XCZU2EG-1SFVA625E - Zynq UltraScale+ MPSoC EG | AMD
MPN： XCZU2EG-1SFVA625E ✓ 啟用中XCZU2EG-1SFVA625E 概覽
A Zynq UltraScale+ MPSoC is a heterogeneous multiprocessor system-on-chip that combines a processing system (PS) with programmable logic (PL) on a single device. The PS includes ARM application and real-time processors, while the PL provides FPGA fabric for custom hardware acceleration. This architecture enables designers to implement complex systems that require both software flexibility and hardware performance, making it ideal for applications such as embedded vision, industrial automation, and software-defined radio.
Key features of the XCZU2EG-1SFVA625E include the quad-core ARM Cortex-A53 MPCore with CoreSight debug, dual-core ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2 GPU. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The programmable logic provides 103,320 logic cells, enabling substantial custom logic implementation. The device is designed for industrial temperature ranges and is RoHS compliant.
From a technical perspective, the XCZU2EG-1SFVA625E leverages the UltraScale+ architecture, which offers advanced clocking, routing, and DSP capabilities. The 20nm process technology provides improved power efficiency and performance compared to older generations. The device includes integrated memory controllers, PCIe blocks, and security features, making it a comprehensive solution for high-performance embedded systems.
Typical applications include embedded vision systems, industrial motor control, automotive driver assistance, and data center acceleration. The combination of ARM processing and FPGA fabric allows for real-time processing and hardware acceleration, making it suitable for edge computing and AI inference.
When designing with this device, consider the power supply requirements, including the 0.95V core voltage and multiple I/O banks. Proper decoupling and power sequencing are essential for reliable operation. The device requires a configuration source, such as QSPI flash or SD card, for booting.
直接替換替代品，適用於 XCZU2EG-1SFVA625E — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XCZU2EG-1SFVA625E （相同外形與佔位） — 差異在於 Core Voltage, Logic Cells, Package, Supply Voltage.
XCZU2EG-1SFVA625I
✅ 直接替換📋 參考替代品（不在目錄中）
XCZU3EG-1SFVA625E
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →XCZU2CG-1SFVA625E
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XCZU2EG-2SFVA625E
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XCZU2EG-1SFVA625I
✅ 直接替換📋 參考替代品（不在目錄中）
XCZU2EG-1SFVA625E 最大額定值與電氣特性
| Family | Zynq UltraScale+ MPSoC EG |
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Logic Cells | 103320 |
| Maximum Frequency | 1.5 GHz (Cortex-A53) |
| 封裝 | 625-FCBGA (21x21 mm) |
| Process Technology | 20nm |
| Core Voltage | 0.95V |
| RoHS 狀態 | Compliant |
| 安裝類型 | Surface Mount |
| 供應電壓 | 0.95V (core) |
| Speed Grade | -1 |
XCZU2EG-1SFVA625E 腳位配置
| 腳位 A1 | VCCINT — Core logic power supply (0.95V) |
| 腳位 A2 | GND — Ground |
| 腳位 B1 | IO_L1P_T0 — User I/O bank 0 differential pair |
| 腳位 B2 | IO_L1N_T0 — User I/O bank 0 differential pair |
| 腳位 C1 | VCCAUX — Auxiliary power supply (1.8V) |
| 腳位 C2 | GND — Ground |
| 腳位 D1 | MIO0 — Multiplexed I/O for PS |
| 腳位 D2 | MIO1 — Multiplexed I/O for PS |
| 腳位 E1 | DDR_A0 — DDR memory address |
| 腳位 E2 | DDR_A1 — DDR memory address |
| 腳位 F1 | DDR_DQ0 — DDR memory data |
| 腳位 F2 | DDR_DQ1 — DDR memory data |
典型應用
XCZU2EG-1SFVA625E 適用於 6 應用s: Embedded Vision, Industrial Automation, Software-Defined Radio, Data Center Acceleration, Automotive Driver Assistance, Medical Imaging.
Embedded Vision
The XCZU2EG-1SFVA625E is ideal for embedded vision systems that require real-time image processing. The quad-core ARM Cortex-A53 can run complex algorithms, while the FPGA fabric accelerates pixel-level operations. With 103,320 logic cells, it can implement custom convolution engines and image signal processing pipelines. The Mali-400 GPU supports graphics rendering for display interfaces. This SoC enables high-performance vision applications in industrial inspection, surveillance, and autonomous vehicles, where low latency and high throughput are critical.
推薦
Industrial Automation
In industrial automation, the XCZU2EG-1SFVA625E provides a powerful platform for motor control, robotics, and PLCs. The dual-core Cortex-R5 is optimized for real-time control, while the FPGA fabric can implement custom communication protocols and high-speed I/O. The device supports industrial temperature ranges (with the 'I' variant) and offers deterministic processing. Its 20nm process ensures low power consumption, making it suitable for factory floor equipment. The integration of processing and logic reduces system complexity and improves reliability.
推薦
Software-Defined Radio
The XCZU2EG-1SFVA625E is well-suited for software-defined radio (SDR) applications due to its high-speed transceivers and DSP capabilities. The FPGA fabric can implement digital down/up converters, filters, and modulation/demodulation algorithms. The ARM cores handle protocol stack and control functions. With 103,320 logic cells, it can support multiple channels and complex waveforms. The device's flexibility allows for reconfiguration to adapt to different communication standards, making it ideal for military, aerospace, and public safety communications.
推薦
Data Center Acceleration
The XCZU2EG-1SFVA625E can be used in data center applications for network processing, storage acceleration, and AI inference. The FPGA fabric allows for custom packet processing and offloading of compute-intensive tasks from the CPU. The ARM cores provide management and control plane functions. With support for PCIe and high-speed serial interfaces, it can integrate into server architectures. The device's low latency and high throughput make it suitable for edge computing and real-time analytics.
推薦
Automotive Driver Assistance
The XCZU2EG-1SFVA625E is suitable for advanced driver assistance systems (ADAS) that require real-time sensor fusion and processing. The FPGA fabric can implement camera and LiDAR data processing, while the ARM cores run fusion algorithms. The Mali-400 GPU supports graphics for displays. The device's high performance and low power make it ideal for in-vehicle systems. It can handle multiple sensor inputs and provide fast response times for safety-critical functions.
推薦
Medical Imaging
The XCZU2EG-1SFVA625E is used in medical imaging systems such as ultrasound and CT scanners. The FPGA fabric can implement real-time signal processing and image reconstruction algorithms. The ARM cores handle system control and user interface. With high logic density and DSP capabilities, it can process large amounts of data quickly. The device's reliability and long-term availability make it suitable for medical equipment, where uptime is critical.
推薦
推薦產品摘要
工程參考資料，適用於 XCZU2EG-1SFVA625E — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XCZU2EG-1SFVA625I | XCZU3EG-1SFVA625E | XCZU2CG-1SFVA625E |
|---|---|---|---|---|
| Package | 625-FCBGA (21x21 mm) | 625-FCBGA (21x21 mm) - same | 625-FCBGA (21x21 mm) - same | 625-FCBGA (21x21 mm) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 103320 | 103320 | 154K | 103K |
| Max Frequency (Cortex-A53) | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.2 GHz |
| Temperature Grade | Extended (E) | Industrial (I) | Extended (E) | Extended (E) |
| Speed Grade | -1 | -1 | -1 | -1 |
| Core Voltage | 0.95V | 0.95V | 0.95V | 0.95V |
| Process Technology | 20nm | 20nm | 20nm | 20nm |
主要差異化特點
- Higher logic density than XCZU2CG (對比XCZU2CG-1SFVA625E)
- Extended temperature grade vs industrial (對比XCZU2EG-1SFVA625I)
- Cost-effective compared to XCZU3EG (對比XCZU3EG-1SFVA625E)
設計說明
The XCZU2EG-1SFVA625E requires multiple power rails: VCCINT at 0.95V, VCCAUX at 1.8V, and various I/O voltages. Use a dedicated power management IC to sequence these rails properly. Refer to the Zynq UltraScale+ MPSoC power supply design guidelines in DS891 for recommended decoupling capacitors and power sequencing requirements.
The 625-FCBGA package has a 21x21 mm footprint with a 0.8mm ball pitch. Ensure adequate via-in-pad or microvia design for routing. Use high-speed design rules for DDR and transceiver signals, including impedance control and length matching. Follow AMD's PCB design guidelines for UltraScale+ devices.
The device can dissipate significant power under heavy load. Use a heatsink or active cooling if the junction temperature exceeds the specified limit. The thermal resistance depends on airflow and PCB design. Calculate the power dissipation based on your application and ensure adequate thermal management.
合規資訊
RoHS compliant per distributor listings. AEC-Q100 not applicable for this device class.
