XC7A200T-1SB484I - 215K Logic Cell Artix-7 FPGA | AMD
MPN： XC7A200T-1SB484I ✓ 啟用中XC7A200T-1SB484I 概覽
An FPGA is a programmable semiconductor in the broader semiconductor and digital-logic hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines programmable logic, block RAM, digital signal processing resources, and programmable I/O in one device. Artix-7 devices balance logic density, embedded memory, signal-processing capability, and low-cost packaging for designs requiring reconfigurable hardware or substantial parallel processing.
The XC7A200T provides 215,360 logic cells and 13,455,360 RAM bits, giving designers substantial capacity for control logic, protocol bridges, data acquisition, embedded vision, and digital signal processing. The device also includes 740 DSP slices according to the Artix-7 family specification summary. Its 285 I/Os provide substantial connectivity for parallel sensors, converters, memories, and communications interfaces.
The XC7A200T belongs to the Artix-7 product family, whose programmable architecture combines logic cells, block RAM, DSP slices, dedicated clocking resources, and programmable input/output. The 28 nm fabrication process supports a compact and power-efficient implementation for industrial, communications, instrumentation, and embedded-control systems. Configuration storage and the programming interface allow the same board design to support multiple hardware functions when field updates are required.
Typical uses include industrial data-acquisition systems, sensor and signal-processing platforms, communications infrastructure, embedded control, high-speed interface bridges, and machine-vision preprocessing. A 484-ball FCBGA also supports dense, high-speed PCB layouts with short escape paths, but it requires careful via-in-pad, solder-mask, and thermal-management practices. The package outline is 19 mm by 19 mm according to the product listing.
When planning a board, verify the SB484 ball map, differential-pair assignments, supply sequencing, and exposed thermal requirements against the AMD Artix-7 package documentation. The high pin count increases routing density, so ball-grid-array escape routing and power-plane integrity can be more consequential than they would be in a smaller package. Use the manufacturer’s pinout files and board-design guidance rather than inferring ball assignments from another Artix-7 package.
This page combines device specifications, package-aware alternatives, direct comparison parameters, and practical implementation guidance. It is designed to help engineers identify the correct Artix-7 density, speed grade, and package before committing to a high-pin-count PCB layout.
直接替換替代品，適用於 XC7A200T-1SB484I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7A200T-1SB484I （相同外形與佔位） — 差異在於 Package, Speed Grade, Mounting Type, Process Technology, Core Voltage.
XC7A200T-1FBG484I
✅ 直接替換✗ 缺貨
$38.5 / 單位
查看資料表 →XC7A200T-2FBG484I
✅ 直接替換✗ 缺貨
$89.15 / 單位
查看資料表 →XC7A200T-2SBG484I
✅ 直接替換📋 參考替代品（不在目錄中）
XC7A200T-L1FBG484I
✅ 直接替換📋 參考替代品（不在目錄中）
XC7A200T-L1SBG484I
✅ 直接替換📋 參考替代品（不在目錄中）
XC7A200T-1SB484I 最大額定值與電氣特性
| Device Type | Artix-7 field-programmable gate array |
| Logic Cells | 215,360 cells |
| Configurable Logic Blocks | 16,825 CLBs |
| Total RAM Bits | 13,455,360 bits |
| DSP Slices | 740 slices |
| Input/Output Count | 285 I/Os |
| Process Technology | 28 nm |
| Core Supply Voltage | 1 V |
| Speed Grade | -1 |
| 封裝 | 484-ball FCBGA, 19 mm x 19 mm |
| Device Family | Artix-7 |
| Programmable Logic | FPGA logic cells and configurable logic blocks |
| Embedded Memory | 13,455,360 RAM bits |
| Digital Signal Processing | 740 DSP slices |
| Temperature Grade | Industrial temperature grade |
| 安裝類型 | Surface-mount ball grid array |
XC7A200T-1SB484I 484-ball fcbga, 19 mm x 19 mm 腳位配置指南
XC7A200T-1SB484I（484-ball fcbga, 19 mm x 19 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC7A200T-1SB484I.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC7A200T-1SB484I 適用於 6 應用s: Industrial Data Acquisition, Communications Interface Bridging, Machine Vision Preprocessing, Digital Signal Processing, Embedded Control and Automation, Test and Measurement Instrumentation.
Industrial Data Acquisition
The XC7A200T-1SB484I fits multi-channel industrial data-acquisition systems because its 285 I/Os can connect parallel converters, sensors, counters, and control signals, while 215,360 logic cells support filtering and protocol conversion. Its 13,455,360 RAM bits provide acquisition buffers, and 740 DSP slices can accelerate filtering or demodulation. Use the FPGA between sensor inputs and a host interface, then validate timing against the industrial-temperature operating range and the SB484 power ball assignments.
推薦
Communications Interface Bridging
The XC7A200T-1SB484I is well suited to communications aggregation, protocol conversion, and test-equipment signal paths requiring multiple parallel interfaces. Its 285 I/Os provide room for multiple buses, while 215,360 logic cells can implement framing, buffering, crossbar logic, and state machines. The 13,455,360 RAM bits support packet queues and data capture. Engineers should use the exact SB484 pinout to preserve intended high-speed routing and verify protocol timing with the selected -1 speed grade.
推薦
Machine Vision Preprocessing
The XC7A200T-1SB484I can perform real-time machine-vision preprocessing before data reaches a processor or network interface. Its 740 DSP slices support filtering and arithmetic pipelines, 215,360 logic cells accommodate control logic and data movement, and 285 I/Os allow direct sensor and memory connectivity. Place the FPGA close to high-bandwidth capture circuitry, use block RAM for line buffers, and validate the -1 speed grade against pixel-clock timing and image-frame throughput requirements.
推薦
Digital Signal Processing
The XC7A200T-1SB484I fits parallel DSP applications such as filtering, modulation, spectral processing, and fixed-point arithmetic pipelines. The device provides 740 DSP slices alongside 215,360 logic cells and 13,455,360 RAM bits, allowing several processing blocks and sample buffers to operate concurrently. Use the FPGA for deterministic real-time transformation, but check clock tolerance, I/O timing, and power behavior for the -1 grade before fixing the system clock and external interface architecture.
推薦
Embedded Control and Automation
The XC7A200T-1SB484I supports embedded-control systems that combine deterministic hardware logic with programmable firmware-like behavior. Its 215,360 logic cells can implement motion sequencing, safety interlocks, state machines, and communication stacks, while 285 I/Os connect sensors, actuators, encoders, and field buses. The industrial-temperature ordering supports equipment deployment, but thermal analysis remains necessary because the 484-ball FCBGA concentrates power handling and routing complexity in a compact area.
推薦
Test and Measurement Instrumentation
The XC7A200T-1SB484I is suitable for programmable test and measurement logic requiring parallel stimulus generation, response capture, and real-time analysis. Its 285 I/Os support multiple channels, 13,455,360 RAM bits can capture timed samples, and 740 DSP slices can perform fast numerical operations. Organize the design into deterministic acquisition, processing, and trigger domains, and use the SB484 ball file to implement controlled escape routing for high-rate differential interfaces.
推薦
推薦產品摘要
工程參考資料，適用於 XC7A200T-1SB484I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7A200T-1FBG484I | XC7A200T-2FBG484I | XC7A200T-2SBG484I | XC7A200T-L1FBG484I | XC7A200T-L1SBG484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-ball FCBGA, 19 mm x 19 mm | 484-ball FCBGA, 19 mm x 19 mm | 484-ball FCBGA, 19 mm x 19 mm | 484-ball FCBGA, 19 mm x 19 mm | 484-ball FCBGA, 19 mm x 19 mm | 484-ball FCBGA, 19 mm x 19 mm |
| Device Family | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 |
| Speed Grade | -1 | -1 | -2 | -2 | L1 | L1 |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
主要差異化特點
- SB484 ordering with the standard -1 speed grade (對比XC7A200T-2SBG484I)
- Exact 484-ball Artix-7 package fit (對比XC7A200T-1FBG484I)
- Full XC7A200T processing resource set (對比XC7A200T-L1SBG484I)
設計說明
Use the AMD SB484 package file as the authoritative source for ball names, power positions, and I/O assignments. Place decoupling capacitors immediately across the relevant supply and ground balls using the package escape pattern recommended in the Artix-7 package documentation. A 484-ball FCBGA requires careful via-in-pad and solder-mask design; do not derive the layout from a similarly named FBG484 or SBG484 ordering code without checking the actual package files.
Thermal design must account for the device's 215,360 logic cells and 740 DSP slices because utilization-dependent activity can produce substantial local heating in the 19 mm by 19 mm FCBGA. Use the AMD power-estimation tools with the intended clocking, utilization, and ambient assumptions. Verify the result against the device thermal model and the board stack-up. Estimated: a design at 70% logic utilization, 50% DSP utilization, and 25% block-RAM utilization requires materially more cooling than a lightly loaded configuration.
Assign high-speed interfaces according to the SB484 package's documented pin assignments and the Artix-7 speed-grade timing limits. Maintain continuous reference planes, minimize stubs, control Z discontinuities, and match length-sensitive interfaces to the external transceiver requirements. The -1 grade is a specific timing grade, so changing to an -2 ordering can improve timing margin while also changing power and qualification characteristics; re-run sign-off timing after any substitution.
Do not treat the SB484 and FBG484 ordering codes as interchangeable solely because both use a 484-ball package. Check the exact package code, speed grade, temperature grade, qualification status, power characteristics, and AMD package data before changing the bill of materials. Also verify that the design tool version supports the selected device, bitstream, and configuration scheme. FPGA software, board constraints, and bitstream compatibility are as important as electrical pin compatibility.
合規資訊
The industrial-temperature suffix does not by itself establish AEC-Q100 qualification. RoHS, REACH, lead-free, halogen-free, and conflict-minerals status require confirmation from the exact AMD product documentation or declaration.
