AS4C512M16D4-75BCNTR vs AS4C512M16D4-75BIN 对比
详细并排对比 AS4C512M16D4-75BCNTR 出自 Alliance Memory 和 AS4C512M16D4-75BIN 出自 Alliance Memory。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Alliance Memory
AS4C512M16D4-75BCNTR - 8Gb DDR4 SDRAM 2666Mbps | Alliance Memory
AS4C512M16D4-75BCNTR ✓ 量产中Alliance Memory
AS4C512M16D4-75BIN - 8Gbit DDR4 SDRAM 512Mx16 | Alliance Memory
AS4C512M16D4-75BIN ✓ 量产中规格对比
| 参数 | AS4C512M16D4-75BCNTR | AS4C512M16D4-75BIN |
|---|---|---|
| 品牌 | Alliance Memory | Alliance Memory |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $7.90 | $8.99 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | — |
| 存储组织 | 512M x 16 | — |
| Clock Frequency | 1.333 GHz | 1.333 GHz |
| 数据速率 | 2666 Mbps per pin | 2666 Mbps |
| Access Time | 18 ns | 18 ns |
| Write Cycle Time | 15 ns | 15 ns |
| Supply Voltage (VDD) | 1.2 V (range 1.14 V to 1.26 V) | — |
| 接口 | Parallel | POD |
| Prefetch Architecture | 8n | — |
| Internal Bank Count | 16 banks | — |
| 封装 | 96-ball FBGA (7.5 x 13 mm) | 96-FBGA (7.5x13) |
| 工作温度范围 | 0C to +95C (case, commercial) | — |
| Process Technology | 20nm-class DRAM | — |
| Termination | On-die termination (ODT) | — |
| Refresh Modes | Auto-refresh and self-refresh | — |
| 安装类型 | Surface Mount | Surface Mount |
| Packaging Option | Tape & Reel (TR suffix) | — |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | — |
| 存储容量 | — | 8 Gbit |
| Memory Organization | — | 512M x 16 |
| 电源电压 | — | 1.2 V |
| 工作温度 | — | -40°C to +95°C |
| 引脚数 | — | 96 |
| 特性 | — | Auto self-refresh, auto precharge, asynchronous reset, output enable, CRC, data mask, write leveling, dynamic ODT, ZQ calibration |