AS4C512M16D4-75BCNTR vs AS4C512M16D4-75BIN Comparison
Detailed side-by-side comparison of AS4C512M16D4-75BCNTR by Alliance Memory and AS4C512M16D4-75BIN by Alliance Memory. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Alliance Memory
AS4C512M16D4-75BCNTR - 8Gb DDR4 SDRAM 2666Mbps | Alliance Memory
AS4C512M16D4-75BCNTR ✓ ActiveAlliance Memory
AS4C512M16D4-75BIN - 8Gbit DDR4 SDRAM 512Mx16 | Alliance Memory
AS4C512M16D4-75BIN ✓ ActiveSpecification Comparison
| Parameter | AS4C512M16D4-75BCNTR | AS4C512M16D4-75BIN |
|---|---|---|
| Brand | Alliance Memory | Alliance Memory |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Unit Price (USD) | $7.90 | — |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | — |
| Organization | 512M x 16 | — |
| Clock Frequency | 1.333 GHz | 1.333 GHz |
| Data Rate | 2666 Mbps per pin | 2666 Mbps |
| Access Time | 18 ns | 18 ns |
| Write Cycle Time | 15 ns | 15 ns |
| Supply Voltage (VDD) | 1.2 V (range 1.14 V to 1.26 V) | — |
| Interface | Parallel | POD |
| Prefetch Architecture | 8n | — |
| Internal Bank Count | 16 banks | — |
| Package | 96-ball FBGA (7.5 x 13 mm) | 96-FBGA (7.5x13) |
| Operating Temperature Range | 0C to +95C (case, commercial) | — |
| Process Technology | 20nm-class DRAM | — |
| Termination | On-die termination (ODT) | — |
| Refresh Modes | Auto-refresh and self-refresh | — |
| Mounting Type | Surface Mount | Surface Mount |
| Packaging Option | Tape & Reel (TR suffix) | — |
| RoHS Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Memory Size | — | 8 Gbit |
| Memory Organization | — | 512M x 16 |
| Supply Voltage | — | 1.2 V |
| Operating Temperature | — | -40°C to +95°C |
| Number of Pins | — | 96 |
| Features | — | Auto self-refresh, auto precharge, asynchronous reset, output enable, CRC, data mask, write leveling, dynamic ODT, ZQ calibration |