YZ38F16SBB-9MFD-M - 4Gb DDR3L Industrial DRAM | Loongtion
N.º da peça: YZ38F16SBB-9MFD-M ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.8 | $980,00 |
| 500 | $8.5 | $4.250,00 |
| 1.000 | $7.2 | $7.200,00 |
YZ38F16SBB-9MFD-M Visão geral
DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) is a type of volatile memory that transfers data on both edges of the clock, achieving high bandwidth. It is the third generation of DDR memory, succeeding DDR2, and is widely used in computing, networking, and embedded systems. DDR3L is a low-voltage variant that operates at 1.35V, reducing power consumption by about 20% compared to standard 1.5V DDR3, making it ideal for power-sensitive applications.
Key features include a 4Gb density (256M x 16), 96-ball FBGA package, industrial temperature range of -40°C to +85°C, and support for both 1.35V and 1.5V operation. The device meets JEDEC standards for DDR3 and DDR3L, including ZQ calibration with an external 240Ω ±1% resistor. It is designed for reliable operation in harsh environments, with wide-temperature screening and testing.
The YZ38F16SBB-9MFD-M is manufactured using a domestic (Chinese) supply chain, offering a secure and controllable source for critical applications. It is compatible with domestic platforms such as Fudan Micro, Phytium, Loongson, and Rockchip, and is available with development boards for evaluation. The device is also certified with ZZKK (domestic autonomous controllable) and WBK (pseudo-empty package) certifications, ensuring authenticity and quality.
Typical applications include industrial automation, embedded computing, networking equipment, and military/aerospace systems where long-term availability and wide-temperature operation are critical. The pin-to-pin compatibility with industry-standard DDR3 parts simplifies BOM management and reduces supply chain risk.
When designing with this device, ensure proper decoupling and signal integrity practices are followed, including placing 0.1µF and 10µF capacitors near the power pins and maintaining controlled impedance for the data and address lines. The device supports standard DDR3 termination and calibration schemes, so follow the JEDEC guidelines for layout and routing.
Alternativas drop-in para YZ38F16SBB-9MFD-M — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com YZ38F16SBB-9MFD-M (mesmo formato e footprint) — diferindo em Data Rate, Package, Supply Voltage, Interface, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MT41K256M16HA-125IT:E
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Ver ficha técnica →MT41K256M16HA-125
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Ver ficha técnica →K4B4G1646E-BYMA
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$14.3182 / unidade
Ver ficha técnica →H5TC4G63AFR-PBA
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.9773 / unidade
Ver ficha técnica →IS43TR16256A-125KBLA2
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
W634GU6RB-11
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$13.5227 / unidade
Ver ficha técnica →YZ38F16SBB-9MFD-M Especificações
| Tipo de memória | DDR3L SDRAM |
| Density | 4Gb |
| Organização da memória | 256M x 16 |
| Encapsulamento | 96-ball FBGA |
| Tensão de alimentação | 1.35V / 1.5V |
| Speed Grade | -9 (DDR3-1866) |
| Temperatura de operação | -40°C to +85°C |
| Interface | JEDEC DDR3 |
| ZQ Calibration | External 240Ω ±1% resistor |
| RoHS | Compliant |
| Lead-Free | Yes |
| Tipo de montagem | Surface Mount |
| Contagem de pinos | 96 |
| Taxa de dados | 1866 Mbps |
Configuração de pinos do YZ38F16SBB-9MFD-M
| Pino A1 | VDD — Power supply (1.35V/1.5V) |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino A4 | VSS — Ground |
| Pino A5 | DQ2 — Data input/output 2 |
| Pino A6 | DQ3 — Data input/output 3 |
| Pino A7 | VDD — Power supply |
| Pino A8 | DQ4 — Data input/output 4 |
| Pino A9 | DQ5 — Data input/output 5 |
| Pino A10 | VSS — Ground |
| Pino A11 | DQ6 — Data input/output 6 |
| Pino A12 | DQ7 — Data input/output 7 |
Aplicações típicas
YZ38F16SBB-9MFD-M é adequado para 6 aplicaçãos: Industrial Automation, Embedded Computing, Networking Equipment, Military & Aerospace, Automotive Infotainment, Medical Devices.
Industrial Automation
The YZ38F16SBB-9MFD-M is ideal for industrial automation systems that require reliable memory operation in harsh environments. Its wide temperature range (-40°C to +85°C) ensures stable performance in factory floors, while the 4Gb density supports complex control algorithms and data logging. The pin-to-pin compatibility with standard DDR3 parts simplifies BOM management and allows for easy upgrades in existing designs.
Recomendado
Embedded Computing
In embedded computing, the YZ38F16SBB-9MFD-M provides high-bandwidth memory for processors and FPGAs. Its 1866 Mbps data rate supports fast data processing, while the low-voltage operation (1.35V) reduces power consumption in portable and fanless systems. The FBGA96 package is compact, saving board space, and the industrial temperature grade ensures reliability in rugged embedded applications.
Recomendado
Networking Equipment
Networking equipment such as routers and switches require high-speed memory for packet buffering and routing tables. The YZ38F16SBB-9MFD-M offers the necessary bandwidth and density, with a wide temperature range for outdoor or industrial networking gear. Its compatibility with standard DDR3 parts allows for easy integration into existing designs, and the domestic supply chain ensures long-term availability.
Recomendado
Military & Aerospace
The YZ38F16SBB-9MFD-M is suitable for military and aerospace applications that demand high reliability and wide temperature operation. Its industrial temperature range and robust design make it ideal for avionics, radar, and communication systems. The domestic sourcing provides supply chain security, and the pin-to-pin compatibility with standard parts allows for easy replacement in legacy systems.
Recomendado
Automotive Infotainment
In automotive infotainment systems, the YZ38F16SBB-9MFD-M provides reliable memory for navigation, multimedia, and connectivity features. Its wide temperature range (-40°C to +85°C) covers automotive cabin environments, and the low-voltage operation reduces power consumption. The FBGA96 package is suitable for space-constrained head units, and the compatibility with standard DDR3 parts simplifies sourcing.
Recomendado
Medical Devices
Medical devices such as patient monitors and diagnostic equipment require reliable memory for data acquisition and processing. The YZ38F16SBB-9MFD-M offers high density and speed, with a wide temperature range for various clinical environments. Its low power consumption is beneficial for battery-powered devices, and the long-term availability ensures product longevity.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para YZ38F16SBB-9MFD-M — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MT41K256M16HA-125IT | K4B4G1646E-BYMA | H5TC4G63AFR-PBA |
|---|---|---|---|---|
| Package | FBGA96 | FBGA96 | FBGA96 | FBGA96 |
| Brand | Loongtion | Micron | Samsung | SK hynix |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Voltage | 1.35V/1.5V | 1.35V/1.5V | 1.35V/1.5V | 1.35V/1.5V |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Wide temperature range (-40°C to +85°C) (vs MT41K256M16HA-125IT)
- Domestic supply chain (China) (vs MT41K256M16HA-125IT)
- Pin-to-pin compatibility with major brands (vs K4B4G1646E-BYMA)
Notas de projeto
Ensure proper decoupling: place 0.1µF and 10µF capacitors close to the VDD and VDDQ pins. Use a solid ground plane and maintain controlled impedance for data and address lines (typically 50Ω single-ended, 100Ω differential). Follow JEDEC layout guidelines for DDR3 to minimize signal integrity issues.
The device is rated for -40°C to +85°C. Ensure adequate airflow or heatsinking if the device is placed near other heat sources. The FBGA96 package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values. For high-temperature environments, verify junction temperature stays within limits.
Verify the speed grade and voltage compatibility with your controller. The -9 grade supports DDR3-1866, but if your system is designed for DDR3-1600, it will still work. Ensure the ZQ calibration resistor (240Ω ±1%) is connected to the ZQ pin. Do not mix 1.5V and 1.35V operation without proper configuration.
Informações de conformidade
RoHS compliant per JLCPCB listing. Other compliance data not explicitly stated in provided data.
