256I 最大額定值與電氣特性
| Device Type | Field-Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 9,152 cells |
| Equivalent Logic Gates | 589,824 gates |
| User I/O | 186 I/O |
| 封裝 | 256-ball LBGA |
| Total Package Balls | 256 balls |
| Logic Architecture | 6-input LUT |
| Speed Grade | -1L |
| Temperature Grade | Industrial |
XC6SLX9-L1FT256I 256 balls 腳位配置指南
XC6SLX9-L1FT256I(256 balls 封裝)的腳位配置。 此數位 IC 包含 GPIO、通訊介面(UART、SPI、I2C)與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料: XC6SLX9-L1FT256I.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC6SLX9-L1FT256I 適用於 6 應用s: Industrial Programmable Control, Data Acquisition and Signal Conditioning, Communications Gateway, Digital Signal Processing, Embedded Instrumentation, General-Purpose Embedded Logic.
Industrial Programmable Control
The XC6SLX9-L1FT256I fits industrial programmable control because it combines 9,152 logic cells with 186 user I/O in a 256-ball package. Those resources can implement state machines, interlocks, sequencing, diagnostic logic, and communication handling while retaining deterministic parallel behavior. The -1L industrial ordering code is appropriate when the original design was qualified around that specific device. Implementation should use constrained Xilinx project settings, and designers should verify the exact industrial temperature limits and timing margin from the production documentation.
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Data Acquisition and Signal Conditioning
The XC6SLX9-L1FT256I can implement parallel data acquisition, filtering, thresholding, and data formatting because its 9,152 logic cells and 186 user I/O support multiple simultaneous channels. A 256-ball package permits direct connection to converters, sensors, memory, and interface transceivers without a large leaded footprint. Engineers should build the acquisition pipeline around parallel I/O, pipeline registers, and clock-domain controls. The verified data does not state maximum I/O frequencies or ADC-specific functions, so timing closure and converter compatibility must be established in the implementation tools.
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Communications Gateway
The XC6SLX9-L1FT256I is suitable for low-to-medium interface aggregation in industrial communications gateways, where 186 user I/O can connect several serial or parallel peripheral interfaces to programmable framing and protocol logic. Its parallel FPGA fabric allows transmit and receive paths to operate concurrently, while the 256-ball package supports a compact board layout. The implementation must define clock domains, constrain I/O timing, and validate protocol behavior against the chosen electrical interface. Because the supplied records do not specify transceiver resources or maximum interface rates, those values must be checked before architecture freeze.
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Digital Signal Processing
The XC6SLX9-L1FT256I can support digital signal processing pipelines using its 9,152 logic cells, six-input LUT architecture, and parallel I/O capability. Suitable tasks include filtering, correlation, waveform generation, and fixed-point arithmetic where independent operations benefit from parallel execution. Designers should map multiplies and memory into the appropriate Spartan-6 resources, then check timing closure at the required sample rate. Exact DSP-slice and block-RAM quantities were not included in the verified records, so the available implementation resources must be confirmed from the device data and synthesis results.
推薦
Embedded Instrumentation
The XC6SLX9-L1FT256I fits embedded instrumentation that combines sensor conditioning, digital filtering, calibration tables, status reporting, and a host interface. With 186 user I/O and a 256-ball package, it can consolidate interface logic around an FPGA-based measurement engine while keeping the assembly compact. Designers should partition the design into clock domains, use deterministic register stages, and reserve resources for calibration and diagnostics. The -1L industrial identity makes the exact original device preferable when maintaining an existing qualified platform, subject to confirming its complete environmental limits.
推薦
General-Purpose Embedded Logic
The XC6SLX9-L1FT256I can act as a general-purpose embedded logic platform for legacy expansion cards, test equipment, custom interface adapters, and specialized controllers. Its 186 user I/O and 9,152 logic cells provide enough parallel connectivity for multi-function glue logic without a processor, while the 256-ball package remains compatible with dense board assembly. A new design should avoid assuming that an FPGA can replace a soft processor automatically; it must define the boot configuration, clocking scheme, memory interface, and programming method. The legacy Spartan-6 toolchain should also be locked and archived for production maintenance.
推薦
推薦產品摘要
工程參考資料,適用於 XC6SLX9-L1FT256I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC6SLX9-2FT256I | XC6SLX9-2FTG256I | XC6SLX9-L1FTG256I | XC6SLX9-1FT256I | XC6SLX9-3FT256I |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (FTBGA-256) | 256-LBGA (FTBGA-256) | 256-LBGA (FTBGA-256) | 256-LBGA (FTBGA-256) | 256-LBGA (FTBGA-256) | 256-LBGA (FTBGA-256) |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 9,152 cells | 9,152 cells | 9,152 cells | 9,152 cells | 9,152 cells | 9,152 cells |
| Equivalent Logic Gates | 589,824 gates | 589,824 gates | 589,824 gates | 589,824 gates | 589,824 gates | 589,824 gates |
| User I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O |
| Speed Grade | -1L | -2 | -2 | -1L | -1 | -3 |
| Programming Tool Support | Xilinx ISE Design Suite | Xilinx ISE Design Suite | Xilinx ISE Design Suite | Xilinx ISE Design Suite | Xilinx ISE Design Suite | Xilinx ISE Design Suite |
主要差異化特點
- Exact original -1L device identity (對比XC6SLX9-2FT256I)
- Same 256-ball integration level (對比XC6SLX9-2FTG256I)
- No resource-count change across the listed alternatives (對比XC6SLX9-3FT256I)
設計說明
Treat the 256-ball package as a package-specific BGA rather than a generic 256-ball land pattern. According to the verified DigiChip record, the package is 17 mm by 17 mm with 1 mm pitch. Use AMD's published Spartan-6 package pinout files to verify every ball assignment, including dedicated configuration, clock, power, and ground balls. Do not derive the pinout from a visually similar XC6 device because unused or dedicated balls can differ even when the package dimensions match.
A same-family MPN with the same 256-ball package is not automatically a drop-in replacement. The target uses the -1L ordering code, while alternatives can use -1, -2, or -3 grades and different FT/FTG suffixes. Compare the exact package pinout, supported temperature range, speed grade, bitstream configuration, and timing closure before substitution. For an existing Spartan-6 design, preserve the original Xilinx ISE project and device constraints as the baseline.
Plan the FPGA's supply rails and decoupling from the exact device power table rather than from generic Spartan-6 guidance. The supplied verified records confirm the FPGA family and 256-ball package but do not include the XC6SLX9-L1FT256I core voltage, I/O voltage, current limits, power-up sequencing, or decoupling values. Those parameters must be obtained from the manufacturer document before schematic layout and power-budget review.
Reserve clean routing for configuration pins and clock inputs, and keep sensitive interfaces away from likely switching-current paths. Although the verified data does not provide the detailed package ball map, the AMD Spartan-6 package files provide the authoritative assignments. During layout review, verify that every assigned pin supports the intended I/O standard and that unused pins follow the manufacturer's termination requirements. Preserve those checks as part of manufacturing and board bring-up procedures.
合規資訊
The supplied verified records identify an industrial Spartan-6 LX FPGA but do not provide RoHS, REACH, lead-free, halogen-free, or conflict-minerals declarations. AEC-Q100 is not applicable to the industrial-grade ordering code identified in the supplied data.