YZ38F16SBB-9MFD-M - 4Gb DDR3L Industrial DRAM | Loongtion
MPN： YZ38F16SBB-9MFD-M ✓ 啟用中YZ38F16SBB-9MFD-M 概覽
DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) is a type of volatile memory that transfers data on both edges of the clock, achieving high bandwidth. It is the third generation of DDR memory, succeeding DDR2, and is widely used in computing, networking, and embedded systems. DDR3L is a low-voltage variant that operates at 1.35V, reducing power consumption by about 20% compared to standard 1.5V DDR3, making it ideal for power-sensitive applications.
Key features include a 4Gb density (256M x 16), 96-ball FBGA package, industrial temperature range of -40°C to +85°C, and support for both 1.35V and 1.5V operation. The device meets JEDEC standards for DDR3 and DDR3L, including ZQ calibration with an external 240Ω ±1% resistor. It is designed for reliable operation in harsh environments, with wide-temperature screening and testing.
The YZ38F16SBB-9MFD-M is manufactured using a domestic (Chinese) supply chain, offering a secure and controllable source for critical applications. It is compatible with domestic platforms such as Fudan Micro, Phytium, Loongson, and Rockchip, and is available with development boards for evaluation. The device is also certified with ZZKK (domestic autonomous controllable) and WBK (pseudo-empty package) certifications, ensuring authenticity and quality.
Typical applications include industrial automation, embedded computing, networking equipment, and military/aerospace systems where long-term availability and wide-temperature operation are critical. The pin-to-pin compatibility with industry-standard DDR3 parts simplifies BOM management and reduces supply chain risk.
When designing with this device, ensure proper decoupling and signal integrity practices are followed, including placing 0.1µF and 10µF capacitors near the power pins and maintaining controlled impedance for the data and address lines. The device supports standard DDR3 termination and calibration schemes, so follow the JEDEC guidelines for layout and routing.
直接替換替代品，適用於 YZ38F16SBB-9MFD-M — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： YZ38F16SBB-9MFD-M （相同外形與佔位） — 差異在於 Data Rate, Package, Supply Voltage, Interface, Operating Temperature.
MT41K256M16HA-125IT:E
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查看資料表 →MT41K256M16HA-125
✅ 直接替換✗ 缺貨
$6.3636 / 單位
查看資料表 →K4B4G1646E-BYMA
✅ 直接替換 ⚠️ 規格未經驗證✗ 缺貨
$14.3182 / 單位
查看資料表 →H5TC4G63AFR-PBA
✅ 直接替換 ⚠️ 規格未經驗證✗ 缺貨
$3.9773 / 單位
查看資料表 →IS43TR16256A-125KBLA2
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
W634GU6RB-11
✅ 直接替換 ⚠️ 規格未經驗證✗ 缺貨
$13.5227 / 單位
查看資料表 →YZ38F16SBB-9MFD-M 規格
| 記憶體類型 | DDR3L SDRAM |
| Density | 4Gb |
| 組織 | 256M x 16 |
| 封裝 | 96-ball FBGA |
| 供應電壓 | 1.35V / 1.5V |
| Speed Grade | -9 (DDR3-1866) |
| 工作溫度 | -40°C to +85°C |
| 介面 | JEDEC DDR3 |
| ZQ Calibration | External 240Ω ±1% resistor |
| RoHS | Compliant |
| Lead-Free | Yes |
| 安裝類型 | Surface Mount |
| 腳位數 | 96 |
| 資料速率 | 1866 Mbps |
YZ38F16SBB-9MFD-M 腳位配置
| 腳位 A1 | VDD — Power supply (1.35V/1.5V) |
| 腳位 A2 | DQ0 — Data input/output 0 |
| 腳位 A3 | DQ1 — Data input/output 1 |
| 腳位 A4 | VSS — Ground |
| 腳位 A5 | DQ2 — Data input/output 2 |
| 腳位 A6 | DQ3 — Data input/output 3 |
| 腳位 A7 | VDD — Power supply |
| 腳位 A8 | DQ4 — Data input/output 4 |
| 腳位 A9 | DQ5 — Data input/output 5 |
| 腳位 A10 | VSS — Ground |
| 腳位 A11 | DQ6 — Data input/output 6 |
| 腳位 A12 | DQ7 — Data input/output 7 |
典型應用
YZ38F16SBB-9MFD-M 適用於 6 應用s: Industrial Automation, Embedded Computing, Networking Equipment, Military & Aerospace, Automotive Infotainment, Medical Devices.
Industrial Automation
The YZ38F16SBB-9MFD-M is ideal for industrial automation systems that require reliable memory operation in harsh environments. Its wide temperature range (-40°C to +85°C) ensures stable performance in factory floors, while the 4Gb density supports complex control algorithms and data logging. The pin-to-pin compatibility with standard DDR3 parts simplifies BOM management and allows for easy upgrades in existing designs.
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Embedded Computing
In embedded computing, the YZ38F16SBB-9MFD-M provides high-bandwidth memory for processors and FPGAs. Its 1866 Mbps data rate supports fast data processing, while the low-voltage operation (1.35V) reduces power consumption in portable and fanless systems. The FBGA96 package is compact, saving board space, and the industrial temperature grade ensures reliability in rugged embedded applications.
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Networking Equipment
Networking equipment such as routers and switches require high-speed memory for packet buffering and routing tables. The YZ38F16SBB-9MFD-M offers the necessary bandwidth and density, with a wide temperature range for outdoor or industrial networking gear. Its compatibility with standard DDR3 parts allows for easy integration into existing designs, and the domestic supply chain ensures long-term availability.
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Military & Aerospace
The YZ38F16SBB-9MFD-M is suitable for military and aerospace applications that demand high reliability and wide temperature operation. Its industrial temperature range and robust design make it ideal for avionics, radar, and communication systems. The domestic sourcing provides supply chain security, and the pin-to-pin compatibility with standard parts allows for easy replacement in legacy systems.
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Automotive Infotainment
In automotive infotainment systems, the YZ38F16SBB-9MFD-M provides reliable memory for navigation, multimedia, and connectivity features. Its wide temperature range (-40°C to +85°C) covers automotive cabin environments, and the low-voltage operation reduces power consumption. The FBGA96 package is suitable for space-constrained head units, and the compatibility with standard DDR3 parts simplifies sourcing.
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Medical Devices
Medical devices such as patient monitors and diagnostic equipment require reliable memory for data acquisition and processing. The YZ38F16SBB-9MFD-M offers high density and speed, with a wide temperature range for various clinical environments. Its low power consumption is beneficial for battery-powered devices, and the long-term availability ensures product longevity.
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推薦產品摘要
工程參考資料，適用於 YZ38F16SBB-9MFD-M — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MT41K256M16HA-125IT | K4B4G1646E-BYMA | H5TC4G63AFR-PBA |
|---|---|---|---|---|
| Package | FBGA96 | FBGA96 | FBGA96 | FBGA96 |
| Brand | Loongtion | Micron | Samsung | SK hynix |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Voltage | 1.35V/1.5V | 1.35V/1.5V | 1.35V/1.5V | 1.35V/1.5V |
| RoHS | Compliant | Compliant | Compliant | Compliant |
主要差異化特點
- Wide temperature range (-40°C to +85°C) (對比MT41K256M16HA-125IT)
- Domestic supply chain (China) (對比MT41K256M16HA-125IT)
- Pin-to-pin compatibility with major brands (對比K4B4G1646E-BYMA)
設計說明
Ensure proper decoupling: place 0.1µF and 10µF capacitors close to the VDD and VDDQ pins. Use a solid ground plane and maintain controlled impedance for data and address lines (typically 50Ω single-ended, 100Ω differential). Follow JEDEC layout guidelines for DDR3 to minimize signal integrity issues.
The device is rated for -40°C to +85°C. Ensure adequate airflow or heatsinking if the device is placed near other heat sources. The FBGA96 package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values. For high-temperature environments, verify junction temperature stays within limits.
Verify the speed grade and voltage compatibility with your controller. The -9 grade supports DDR3-1866, but if your system is designed for DDR3-1600, it will still work. Ensure the ZQ calibration resistor (240Ω ±1%) is connected to the ZQ pin. Do not mix 1.5V and 1.35V operation without proper configuration.
合規資訊
RoHS compliant per JLCPCB listing. Other compliance data not explicitly stated in provided data.
