EP3SL200H780I4N vs EP3SL200H780I4 对比

详细并排对比 EP3SL200H780I4N 出自 Intel 和 EP3SL200H780I4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SL200H780I4N EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N ⚠ 最后一次采购

规格对比

参数 EP3SL200H780I4N EP3SL200H780I4
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 不推荐新设计
库存状态 有库存 有库存
单价(USD) $4,750.00 $6,255.75
Series Stratix III L Stratix III L
Family Stratix III (Logic-rich variant) Stratix III
Logic Elements 200,000 —
Logic Array Blocks (LABs) 8,000 8000
Embedded Memory (bits) 10,901,504 —
User I/Os 488 —
Core Voltage 1.1 V (0.86 V to 1.15 V range) —
Process Technology 65 nm CMOS 65 nm CMOS
Fabric Frequency (typical) 450 MHz —
Speed Grade I4 I4 (industrial)
工作温度范围 -40C to +100C (industrial) —
封装 780-ball FCBGA (Flip-Chip BGA, FineLine) —
安装类型 Surface Mount (BGA) —
Lead-Free Yes (suffix N) —
RoHS 状态 Compliant Compliant
Logic Elements (LE) — 200,000
Embedded Memory Bits — 10,901,504
User I/O Count — 488
DSP Multipliers (18x18) — 384
Voltage - Core Supply — 1.1 V
Package Type — 780-BBGA / FCBGA (FC-HFBGA)
Package Dimensions — 33 mm x 33 mm
工作结温 — -40C to +100C (industrial)
Configuration Memory — SRAM-based, volatile
Design Tool — Quartus II (legacy) / Quartus Prime

数据手册与资源

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