H5AN8G6NDJR-XNC vs H5AN8G6NDJR 对比

详细并排对比 H5AN8G6NDJR-XNC 出自 SK hynix 和 H5AN8G6NDJR 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

SK hynix
H5AN8G6NDJR-XNC H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC ✓ 量产中
SK hynix
H5AN8G6NDJR H5AN8G6NDJR - 8Gb DDR4-3200 SDRAM | SK hynix

H5AN8G6NDJR - 8Gb DDR4-3200 SDRAM | SK hynix

H5AN8G6NDJR ✓ 量产中

规格对比

参数 H5AN8G6NDJR-XNC H5AN8G6NDJR
品牌 SK hynix SK hynix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $55.68 $35.00
存储器类型 DDR4 SDRAM DDR4 SDRAM
存储容量 8 Gb —
Memory Organization 512M x16 —
数据速率 3200 Mbps 3200 Mbps (DDR4-3200)
Supply Voltage (VDD) 1.2 V (max 1.26 V) —
封装 FBGA-96 (13x7.5 mm) 96-ball FBGA (13mm x 7.5mm)
Number of Terminals 96 96
Maximum Operating Temperature 85 °C 85 °C
Input/Output Type COMMON —
RoHS Compliant Compliant
Lead-Free Yes —
无卤 Yes —
Auto Self-Refresh Yes —
Auto Precharge Yes —
Data Mask Yes —
Dynamic On-Chip Termination Yes —
ZQ Calibration Yes —
CRC Function Yes —
Write Leveling Yes —
Asynchronous Reset Yes —
Density — 8 Gb
存储组织 — 512M x 16
电源电压 — 1.2 V
Maximum Supply Voltage (Vsup) — 1.26 V
Burst Length — 8 (BL8), 4 (BC4)
CAS 延迟 — 22 cycles (at 3200 Mbps)
Access Mode — Multi Bank Page Burst
JESD-30 Code — R-PBGA-B96
特性 — Auto self-refresh, auto precharge, asynchronous reset, data mask, dynamic ODT, ZQ calibration, CRC, write leveling

数据手册与资源

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