XC7Z030-2FBG484I - Zynq-7000 SoC, 125K Logic Cells | AMD
MPN： XC7Z030-2FBG484I ✓ 啟用中XC7Z030-2FBG484I 概覽
A System-on-Chip (SoC) is an integrated circuit that consolidates all components of a computer or other electronic system into a single chip. The Zynq-7000 family specifically combines a hard processing system (PS) with programmable logic (PL), allowing designers to implement custom hardware accelerators alongside software applications. This architecture bridges the gap between traditional microprocessors and FPGAs, enabling high-performance, low-latency processing for demanding embedded applications.
Key features of the XC7Z030-2FBG484I include 125,000 logic cells, a dual-core ARM Cortex-A9 processor running at up to 800 MHz, and support for 1.2V to 3.3V I/O standards. The device also includes 256 KB of on-chip memory, integrated PCIe, and multiple high-speed transceivers. These features provide a powerful and flexible platform for implementing complex digital systems.
From a technical perspective, the XC7Z030-2FBG484I is fabricated using a 28nm process technology, which balances performance and power efficiency. The processing system includes a memory management unit, L1 and L2 caches, and a wide range of peripherals, while the programmable logic is based on the Kintex-7 architecture, offering high logic density and DSP capabilities. This combination allows for the implementation of sophisticated algorithms and interfaces.
Typical applications for the XC7Z030-2FBG484I include software-defined radio, where the programmable logic handles baseband processing and the ARM cores run protocol stacks; industrial motor control, where the FPGA implements high-speed PWM and the processor handles communication; and medical imaging, where the device accelerates image processing algorithms. The device's high-speed transceivers also make it suitable for video and network processing.
When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 484-pin FCBGA package requires a multi-layer PCB with dedicated power and ground planes. The device's power consumption can be significant, so a proper heatsink or active cooling solution may be necessary for high-performance applications.
直接替換替代品，適用於 XC7Z030-2FBG484I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7Z030-2FBG484I （相同外形與佔位） — 差異在於 Logic Cells, Package, Speed Grade, Mounting Type, Operating Temperature.
XC7Z030-1FBG484I
✅ 直接替換聯絡詢價
查看資料表 →XC7Z035-2FBG484I
✅ 直接替換📋 參考替代品（不在目錄中）
XC7Z030-1FBG484C
✅ 直接替換📋 參考替代品（不在目錄中）
XC7Z020-2CLG484I
✅ 直接替換 ⚠️ 規格未經驗證✗ 缺貨
$49 / 單位
查看資料表 →XC7Z045-2FBG484I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC7Z030-2FBG484I 最大額定值與電氣特性
| Family | Zynq-7000 |
| Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Number of Cores | 2 |
| Primary Clock Speed | 800 MHz |
| Logic Cells | 125000 |
| 封裝 | 484-FCBGA (23x23) |
| 工作溫度 | -40°C to +100°C |
| I/O Voltage | 1.2V to 3.3V |
| Process Technology | 28nm |
| On-Chip Memory | 256 KB |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| REACH Status | Compliant |
| 生命週期狀態 | Active |
XC7Z030-2FBG484I 腳位配置
| 腳位 A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| 腳位 A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| 腳位 B1 | VCCINT — Internal core voltage 1.0V |
| 腳位 B2 | GND — Ground |
| 腳位 C1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| 腳位 C2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| 腳位 D1 | VCCAUX — Auxiliary voltage 1.8V |
| 腳位 D2 | GND — Ground |
| 腳位 E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| 腳位 E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| 腳位 F1 | VCCIO_0 — I/O bank 0 voltage supply |
| 腳位 F2 | GND — Ground |
典型應用
XC7Z030-2FBG484I 適用於 6 應用s: Software-Defined Radio, Industrial Motor Control, Medical Imaging, Automotive Driver Assistance, Video and Network Processing, Aerospace and Defense.
Software-Defined Radio
The XC7Z030-2FBG484I is ideal for software-defined radio (SDR) systems. Its 125K logic cells can implement high-speed digital down/up converters, filters, and FFT engines, while the dual-core ARM Cortex-A9 at 800 MHz handles protocol stacks and control. The device's high-speed transceivers support wideband signal capture and generation. This SoC enables a compact, low-power SDR platform that can be reconfigured in the field, making it suitable for military communications, amateur radio, and spectrum monitoring applications.
推薦
Industrial Motor Control
The XC7Z030-2FBG484I excels in industrial motor control applications. The programmable logic can implement high-speed PWM generation, encoder interfaces, and current-loop control with nanosecond-level precision, while the ARM cores run communication protocols like EtherCAT and PROFINET. The device's 28nm process and industrial temperature range (-40°C to +100°C) ensure reliable operation in harsh factory environments. This SoC enables a single-chip solution for multi-axis servo drives and robotics, reducing system cost and complexity.
推薦
Medical Imaging
The XC7Z030-2FBG484I is well-suited for medical imaging systems such as ultrasound and CT scanners. The FPGA fabric can accelerate image processing algorithms like beamforming, filtering, and 3D reconstruction, while the ARM cores manage system control and data streaming. The device's high memory bandwidth and DSP capabilities enable real-time processing of high-resolution images. Its industrial temperature range and long-term availability make it a reliable choice for medical equipment manufacturers.
推薦
Automotive Driver Assistance
The XC7Z030-2FBG484I is used in automotive driver assistance systems (ADAS) for sensor fusion and real-time processing. The programmable logic can implement camera interfaces, image preprocessing, and object detection accelerators, while the ARM cores run high-level algorithms and vehicle communication. The device's 28nm process provides a balance of performance and power efficiency, suitable for in-vehicle use. Although not AEC-Q100 qualified, it is often used in aftermarket and development platforms.
推薦
Video and Network Processing
The XC7Z030-2FBG484I is ideal for video and network processing applications. Its high-speed transceivers support 10G Ethernet and DisplayPort, while the FPGA fabric can implement video codecs, packet processing, and traffic shaping. The ARM cores handle control plane functions and management interfaces. This SoC enables a single-chip solution for video surveillance servers, network appliances, and broadcast equipment, offering high throughput and low latency.
推薦
Aerospace and Defense
The XC7Z030-2FBG484I is used in aerospace and defense applications such as radar, electronic warfare, and secure communications. The programmable logic can implement beamforming, pulse compression, and encryption engines, while the ARM cores run mission management software. The device's industrial temperature range and high reliability make it suitable for harsh environments. Its reconfigurability allows for in-field updates and adaptation to evolving threats.
推薦
推薦產品摘要
工程參考資料，適用於 XC7Z030-2FBG484I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7Z030-1FBG484I | XC7Z035-2FBG484I | XC7Z030-1FBG484C |
|---|---|---|---|---|
| Package | 484-FCBGA (23x23) | 484-FCBGA (23x23) | 484-FCBGA (23x23) | 484-FCBGA (23x23) |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 125000 | 125000 | 275000 | 125000 |
| Max Clock Speed | 800 MHz | 667 MHz | 800 MHz | 667 MHz |
| Operating Temperature | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | 0°C to +85°C |
| On-Chip Memory | 256 KB | 256 KB | 256 KB | 256 KB |
| Process Technology | 28nm | 28nm | 28nm | 28nm |
主要差異化特點
- Higher clock speed than -1 grade (對比XC7Z030-1FBG484I)
- Industrial temperature grade (對比XC7Z030-1FBG484C)
- Balanced logic density (對比XC7Z035-2FBG484I)
設計說明
The XC7Z030-2FBG484I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCIO (1.2V-3.3V). Use dedicated power management ICs or DC-DC converters for each rail. Ensure proper decoupling with 100nF capacitors close to each power pin and bulk capacitors on the board. Follow the power sequencing requirements in the Zynq-7000 TRM (UG585) to avoid damage.
The XC7Z030-2FBG484I can dissipate significant power, especially when using high-speed transceivers and large logic designs. The 484-FCBGA package has a thermal resistance that requires a heatsink or active cooling for high-performance applications. Use thermal vias under the package and a copper pour on the PCB to improve heat dissipation. Monitor junction temperature to stay within the -40°C to +100°C range.
The 484-FCBGA package requires a multi-layer PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance and minimize trace lengths. Follow the layout guidelines in the Zynq-7000 PCB Design Guide (UG933) for signal integrity. Place the device away from noisy components and use proper grounding techniques.
合規資訊
RoHS and REACH compliant per distributor data. Not AEC-Q100 qualified for automotive use.
