YZ38F16SBB-9MFD-M - 4Gb DDR3L Industrial DRAM | Loongtion
Référence : YZ38F16SBB-9MFD-M ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.8 | $980,00 |
| 500 | $8.5 | $4 250,00 |
| 1 000 | $7.2 | $7 200,00 |
YZ38F16SBB-9MFD-M Présentation
DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) is a type of volatile memory that transfers data on both edges of the clock, achieving high bandwidth. It is the third generation of DDR memory, succeeding DDR2, and is widely used in computing, networking, and embedded systems. DDR3L is a low-voltage variant that operates at 1.35V, reducing power consumption by about 20% compared to standard 1.5V DDR3, making it ideal for power-sensitive applications.
Key features include a 4Gb density (256M x 16), 96-ball FBGA package, industrial temperature range of -40°C to +85°C, and support for both 1.35V and 1.5V operation. The device meets JEDEC standards for DDR3 and DDR3L, including ZQ calibration with an external 240Ω ±1% resistor. It is designed for reliable operation in harsh environments, with wide-temperature screening and testing.
The YZ38F16SBB-9MFD-M is manufactured using a domestic (Chinese) supply chain, offering a secure and controllable source for critical applications. It is compatible with domestic platforms such as Fudan Micro, Phytium, Loongson, and Rockchip, and is available with development boards for evaluation. The device is also certified with ZZKK (domestic autonomous controllable) and WBK (pseudo-empty package) certifications, ensuring authenticity and quality.
Typical applications include industrial automation, embedded computing, networking equipment, and military/aerospace systems where long-term availability and wide-temperature operation are critical. The pin-to-pin compatibility with industry-standard DDR3 parts simplifies BOM management and reduces supply chain risk.
When designing with this device, ensure proper decoupling and signal integrity practices are followed, including placing 0.1µF and 10µF capacitors near the power pins and maintaining controlled impedance for the data and address lines. The device supports standard DDR3 termination and calibration schemes, so follow the JEDEC guidelines for layout and routing.
Alternatives de remplacement direct pour YZ38F16SBB-9MFD-M — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec YZ38F16SBB-9MFD-M (même facteur de forme et même empreinte) — différant par Data Rate, Package, Supply Voltage, Interface, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MT41K256M16HA-125IT:E
✅ Remplacement direct✓ En stock
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Voir la fiche technique →MT41K256M16HA-125
✅ Remplacement direct✓ En stock
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Voir la fiche technique →K4B4G1646E-BYMA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
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Voir la fiche technique →H5TC4G63AFR-PBA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
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Voir la fiche technique →IS43TR16256A-125KBLA2
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
W634GU6RB-11
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
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Voir la fiche technique →YZ38F16SBB-9MFD-M Spécifications
| Type de mémoire | DDR3L SDRAM |
| Density | 4Gb |
| Organisation de la mémoire | 256M x 16 |
| Boîtier | 96-ball FBGA |
| Tension d'alimentation | 1.35V / 1.5V |
| Speed Grade | -9 (DDR3-1866) |
| Température de fonctionnement | -40°C to +85°C |
| Interface | JEDEC DDR3 |
| ZQ Calibration | External 240Ω ±1% resistor |
| RoHS | Compliant |
| Lead-Free | Yes |
| Type de montage | Surface Mount |
| Nombre de broches | 96 |
| Débit de données | 1866 Mbps |
Configuration des broches de YZ38F16SBB-9MFD-M
| Broche A1 | VDD — Power supply (1.35V/1.5V) |
| Broche A2 | DQ0 — Data input/output 0 |
| Broche A3 | DQ1 — Data input/output 1 |
| Broche A4 | VSS — Ground |
| Broche A5 | DQ2 — Data input/output 2 |
| Broche A6 | DQ3 — Data input/output 3 |
| Broche A7 | VDD — Power supply |
| Broche A8 | DQ4 — Data input/output 4 |
| Broche A9 | DQ5 — Data input/output 5 |
| Broche A10 | VSS — Ground |
| Broche A11 | DQ6 — Data input/output 6 |
| Broche A12 | DQ7 — Data input/output 7 |
Applications typiques
YZ38F16SBB-9MFD-M convient pour 6 applications: Industrial Automation, Embedded Computing, Networking Equipment, Military & Aerospace, Automotive Infotainment, Medical Devices.
Industrial Automation
The YZ38F16SBB-9MFD-M is ideal for industrial automation systems that require reliable memory operation in harsh environments. Its wide temperature range (-40°C to +85°C) ensures stable performance in factory floors, while the 4Gb density supports complex control algorithms and data logging. The pin-to-pin compatibility with standard DDR3 parts simplifies BOM management and allows for easy upgrades in existing designs.
Recommandé
Embedded Computing
In embedded computing, the YZ38F16SBB-9MFD-M provides high-bandwidth memory for processors and FPGAs. Its 1866 Mbps data rate supports fast data processing, while the low-voltage operation (1.35V) reduces power consumption in portable and fanless systems. The FBGA96 package is compact, saving board space, and the industrial temperature grade ensures reliability in rugged embedded applications.
Recommandé
Networking Equipment
Networking equipment such as routers and switches require high-speed memory for packet buffering and routing tables. The YZ38F16SBB-9MFD-M offers the necessary bandwidth and density, with a wide temperature range for outdoor or industrial networking gear. Its compatibility with standard DDR3 parts allows for easy integration into existing designs, and the domestic supply chain ensures long-term availability.
Recommandé
Military & Aerospace
The YZ38F16SBB-9MFD-M is suitable for military and aerospace applications that demand high reliability and wide temperature operation. Its industrial temperature range and robust design make it ideal for avionics, radar, and communication systems. The domestic sourcing provides supply chain security, and the pin-to-pin compatibility with standard parts allows for easy replacement in legacy systems.
Recommandé
Automotive Infotainment
In automotive infotainment systems, the YZ38F16SBB-9MFD-M provides reliable memory for navigation, multimedia, and connectivity features. Its wide temperature range (-40°C to +85°C) covers automotive cabin environments, and the low-voltage operation reduces power consumption. The FBGA96 package is suitable for space-constrained head units, and the compatibility with standard DDR3 parts simplifies sourcing.
Recommandé
Medical Devices
Medical devices such as patient monitors and diagnostic equipment require reliable memory for data acquisition and processing. The YZ38F16SBB-9MFD-M offers high density and speed, with a wide temperature range for various clinical environments. Its low power consumption is beneficial for battery-powered devices, and the long-term availability ensures product longevity.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour YZ38F16SBB-9MFD-M — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MT41K256M16HA-125IT | K4B4G1646E-BYMA | H5TC4G63AFR-PBA |
|---|---|---|---|---|
| Package | FBGA96 | FBGA96 | FBGA96 | FBGA96 |
| Brand | Loongtion | Micron | Samsung | SK hynix |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Voltage | 1.35V/1.5V | 1.35V/1.5V | 1.35V/1.5V | 1.35V/1.5V |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Wide temperature range (-40°C to +85°C) (vs MT41K256M16HA-125IT)
- Domestic supply chain (China) (vs MT41K256M16HA-125IT)
- Pin-to-pin compatibility with major brands (vs K4B4G1646E-BYMA)
Notes de conception
Ensure proper decoupling: place 0.1µF and 10µF capacitors close to the VDD and VDDQ pins. Use a solid ground plane and maintain controlled impedance for data and address lines (typically 50Ω single-ended, 100Ω differential). Follow JEDEC layout guidelines for DDR3 to minimize signal integrity issues.
The device is rated for -40°C to +85°C. Ensure adequate airflow or heatsinking if the device is placed near other heat sources. The FBGA96 package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values. For high-temperature environments, verify junction temperature stays within limits.
Verify the speed grade and voltage compatibility with your controller. The -9 grade supports DDR3-1866, but if your system is designed for DDR3-1600, it will still work. Ensure the ZQ calibration resistor (240Ω ±1%) is connected to the ZQ pin. Do not mix 1.5V and 1.35V operation without proper configuration.
Informations de conformité
RoHS compliant per JLCPCB listing. Other compliance data not explicitly stated in provided data.
